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Número de pieza | TQQ7307 | |
Descripción | 2535 MHz LTE Band 7 Uplink BAW Filter | |
Fabricantes | TriQuint Semiconductor | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de TQQ7307 (archivo pdf) en la parte inferior de esta página. Total 8 Páginas | ||
No Preview Available ! Applications
• LTE Band 7 Uplink Infrastructure
• Base Station
• General Purpose Wireless
TQQ7307
2535 MHz LTE Band 7 Uplink BAW Filter
Product Features
• 70 MHz Bandwidth
• High Attenuation
• Low Loss
• 50 Ohm Input/Output Impedance
• Single-ended Operation
• Small Size: 3 x 3 x 1.02 mm
• Surface Mount Device
• RoHS Compliant, Pb-Free
6 Pin 3 x 3 mm leadless SMT Package
Functional Block Diagram
Ground
1
6 Ground
Input 2
5 Output
Ground 3
4 Ground
Top View
General Description
The TQQ7307 is a general purpose uplink BAW filter for
LTE Band 7. This filter is housed in a compact 3 x 3 mm
package for base station applications.
Low insertion loss, coupled with high attenuation makes
this filter an ideal choice for uplink RF filtering needs.
The TQQ7307 is part of TriQuint’s extensive portfolio of
RF BAW and SAW filters.
Pin Configuration
Pin No.
2
5
1,3,4,6
Label
Input
Output
Ground
Advanced Datasheet: Rev B 07-16-14
© 2014 TriQuint
Ordering Information
Part No.
TQQ7307
Description
2535 MHz BAW Filter
TQQ7307-EVB
Evaluation board
Standard T/R size = 2500 pieces on a 7" reel
- 1 of 8 -
Disclaimer: Subject to change without notice
www.triquint.com
1 page TQQ7307
2535 MHz LTE Band 7 Uplink BAW Filter
Package Marking and Dimensions
2x
0.10 C
2x
0.10 C
3.00±0.10
A
B
(5X) 0.650x X 0.600y
0.10 C A B
1.071
3.00±0.10
0.700
(1X) 1.400x X 0.600y
0.10 C A B
PIN 1
Pin #1 Identifier
Package Marking
Product Identifier: Q7307
Date Code: YYWW
Assembly Code: AaXXXX
Q7307
YYWW
aXXXX
3.00±0.10
TOP VIEW
3.00±0.10
1.100
1.100
0.100±0.100
BOTTOM VIEW
1.075
0.100±0.100
0.10 C
C
1.02±0.07
3.00±0.10
SIDE VIEW
Notes:
1. All dimensions are in millimeters
2. All tolerances are ±0.15 mm except overall length and width ±0.10 mm
3. Contact plating : ENIG (Electroless Nickel Immersion Gold)
4. Terminations: 0.5 – 1.0 μm Au plating, over a 2 – 6 μm Ni plating
PCB Mounting Pattern
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
Advanced Datasheet: Rev B 07-16-14
© 2014 TriQuint
- 5 of 8 -
Disclaimer: Subject to change without notice
www.triquint.com
5 Page |
Páginas | Total 8 Páginas | |
PDF Descargar | [ Datasheet TQQ7307.PDF ] |
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