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PDF CPC1779J Data sheet ( Hoja de datos )

Número de pieza CPC1779J
Descripción Normally Open DC-Only Power Relay
Fabricantes IXYS 
Logotipo IXYS Logotipo



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INTEGRATED CIRCUITS DIVISION
CPC1779
600V Single-Pole, Normally Open
DC-Only Power Relay
Characteristics
Parameter
Blocking Voltage
Load Current, TA=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance (max)
Thermal Resistance,
Junction-to-Case, JC
Rating
600
4.12
1.65
0.4
0.3
Units
VP
ADC
°C/W
Features
4.12ADC Load Current with 5°C/W Heat Sink
Low 0.4On-Resistance
600VP Blocking Voltage
2500Vrms Input/Output Isolation
Low Thermal Resistance: JC = 0.3 °C/W
Isolated, Low Thermal Impedance Ceramic Pad for
Heat Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Applications
Industrial Controls / Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Transportation Equipment
Aerospace/Defense
Approvals
UL 508 Certified Component: File E69938
Pin Configuration
12
+-
34
-+
e3
Description
IXYS Integrated Circuits Division and IXYS have
combined to bring OptoMOS® technology, reliability,
and compact size to a new family of high-power Solid
State Relays.
As part of this new family, the CPC1779 single-pole
normally open (1-Form-A) DC Solid State Power
Relay employs optically coupled MOSFET technology
to provide 2500Vrms of input to output isolation.
The optically coupled outputs, that use patented
OptoMOS architecture, are controlled by a highly
efficient infrared LED. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance DC switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500Vrms isolation, but also very low junction-to-case
thermal resistance (0.3 °C/W).
Ordering Information
Part
CPC1779J
Description
ISOPLUS-264 Package (25 per tube)
Switching Characteristics
Form-A
I
F
ILOAD
90%
ton
10%
toff
DS-CPC1779-R07
www.ixysic.com
1

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CPC1779J pdf
INTEGRATED CIRCUITS DIVISION
CPC1779
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
-40
Typical On-Resistance
vs. Temperature
(IF=10mA, IL=1ADC)
-20 0 20 40 60 80
Temperature (ºC)
100
760
740
720
700
680
660
640
620
600
-40
Typical Blocking Voltage
vs. Temperature
-20 0 20 40 60 80
Temperature (ºC)
100
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
Typical Load Current
vs. Load Voltage
(IF=10mA)
0.2 0.4 0.6 0.8 1.0 1.2
Load Voltage (V)
Typical Leakage vs. Temperature
Measured Across Pins 1&2
(VL=600VP)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40 -20
0 20 40 60
Temperature (ºC)
80 100
Maximum Load Current
vs. Temperature with Heat Sink
10
8 1ºC/W
6
5ºC/W
4 10ºC/W
Free Air
2
0
0 20 40 60 80 100
Temperature (ºC)
Energy Rating Curve
(Free Air, No Heat Sink)
20
18
16
14
12
10
8
6
4
2
0
10µs 100µs 1ms 10ms 100ms 1s 10s 100s
Time
Unless otherwise specified, all performance data was acquired without the use of a heat sink.
The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the
written specifications, please contact our application department.
5
www.ixysic.com
R07

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