Datasheet.kr   

BD8165MUV PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 BD8165MUV
기능 Multi-Channel Power IC
제조업체 Rohm
로고 Rohm 로고 



전체 5 페이지

		

No Preview Available !

BD8165MUV 데이터시트, 핀배열, 회로
STRUCTURE
Silicon Monolithic Integrated Circuit
PRODUCT NAME
Multi-Channel Power IC
TYPE BD8165MUV
FEATURES
Built-in 5-channel outputs for TFT-LCD Display
Built-in VCOM AMP
ABSOLUTE MAXIMUM RATINGS (Ta=25℃)
PARAMETER
SYMBOL
LIMITS
UNIT
Supply Voltage 1
VCC,PVCC2,3
15
V
Supply Voltage 2
LDVCC1
7
V
Supply Voltage 3
HVCC 20 V
SW1 Voltage
VSW1 22 V
Junction Temperature Tjmax 150
Power Dissipation
Pd
4826*1
mW
Operating Temperature Range
Topr
-40105
Storage Temperature Range
Tstg
-55150
*1 Decreased in done 38.6mW/℃ for operating above Ta≧25℃,
mounted on 70×70×1.6mm 4 layer Glass-epoxy PCB.(back foil 70.0mm×70.0mm)
OPERATING CONDITIONS (Ta=-40℃~+105)
Parameter
Symbol
MIN MAX
Supply Voltage 1
VCC,PVCC2,3 4.2 14
Supply Voltage 2
LDVCC1
- 5.5
Supply Voltage 3
HVCC
6 18
SW1 Voltage
VSW1
- 18
Unit
V
V
V
V
Status of this document
The Japanese version of this document is the formal specification.
A customer may use this translation version only for a reference to help reading the formal version.
If there are any differences in translation version of this document, formal version takes priority.
1/4
REV. D




BD8165MUV pdf, 반도체, 판매, 대치품
4/4
Operation Notes
1. Absolute maximum range
This product are produced with strict quality control, but might be destroyed in using beyond absolute maximum ratings. Open IC
destroyed a failure mode cannot be defined (like Short mode, or Open mode).
Therefore physical security countermeasure, like fuse, is to be given when a specified mode to be beyond absolute maximum ratings
is considered.
2. Ground potential
GND terminal should be a lowest voltage potential every state.
Please make sure all pins which is over ground even if include transient feature.
3. Setting of heat
Use a setting of heat that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions..
4 . Short Circuit between Terminal and Soldering
Don’t short-circuit between Output pin and the power supply pin, Output pin and GND pin, or the power supply pin and GND pin.When soldering
the IC on circuit board, please be unusually cautious about the orientation and the
position of the IC. When the orientation is mistaken the IC may be destroyed.
5 . Electromagnetic Field
Mal-function may happen when the device is used in the strong electromagnetic field.
6. Ground wiring patterns
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a
single ground point at the application's reference point so that the pattern wiring resistance and voltage variations caused
by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring patterns
of any external components.
7. This IC is a monolithic IC which has P+ isolation in the P substrate and between the various pins.
A P-N junction is formed from this P layer and the N layer of each pin.
For example, when a resistor and a transistor is connected to a pin.
Parasitic diodes can occur inevitably in the structure of the IC. The operation of parasitic diodes can result in mutual interference
among circuits as well as operation faults and physical damage. Accordingly, you must not use methods by which parasitic diodes
operate, such as applying a voltage that is lower than the GND (P substrate) voltage to an input pin.
(PinA)
SIMPLIFIED STRUCTURE OF
BI-POLAR IC
resister
(PinB)
parasitic diode
GND
Psubstrate
GND
parasitic diode or transistor
(PinB)
GND
near-by other element
GND
(PinA)
parasitic diode or transistor
Parasitic diode
8. Over current protection circuit
The over-current protection circuits are built in at output, according to their respective current outputs and prevent the IC
from being damaged when the load is short-circuited or over-current. But, these protection circuits are effective for preventing
destruction by unexpected accident. When it’s in continuous protection circuit moving period don’t use please. And for ability,
because this chip has minus characteristic, be careful for heat plan.
9. Built-in thermal circuit
A temperature control circuit is built in the IC to prevent the damage due to overheat.
Therefore, all the outputs are turned off when the thermal circuit works and are turned on when the temperature goes down to
the specified level.
10.Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance
subjects the IC to stress. Always discharge capacitors after each process or step. Ground the IC
during assembly steps as an antistatic measure, and use similar caution when transporting or storing the
IC. Always turn the IC's power supply off before connecting it to or removing it from a jig or fixture
during the inspection process.
11.Discontiguous mode
The DC/DC converters of this IC are designed for being used in contiguous current mode, normally. The special consideration on adjusting
the inductance or the resistive output load to avoid the discontiguous current mode should be properly done.
REV. D

4페이지













구       성총 5 페이지
다운로드[ BD8165MUV.PDF 데이터시트 ]
구매 문의
일반 IC 문의 : 샘플 및 소량 구매
-----------------------------------------------------------------------

전력 반도체 판매 ( IGBT, TR 모듈, SCR, 다이오드 모듈 )

휴대전화 : 010-3582-2743


상호 : 아이지 인터내셔날

전화번호 : 051-319-2877, [ 홈페이지 ]



링크공유

링크 :

관련 데이터시트

부품번호상세설명 및 기능제조사
BD8165MUV

Multi-Channel Power IC

Rohm
Rohm

DataSheet.kr    |   2019   |  연락처   |  링크모음   |   검색  |   사이트맵