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PDF 29F2G08 Data sheet ( Hoja de datos )

Número de pieza 29F2G08
Descripción NAND Flash Memory
Fabricantes Micron　
Logotipo Micron Logotipo



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No Preview Available ! 29F2G08 Hoja de datos, Descripción, Manual

Micron Confidential and Proprietary
2Gb x8, x16: NAND Flash Memory
Features
NAND Flash Memory
MT29F2G08AAD, MT29F2G16AAD,
MT29F2G08ABD, MT29F2G16ABD
Features
• Open NAND Flash Interface (ONFI) 1.0-compliant
• Single-level cell (SLC) technology
• Organization
– Page size:
• x8: 2,112 bytes (2,048 + 64 bytes)
• x16: 1,056 words (1,024 + 32 words)
– Block size: 64 pages (128K + 4K bytes)
– Device size: 2Gb: 2,048 blocks
• READ performance
– Random READ: 25µs
– Sequential READ: 25ns (3.3V)
– Sequential READ: 35ns (1.8V)
• WRITE performance
– PROGRAM PAGE: 220µs (TYP, 3.3V)
– PROGRAM PAGE: 300µs (TYP, 1.8V)
– BLOCK ERASE: 500µs (TYP)
• Data retention: 10 years
• Endurance: 100,000 PROGRAM/ERASE cycles
• First block (block address 00h) guaranteed to be
valid with ECC when shipped from factory1
• Industry-standard basic NAND Flash command set
• Advanced command set:
– PROGRAM PAGE CACHE MODE
– PAGE READ CACHE MODE
– One-time programmable (OTP) commands
– BLOCK LOCK (1.8V only)
– PROGRAMMABLE DRIVE STRENGTH
– READ UNIQUE ID
• Operation status byte provides a software method of
detecting:
– Operation completion
– Pass/fail condition
– Write-protect status
• Ready/busy# (R/B#) signal provides a hardware
method of detecting operation completion
• WP# signal: write protect entire device
• RESET required as first command after power-up
• INTERNAL DATA MOVE operations supported
• Alternate method of device initialization
(Nand_Init) after power up4 (Contact Factory)
Figure 1: 63-Ball VFBGA
Options
• Density2: 2Gb (single die)
• Device width: x8, x16
• Configuration:
# of die # of CE# # of R/B# I/O
1 1 1 Common
• VCC: 2.7–3.6V
• VCC: 1.65–1.95V
• Package
– 48-pin TSOP type I CPL3 (lead-free plating, 3.3V
only)
– 63-ball VFBGA (lead-free, 1.8V only)
• Operating temperature:
– Commercial (0°C to +70°C)
– Extended (–40°C to +85°C)
1. See “Error Management” on page 61.
2. For part numbering and markings, see
Figure 2 on page 2 and Figure 3 on page 3.
3. CPL = center parting line
4. Available only in 1.8V VFBGA package.
PDF: 09005aef82784784 / Source: 09005aef82784840
NDA_2gb_nand_m59a__1.fm - Rev. A 8/08 EN
1 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2007 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.

1 page




29F2G08 pdf
Micron Confidential and Proprietary
2Gb x8, x16: NAND Flash Memory
Table of Contents
WRITE PROTECT Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Error Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
VCC Power Cycling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Timing Diagrams. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
PDF: 09005aef82784784 / Source: 09005aef82784840
NDA_2gb_nand_m59aTOC.fm - Rev. A 8/08 EN
5 Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2007 Micron Technology, Inc. All rights reserved.

5 Page





29F2G08 arduino
Micron Confidential and Proprietary
2Gb x8, x16: NAND Flash Memory
General Description
Figure 6: Ball Assignment: 63-Ball VFBGA (x16)
1 2 3 4 5 6 7 8 9 10
A NC NC
NC NC
B NC
NC NC
C WP# ALE Vss CE# WE# R/B#
D Vcc RE# CLE NC NC NC
E NC NC NC NC NC NC
F NC NC NC NC Vss NC
G DNU Vcc LOCK I/O13 I/O15 NC
H I/O8 I/O0 I/O10 I/O12 I/O14 Vcc
J I/O9 I/O1 I/O11 Vcc I/O5 I/O7
K Vss I/O2 I/O3 I/O4 I/O6 Vss
L NC NC
NC NC
M NC NC
NC NC
Top View, Ball Down
Notes: 1. For package dimensions, see Figure 77 on page 87.
PDF: 09005aef82784784 / Source: 09005aef82784840
NDA_2gb_nand_m59a__2.fm - Rev. A 8/08 EN
11
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2007 Micron Technology, Inc. All rights reserved.

11 Page







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