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CRS15 데이터시트 PDF




Toshiba에서 제조한 전자 부품 CRS15은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


PDF 형식의 CRS15 자료 제공

부품번호 CRS15 기능
기능 Schottky Barrier Rectifier ( Diode )
제조업체 Toshiba
로고 Toshiba 로고


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CRS15 데이터시트, 핀배열, 회로
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CRS15
Switching Mode Power Supply Applications
Portable Equipment Battery Applications
Forward voltage: VFM = 0.52 V (max) @ IF = 3.0 A
Forward current (DC): IF (DC) = 3.0 A
Repetitive peak reverse voltage: VRRM = 30 V
Suitable for high-density board assembly due to the use of a small
surface-mount package, “S-FLATTM
CRS15
Unit: mm
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Symbol
Rating
Repetitive peak reverse voltage
Forward current (DC)
Peak one cycle surge forward current
(non-repetitive)
VRRM
IF (DC)
IFSM
30
3.0 (Note 1)
30 (50 Hz)
Junction temperature
Storage temperature
Tj 40 to 150
Tstg 40 to 150
Note 1: Ta = 69°C : Device mounted on a ceramic board
Board size : 50 mm × 50 mm
Soldering size : 2 mm × 2 mm
Board thickness : 0.64 mm
DC waveform (VR = 0 V)
Unit
V
A
A
°C
°C
0.9 ± 0.1
+ 0.2
1.6 0.1
0.16
ANODE
CATHODE
JEDEC
JEITA
TOSHIBA
3-2A1A
Weight: 0.013 g (typ.)
Note 2: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly
even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute
maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Start of commercial production
2008-08
1 2013-11-01




CRS15 pdf, 반도체, 판매, 대치품
iF – vF
10
3
Tj = 150°C
1 125°C
75°C
0.3
0.1
25°C
0.03
0.01
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
Instantaneous forward voltage vF (V)
Ta max – IF (AV)
Ceramic substrate (substrate size:
50 mm × 50 mm, soldering land: 2 mm × 2 mm)
160 Rectangular waveform
140
α 360°
120 IF (AV)
Conduction angle α
100 VR = 15 V
80 DC
60
180°
40
120°
α = 60°
20
0
0.0 0.6
1.2 1.8
2.4 3.0
3.6
Average forward current IF (AV) (A)
CRS15
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0.0
PF (AV) – IF (AV)
180°
α = 60°
120°
DC
Rectangular
waveform
α 360°
Conduction angle α
0.6 1.2 1.8 2.4 3.0 3.6
Average forward current IF (AV) (A)
Ta max – IF (AV)
Glass-epoxy substrate (substrate size:
50 mm × 50 mm, soldering land: 6 mm × 6 mm)
160 Rectangular waveform
140
α 360°
120 IF (AV)
Conduction angle α
100 VR = 15 V
80
60
40
20 α = 60° 120°
180°
DC
0
0.0 0.6 1.2 1.8 2.4 3.0
Average forward current IF (AV) (A)
3.6
Tmax – IF (AV)
160
140
DC
120
100 180°
80
α = 60°
120°
60 Rectangular waveform
40
α 360°
20 IF (AV)
Conduction angle α
0 VR = 15 V
0.0 0.6 1.2 1.8 2.4 3.0
Average forward current IF (AV) (A)
3.6
1000
500
300
100
50
30
rth (j-a) – t
Device mounted on a glass-epoxy board:
board size: 50 mm × 50 mm
Soldering land: 6.0 mm × 6.0 mm
board thickness: 1.6 mm
10
5
3
1
0.001
0.01
Device mounted on a ceramic board:
board size: 50 mm × 50 mm
Soldering land: 2.0 mm × 2.0 mm
board thickness: 0.64 mm
0.1 1
Time t (s)
10 100
4 2013-11-01

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