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MPC853T 데이터시트 PDF : 부품 기능 및 핀배열

부품번호 MPC853T
기능 PowerPC processor
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MPC853T 데이터시트 및 MPC853T PDF

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MPC853T pdf, 반도체, 판매, 대치품
Features
• SPI (serial peripheral interface)
— Supports master and slave modes
— Supports multiple-master operation on the same bus
• The MPC853T has a time-slot assigner (TSA) that supports one TDM bus (TDMb)
— Allows SCCs and SMC to run in multiplexed and/or non-multiplexed operation
— Supports T1, CEPT, PCM highway, ISDN basic rate, ISDN primary rate, user defined
— 1- or 8-bit resolution
— Allows independent transmit and receive routing, frame synchronization, and clocking
— Allows dynamic changes
— Can be internally connected to three serial channels (two SCCs and one SMC)
• PCMCIA interface
— Master (socket) interface, release 2.1 compliant
— Supports one independent PCMCIA socket, 8 memory or I/O windows
• Debug interface
— Eight comparators: four operate on instruction address, two operate on data address, and two operate on
data
— Supports conditions: = < >
— Each watchpoint can generate a break point internally
• Normal high and normal low power modes to conserve power
• 1.8-V core and 3.3-V I/O operation with 5-V TTL compatibility. Refer to Table 5 for a listing of the 5-V
tolerant pins.
MPC853T Hardware Specification, Rev. 1
4 Freescale Semiconductor

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MPC853T 전자부품, 판매, 대치품
Thermal Characteristics
4 Thermal Characteristics
Table 3 shows the thermal characteristics for the MPC853T.
Table 3. MPC853T Thermal Resistance Data
Rating
Environment
Symbol Value Unit
Junction-to-ambient 1
Natural convection
Airflow (200 ft/min)
Junction-to-board 4
Junction-to-case 5
Junction-to-package top 6
Natural convection
Single-layer board (1s)
Four-layer board (2s2p)
Single-layer board (1s)
Four-layer board (2s2p)
RθJA 2
RθJMA 3
RθJMA3
RθJMA3
RθJB
RθJC
ΨJT
49 °C/W
32
41
29
24
13
3
Airflow (200 ft/min)
ΨJT 2
1 Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2 Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3 Per JEDEC JESD51-6 with the board horizontal.
4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5 Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed
pad packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated
value from the junction to the exposed pad without contact resistance.
6 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2.
5 Power Dissipation
Table 4 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1
mode, where CPU frequency is twice bus speed.
Freescale Semiconductor
MPC853T Hardware Specification, Rev. 1
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