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PDF PLA190 Data sheet ( Hoja de datos )
| Número de pieza | PLA190 | |
| Descripción | Normally Open OptoMOS Relay | |
| Fabricantes | IXYS | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de PLA190 (archivo pdf) en la parte inferior de esta página. Total 7 Páginas | ||
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INTEGRATED CIRCUITS DIVISION
PLA190
Single Pole, Normally Open
OptoMOS® Relay
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
400
150
22
Units
VP
mArms / mADC
Features
• 5000Vrms Input/Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 6-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Version Available
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment—Patient/Equipment Isolation
• Security Systems
• Aerospace
• Industrial Controls
Description
The PLA190 is a 400V, single-pole, normally open
(1-Form-A) solid state relay that uses optically
coupled relay technology to provide an enhanced
5000Vrms isolation barrier between the input and
output of the relay.
Its optically coupled outputs, which use the patented
OptoMOS architecture, are controlled by a highly
efficient GaAIAs infrared LED.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 09 07 49410 004
Ordering Information
Part Number
PLA190
PLA190S
PLA190STR
Description
6-Pin DIP (50/Tube)
6-Pin Surface Mount (50/Tube)
6-Pin Surface Mount (1,000/Reel)
Pin Configuration
AC/DC Configuration
1
+ Control
2
- Control
3
NC
6
Load
5
Do Not Use
4
Load
DC-Only Configuration
1
+ Control
2
- Control
3
NC
6
5
4
+ Load
- Load
Pb
DS-PLA190-R04
e3
www.ixysic.com
Switching Characteristics of
Normally Open Devices
Form-A
IF
ILOAD
90%
ton
10%
toff
1
1 page  
INTEGRATED CIRCUITS DIVISION
PLA190
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
PLA190 / PLA190S
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
PLA190 / PLA190S
Maximum Temperature x Time
250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb e3
R04 www.ixysic.com
5
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet PLA190.PDF ] | |
Hoja de datos destacado
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