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PDF MAX32625 Data sheet ( Hoja de datos )
| Número de pieza | MAX32625 | |
| Descripción | ARM Cortex-M4F Microcontroller | |
| Fabricantes | Maxim Integrated | |
| Logotipo |  |
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MAX32625/MAX32626
Ultra-Low Power, High-Performance
ARM Cortex-M4F Microcontroller for Wearables
General Description
The MAX32625/MAX32626 is an ARM® Cortex®-M4F
32-bit microcontroller with an unconnected point unit,
ideal for the emerging category of wearable medical and
fitness applications. The architecture combines ultra-
low power, high-efficiency signal processing functionality
and ease of use. An internal 96MHz oscillator provides
high-performance capability, and the internal 4MHz oscil-
lator supports minimal power consumption for applica-
tions requiring always-on monitoring. The device provides
512kB of flash and 160kB of SRAM.
The device features four powerful and flexible power
modes. A peripheral management unit (PMU) enables
intelligent peripheral control with up to six channels to
significantly reduce power consumption. Built-in dynamic
clock gating and firmware-controlled power gating allows
the user to optimize power for the specific application.
Multiple SPI, UART, and I2C serial interfaces are pro-
vided, as well as a 1-Wire® master and USB, allowing
for interconnection to a wide variety of external sensors.
A four-input, 10-bit delta-sigma ADC monitors analog
input from external sensors.
The MAX32625L is a lower-cost version of the MAX32625,
providing 256kB of flash and 128kB of SRAM.
The MAX32626 is a secure version of the MAX32625.
It incorporates a trust protection unit (TPU) with encryption
and advanced security features. These features include
a modular arithmetic accelerator (MAA) for ECDSA, a
hardware PRNG entropy generator, and a secure boot
loader. Both the MAX32626 and the MAX32625 provide
a hardware AES engine.
Applications
●● Sports Watches
●● Fitness Monitors
●● Wearable Medical Patches
●● Portable Medical Devices
●● Sensor Hubs
Ordering Information appears at end of data sheet.
ARM is a registered trademark and registered service mark and
Cortex is a registered trademark of ARM Limited.
1-Wire is a registered trademark of Maxim Integrated Products, Inc.
Benefits and Features
●● High-Efficiency Microcontroller for Wearable Devices
• Internal Oscillator Operates Up to 96MHz
• Low Power 4MHz Oscillator System Clock Option
for Always-On Monitoring Applications
• 512KB Flash Memory (256KB “L” Version)
• 160KB SRAM (128KB “L” Version)
• 8KB Instruction Cache
• 1.2V Core Supply Voltage
• 1.8V to 3.3V I/O
• Optional 3.3V ±5% USB Supply Voltage
• Wide Operating Temperature: -30°C to +85°C
●● Power Management Maximizes Uptime for Battery
Applications
• 106μA/MHz Active Current Executing from Cache
• 49μA/MHz Active Current Executing from Flash
• Wake-Up to 96MHz Clock or 4MHz Clock
• 600nA Low Power Mode (LP0) Current with RTC
Enabled
• 2.56μW Ultra-Low Power Data Retention Sleep
Mode (LP1) with Fast 5μs Wake-Up on 96MHz
Clock Source
• 27μA/MHz Low Power Mode (LP2) Current
●● Optimal Peripheral Mix Provides Platform Scalability
• SPI Execute in Place (SPIX) Engine for Memory
Expansion with Minimal Footprint
• Three SPI Masters, One SPI Slave
• Three UARTs
• Up to Two I2C Masters, One I2C Slave
• 1-Wire Master
• Full-Speed USB 2.0 Device with Internal
Transceiver
• Sixteen Pulse Train (PWM) Engines
• Six 32-Bit Timers and 3 Watchdog Timers
• Up to 40 General-Purpose I/O Pins
• 10-Bit Delta-Sigma ADC Operating at 7.8ksps
• AES -128, -192, -256
• CMOS-Level 32kHz RTC Output Available in All
Power Modes
●● Secure Valuable IP and Data with Robust Internal
Hardware Security (MAX32626 Only)
• Trust Protection Unit (TPU) Provides ECDSA and
Modular Arithmetic Acceleration Support
• PRNG Seed Generator
• Secure Boot Loader
19-8596; Rev 0; 8/16
1 page  
MAX32625/MAX32626
Ultra-Low Power, High-Performance
ARM Cortex-M4F Microcontroller for Wearables
Absolute Maximum Ratings
VDD18..................................................................-0.3V to +1.89V
VDD12..................................................................-0.3V to +1.32V
VRTC....................................................................-0.3V to +1.89V
VDDB.....................................................................-0.3V to +3.6V
VDDIO....................................................................-0.3V to +3.6V
VDDIOH..................................................................-0.3V to +3.6V
32KIN, 32KOUT....................................................-0.3V to +3.6V
RSTN, SRSTN, DP, DM, GPIO, JTAG..................-0.3V to +3.6V
AIN[1:0].................................................................-0.3V to +5.5V
AIN[3:2].................................................................-0.3V to +3.6V
(All voltages with respect to VSS, unless otherwise noted.)
Total Current into All VDDIO and VDDIOH Power Pins Combined
(Sink)............................................................................. 100mA
Total Current into VSS.......................................................100mA
Output Current (Sink) by Any I/O Pin..................................25mA
Output Current (Source) by Any I/O Pin............................-25mA
Continuous Package Power Dissipation TQFN (multilayer board)
TA = +70°C (derate 49.5mW/°C above +70°C).......3960.4mW
Operating Temperature Range............................ -30°C to +85°C
Storage Temperature Range............................. -65°C to +150°C
Soldering Temperature (reflow)........................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
63 WLP
PACKAGE CODE
Outline Number
Land Pattern Number
Thermal Resistance, Single Layer Board:
Junction-to-Ambient (θJA)
Junction-to-Case Thermal Resistance (θJC)
Thermal Resistance, Four Layer Board:
Junction-to-Ambient (θJA)
Junction-to-Case Thermal Resistance (θJC)
W6333B+1
21-100084
Refer to Application Note 1891
N/A
N/A
35.87ºC/W
N/A
68 TQFN
PACKAGE CODE
T6888+1
Outline Number
21-0510
Land Pattern Number
90-0354
Thermal Resistance, Single Layer Board:
Junction-to-Ambient (θJA)
Junction-to-Case Thermal Resistance (θJC)
Thermal Resistance, Four Layer Board:
N/A
N/A
Junction-to-Ambient (θJA)
Junction-to-Case Thermal Resistance (θJC)
20.20ºC/W
1ºC/W
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packaging. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board.
For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
www.maximintegrated.com
Maxim Integrated │ 5
5 Page 
MAX32625/MAX32626
Ultra-Low Power, High-Performance
ARM Cortex-M4F Microcontroller for Wearables
Electrical Characteristics - ADC (continued)
(Internal bandgap reference selected and ADC_SCALE = ADC_REFSCL = 1 unless otherwise specified. Specifications marked GBD
are guaranteed by design and not production tested.)
PARAMETER
AIN0/AIN1 Resistor Divider
Error
Full-Scale Voltage
Bandgap Temperature
Coefficient
SYMBOL
VFS
VTEMPCO
CONDITIONS
ADC_CHSEL = 4 or 5, not including ADC
offset/gain error
ADC code = 0x3FF
Box method
MIN
TYP MAX UNITS
±2 LSB
1.2 V
30 ppm/°C
Electrical Characteristics - USB
(VDD18 = VRST to 1.89V, TA = -30°C to +85°C.)
PARAMETER
USB PHY Supply Voltage
Single-Ended Input High
Voltage DP, DM
Single-Ended Input
Low Voltage DP, DM
Output Low Voltage DP, DM
Output High Voltage DP, DM
Differential Input
Sensitivity DP, DM
Common-Mode Voltage
Range
Single-Ended Receiver
Threshold
Single-Ended Receiver
Hysteresis
Differential Output Signal
Cross-Point Voltage
DP, DM Off-State Input
Impedance
Driver Output Impedance
DP Pull-up Resistor
DP Pullup Resistor
USB TIMING
DP, DM Rise Time (Transmit)
DP, DM Fall Time (Transmit)
Rise/Fall Time Matching
(Transmit)
SYMBOL
VDDB
VIHD
CONDITIONS
VILD
VOLD
VOHD
VDI
RL = 1.5kΩ from DP to 3.6V
RL = 15kΩ from DP and DM to VSS
DP to DM
VCM
Includes VDI range
VSE
VSEH
VCRS
CL = 50pF, GBD
RLZ
RDRV
RPU
RPU
Steady-state drive
Idle
Receiving
tR
tF
tR, tF
CL = 50pF, GBD
CL = 50pF, GBD
CL = 50pF, GBD
MIN TYP MAX UNITS
3.3 V
2V
0.8 V
0.3 V
2.8 V
0.2 V
0.8 2.5 V
0.8 2 V
200 mV
1.3 2 V
300
28
0.9
1.425
44
1.575
3.09
kΩ
Ω
kΩ
kΩ
4 20 ns
4 20 ns
90 110 %
www.maximintegrated.com
Maxim Integrated │ 11
11 Page | ||
| Páginas | Total 27 Páginas | |
| PDF Descargar | [ Datasheet MAX32625.PDF ] | |
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