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PDF MC10H646 Data sheet ( Hoja de datos )

Número de pieza MC10H646
Descripción PECL/TTL-TTL 1:8 Clock Distribution Chip
Fabricantes Motorola Semiconductors 
Logotipo Motorola Semiconductors Logotipo



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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
PECL/TTL-TTL 1:8 Clock
Distribution Chip
MC10H646
MC100H646
The MC10H/100H646 is a single supply, low skew translating 1:8 clock
driver. Devices in the Motorola H600 translator series utilize the 28–lead
PLCC for optimal power pinning, signal flow through and electrical
performance. The single supply H646 is similar to the H643, which is a
dual supply 1:8 version of the same function.
PECL/TTL–TTL Version of Popular ECLinPSE111
Low Skew
Guaranteed Skew Spec
Tri–State Enable
Differential Internal Design
VBB Output
Single Supply
Extra TTL and ECL Power/Ground Pins
Matched High and Low Output Impedance
Meets Specifications Required to Drive the PentiumMicroprocessor
PENTIUM
MICROPROCESSOR
PECL/TTL–TTL
CLOCK DRIVER
The H646 was designed specifically to drive series terminated
transmission lines. Special techniques were used to match the HIGH and
LOW output impedances to about 7ohms. This simplifies the choice of the
termination resistor for series terminated applications. To match the HIGH
and LOW output impedances, it was necessary to remove the standard
IOS limiting resistor. As a result, the user should take care in preventing an
output short to ground as the part will be permanently damaged.
FN SUFFIX
PLASTIC PACKAGE
CASE 776–02
The H646 device meets all of the requirements for driving the 60 and 66MHz Pentium Microprocessor. The device has no PLL
components, which greatly simplifies its implementation into a digital design. The eight copies of the clock allows for
point–to–point clock distribution to simplify board layout and optimize signal integrity.
The H646 provides differential PECL inputs for picking up LOW skew PECL clocks from the backplane and distributing it to
TTL loads on a daughter board. When used in conjunction with the MC10/100E111, very low skew, very wide clock trees can be
designed. In addition, a TTL level clock input is provided for flexibility. Note that only one of the inputs can be used on a single
chip. For correct operation, the unused input pins should be left open.
The Output Enable pin forces the outputs into a high impedance state when a logic 0 is applied.
The output buffers of the H646 can drive two series terminated, 50transmission lines each. This capability allows the H646
to drive up to 16 different point–to–point clock loads. Refer to the Applications section for a more detailed discussion in this area.
The 10H version is compatible with MECL 10HECL logic levels. The 100H version is compatible with 100K levels.
MECL 10H and ECLinPS are trademarks of Motorola, Inc. Pentium is a trademark of Intel Corporation.
8/94
© Motorola, Inc. 1996
1
REV 1

1 page




MC10H646 pdf
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
Y BRK
–N–
D
B 0.007 (0.180) M T L–M S N S
U 0.007 (0.180) M T L–M S N S
Z
–L– –M–
WD
28 1 V
X
VIEW D–D
G1 0.010 (0.250) S T L–M S N S
A 0.007 (0.180) M T L–M S N S
H 0.007 (0.180) M T L–M S N S
Z
R 0.007 (0.180) M T L–M S N S
CE
0.004 (0.100)
G
J
–T– SEATING
PLANE
G1
0.010 (0.250) S T L–M S N S
VIEW S
K1
K
F
VIEW S
0.007 (0.180) M T L–M S N S
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE
MOLD FLASH. ALLOWABLE MOLD FLASH IS
0.010 (0.250) PER SIDE.
4. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.485 0.495 12.32 12.57
B 0.485 0.495 12.32 12.57
C 0.165 0.180 4.20 4.57
E 0.090 0.110 2.29 2.79
F 0.013 0.019 0.33 0.48
G 0.050 BSC
1.27 BSC
H 0.026 0.032 0.66 0.81
J 0.020 ––– 0.51 –––
K 0.025 ––– 0.64 –––
R 0.450 0.456 11.43 11.58
U 0.450 0.456 11.43 11.58
V 0.042 0.048 1.07 1.21
W 0.042 0.048 1.07 1.21
X 0.042 0.056 1.07 1.42
Y ––– 0.020 ––– 0.50
Z 2_ 10_ 2_ 10_
G1 0.410 0.430 10.42 10.92
K1 0.040 ––– 1.02 –––
TIMING SOLUTIONS
BR1333 — Rev 6
5
MOTOROLA

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