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TLP3312 데이터시트 PDF




Toshiba에서 제조한 전자 부품 TLP3312은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

PDF 형식의 TLP3312 자료 제공

부품번호 TLP3312 기능
기능 Photocoupler Photorelay
제조업체 Toshiba
로고 Toshiba 로고


TLP3312 데이터시트 를 다운로드하여 반도체의 전기적 특성과 매개변수에 대해 알아보세요.




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TLP3312 데이터시트, 핀배열, 회로
TOSHIBA PHOTOCOUPLER PHOTO RELAY
TLP3312
Battery Control
Measuring Instruments
Logic IC Testers / Memory Testers
TLP3312
Unit: mm
The TOSHIBA TLP3312 is an ultra-small photorelay suitable for
surface-mount assembly. The TLP3312 consists of a GaAs infrared-
emitting diode optically coupled to a photo-MOSFET and is housed in a
4-pin package.
Its features include low Off-state current and low output pin capacitance.
Features
4-pin USOP (SSOP4): height=1.65 mm, pitch=1.27 mm
1-Form-A
Peak Off-State Voltage: 60 V (min)
Trigger LED Current: 3 mA (max)
On-State Current: 400 mA (max)
On-State Resistance: 1.5 (max), 1.0 (typ.)
Isolation Voltage: 500 Vrms (min)
JEDEC
JEITA
TOSHIBA
11-2C1
Weight: 0.03 g (typ.)
Pin Configuration (Top View)
14
Schematic
1
4
23
1 : ANODE
2 : CATHODE
3 : DRAIN
4 : DRAIN
2
3
Start of commercial production
2009/03
1 2014-09-01




TLP3312 pdf, 반도체, 판매, 대치품
I F Ta
100
80
60
40
20
0-20 0 20 40 60 80 100 120
Ambient temperature Ta (°C)
100
50 Ta = 25 °C
30
I F VF
10
5
3
1
0.5
0.3
0.1
0.6
0.8 1 1.2 1.4 1.6
Forward voltage VF (V)
1.8
RON Ta
2.0
1.8
IF = 5mA
ION = 400mA
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-40 -20 0 20 40 60 80 100
Ambient temperature Ta (°C)
*: The above graphs show typical characteristics.
TLP3312
I ON Ta
500
400
300
200
100
0-20 0 20 40 60 80 100 120
Ambient temperature Ta (°C)
I ON VON
500
Ta = 25 °C
400 I F = 5 mA
300
200
100
0
-100
-200
-300
-400
-50-0500 -400 -300 -200 -100 0 100 200 300 400 500
On-sate voltage VON (mV)
I FT Ta
0.8
ION = 400mA
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.00
-40 -20 0 20 40 60 80 100
Ambient temperature Ta (°C)
4 2014-09-01

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TLP3312 전자부품, 판매, 대치품
2Packing
TLP3312
Please use the device in a condition of the following because package breaking may occur when the USOP
coupler catches the heat stress in the time of soldering in the state that exposure to moisture in the air.
1. This moisture-proof bag may be stored unopened for up to 12 months under the following conditions.
Temperature: 5°C~30°C
Humidity: 90% (max)
2. After the moisture-proof bag has been opened, the devices should be assembled within 168 hours in an
environment of 5°C to 30°C/70% RH or below.
3. If, upon opening, the moisture indicator card shows humidity of 30% or above (when the indication color
changes to pink) or the expiration date has passed, the devices should be baked while packed in the tape reel.
After baking, use the baked devices within 72 hours, but perform baking only once.
Baking conditions: 60 ±5°C, for 64 to 72 hours.
Expiration date: 12 months from the sealing date, which is imprinted on the same side as this label.
4. Repeated baking may cause the peeling strength of the tape to change, leading to trouble in mounting. Also, be
sure to prevent damage to the device from static electricity during the baking process.
5. Any breakage in the laminate packing material will cause the hermetically of the product to deteriorate. Do
not toss or drop the packed devices.
7 2014-09-01

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-----------------------------------------------------------------------

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