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PDF MC10E1652 Data sheet ( Hoja de datos )
| Número de pieza | MC10E1652 | |
| Descripción | DUAL ECL OUTPUT COMPARATOR | |
| Fabricantes | Motorola Semiconductors | |
| Logotipo |  |
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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Dual ECL Output Comparator
With Latch
The MC10E1652 is functionally and pin-for-pin compatible with the
MC10E1651 and thus the MC1651 in the MECL III™ family, but is
fabricated using Motorola’s advanced MOSAIC III™ process and is output
compatible with 10H logic devices. In addition, the device is available in
both a 16-pin DIP and a 20-pin surface mount package. However, the
MC10E1652 provides user programmable hysteresis.
The latch enable (LENa and LENb) input pins operate from standard
ECL 10H™ logic levels. When the latch enable is at a logic high level the
MC10E1652 acts as a comparator, hence Q will be at a logic high level if
V1 > V2 (V1 is more positive than V2). Q is the complement of Q. When
the latch enable input goes to a low logic level, the outputs are latched in
their present state, providing the latch enable setup and hold time
constraints are met. The level of input hysteresis is controlled by applying
a bias voltage to the HYS pin.
• Typical 3.0 dB Bandwidth > 1.0 GHz
• Typical V to Q Propagation Delay of 775 ps
• Typical Output Rise/Fall of 350 ps
• Common Mode Range –2.0 V to +3.0 V
• Individual Latch Enables
• Differential Outputs
• Programmable Input Hysteresis
MC10E1652
DUAL ECL OUTPUT
COMPARATOR
WITH LATCH
FN SUFFIX
PLASTIC PACKAGE
CASE 775-02
V1a
V2a
LENa
HYS
V1b
V2b
LENb
12/93
© Motorola, Inc. 1996
LOGIC DIAGRAM
Qa
Qa
VEE = –5.2 V
VCC = +5.0 V
Qb
Qb
2–1
L SUFFIX
CERAMIC PACKAGE
CASE 620-10
FUNCTION TABLE
LEN
H
H
L
V1, V2
V1 > V2
V1 < V2
X
Function
H
L
Latched
REV 1
1 page  
MC10E1652
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
-N- Y BRK
B 0.007 (0.180) M T L –M S N S
D U 0.007 (0.180) M T L –M S N S
-L- -M-
WZ
20 1
V
D
X
VIEW D-D
G1 0.010 (0.250) S T L –M S N S
A 0.007 (0.180) M T L –M S N S
Z
R 0.007 (0.180) M T L –M S N S
H 0.007 (0.180) M T L –M S N S
C
E
0.004 (0.100)
G
J
-T- SEATING
PLANE
VIEW S
G1
0.010 (0.250) S T L –M S N S
K1
K
F
VIEW S
0.007 (0.180) M T L –M S N S
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE
TOP OF LEAD SHOULDER EXITS PLASTIC BODY
AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED AT
DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER
SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.385 0.395 9.78 10.03
B 0.385 0.395 9.78 10.03
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC
1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 — 0.51 —
K 0.025 — 0.64 —
R 0.350 0.356 8.89 9.04
U 0.350 0.356 8.89 9.04
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y — 0.020 — 0.50
Z
2° 10°
2° 10°
G1 0.310 0.330 7.88 8.38
K1 0.040 — 1.02 —
ECLinPS and ECLinPS Lite
DL140 — Rev 4
2–5
MOTOROLA
5 Page | ||
| Páginas | Total 7 Páginas | |
| PDF Descargar | [ Datasheet MC10E1652.PDF ] | |
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