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2SCR513PFRA 데이터시트 PDF




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부품번호 2SCR513PFRA 기능
기능 NPN 1.0A 50V Middle Power Transistor
제조업체 ROHM Semiconductor
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2SCR513PFRA 데이터시트, 핀배열, 회로
22SSCCRR551133PPFRA
NPN 1.0A 50V Middle Power Transistor
Parameter
VCEO
IC
Value
50V
1.0A
lFeatures
1) Suitable for Middle Power Driver
2) Complementary PNP Types : 22SSAARR551133PPFRA
3) Low VCE(sat)
VCE(sat)=0.35V(Max.)
(IC/IB=500mA/25mA)
4) Lead Free/RoHS Compliant.
lOutline
MPT3
Base
Collector
Emitter
2S2CSRC5R1531P3FPRA
(SC-62)
<SOT-89>
Datasheet
AEC-Q101 Qualified
lInner circuit
Collector
Base
Emitter
lPackaging specifications
Part No.
Package
2S2CSRC5R135P1F3RPA
MPT3
Package
size
(mm)
4540
lApplications
Motor driver , LED driver
Power supply
Taping
code
T100
Reel size
(mm)
Tape width
(mm)
Basic
ordering
unit (pcs)
180 12 1,000
Marking
NC
lAbsolute maximum ratings (Ta = 25°C)
Parameter
Collector-base voltage
Collector-emitter voltage
Emitter-base voltage
Collector current
DC
Pulsed
Power dissipation
Junction temperature
Range of storage temperature
*1 Pw=10ms , single pulse
*2 Each terminal mounted on a reference land
*3 Mounted on a ceramic board (40×40×0.7mm)
Symbol
VCBO
VCEO
VEBO
IC
ICP *1
PD *2
PD *3
Tj
Tstg
Values
50
50
6
1.0
2.0
0.5
2.0
150
-55 to +150
Unit
V
V
V
A
A
W
W
°C
°C
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
1/6
2013.05 - Rev.B




2SCR513PFRA pdf, 반도체, 판매, 대치품
2SCR513PFRA
lElectrical characteristic curves(Ta = 25°C)
Data Sheet
Fig.5 Collector-Emitter Saturation Voltage
vs. Collector Current (I)
1
IC / IB = 20
Fig.6 Collector-Emitter Saturation Voltage
vs. Collector Current (II)
1
Ta=25ºC
0.1 0.1
Ta=125ºC
75ºC
0.01
25ºC
-40ºC
0.01
IC / IB = 50
20
10
0.001
1
10 100 1000 10000
COLLECTOR CURRENT : IC [mA]
0.001
1
10 100 1000 10000
COLLECTOR CURRENT : IC [mA]
Fig.7 Base-Emitter Saturation Voltage
vs. Collector Current
10
Ta= -40ºC
25ºC
75ºC
125ºC
1
Fig.8 Gain Bandwidth Product
vs. Emitter Current
1000
Ta=25ºC
VCE= 10V
100
0.1
1
IC / IB = 20
Pulsed
10 100 1000 10000
COLLECTOR CURRENT : IC [mA]
10
-10
-100
-1000
EMITTER CURRENT : IE [mA]
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
4/6
2013.05 - Rev.B

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2SCR513PFRA 전자부품, 판매, 대치품
Datasheet
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU CHINA
CLASS
CLASS
CLASS
CLASSb
CLASS
CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001

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부품번호상세설명 및 기능제조사
2SCR513PFRA

NPN 1.0A 50V Middle Power Transistor

ROHM Semiconductor
ROHM Semiconductor

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