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PDF QPA9119 Data sheet ( Hoja de datos )
| Número de pieza | QPA9119 | |
| Descripción | High Linearity Amplifier | |
| Fabricantes | TriQuint Semiconductor | |
| Logotipo |  |
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Applications
Repeaters / DAS
Mobile Infrastructure
Defense Communications
General Purpose Wireless
QPA9119
½ W High Linearity Amplifier
Product Features
400-4200 MHz
+27.2 dBm P1dB
+44 dBm Output IP3
17 dB Gain at 2140 MHz
+5 V Single Supply, 130 mA ICQ
Internal RF overdrive protection
Internal DC overvoltage protection
On chip ESD protection
3x3 mm QFN Package
General Description
The QPA9119 is a high linearity driver amplifier in a low-
cost, RoHS compliant, surface mount package. This
InGaP/GaAs HBT delivers high performance across a
broad range of frequencies with +44 dBm OIP3 and
+27.2 dBm P1dB while only consuming 130 mA quiescent
current. All devices are 100% RF and DC tested.
The QPA9119 incorporates on-chip features that
differentiate it from other products in the market. The
amplifier integrates an on-chip DC over-voltage and RF
over-drive protection. This protects the amplifier from
electrical DC voltage surges and high input RF input
power levels that may occur in a system. On-chip ESD
protection allows the amplifier to have a very robust Class
1C HBM ESD rating.
The QPA9119 is targeted for use as a driver amplifier in
wireless infrastructure where high linearity, medium
power, and high efficiency are required. The device an
excellent candidate for transceiver line cards in current
and next generation multi-carrier 3G / 4G base stations.
16-Pin 3 x 3 mm Leadless QFN Package
Functional Block Diagram
Pin 1 Reference Mark
NC I Ref NC
16 15 14
NC 1
RF In 2
Bias
NC
13
12 NC
11 RF Out
RF In 3
10 RF Out
NC 4
9 NC
5678
NC NC NC NC
Backside Paddle - RF/DC GND
Top View
Pin Configuration
Pin No.
Label
1, 4, 5, 6, 7, 8, 9, 12, 13, 14, 16 No Connection
2, 3 RF In
10, 11
RF Out
15 I Ref
Backside Paddle
GND
Ordering Information
Part No.
Description
QPA9119
0.5 W High Linearity Amplifier
QPA9119−PCB900 869−960 MHz Evaluation Board
QPA9119−PCB2140 2.11–2.17 GHz Evaluation Board
Standard T/R size = 2,500 pieces on a 7” reel
Data Sheet: Rev. E 09-24-15
© 2015 TriQuint Semiconductor, Inc
- 1 of 12 -
Disclaimer: Subject to change without notice
www.Qorvo.com / www.qorvo.com
1 page  
QPA9119
½ W High Linearity Amplifier
Performance Plots QPA9119−PCB900
Test conditions unless otherwise noted:
Gain vs. Frequency
25
+105°C
+25°C
23 −40°C
21
19
VCC = VPD = +5V, ICQ = 130 mA , IREF = 7 mA , Temp.=+25 °C
Input Return Loss vs. Frequency
0
Output Return Loss vs. Frequency
0
-5 -5
+105°C
+105°C
+25°C
+25°C
−40°C
−40°C
-10 -10
-15 -15
17
15
860
55
50
45
880 900 920
Frequency (MHz)
OIP3 vs Pout/tone
940
Temp.=+25°C
-20
960 860
55
880 900 920 940
Frequency (MHz)
OIP3 vs Pout/tone
F = 920 MHz
50
45
+105°C
+25°C
−40°C
-20
960 860
30
29
28
880 900 920 940
Frequency (MHz)
P1dB vs Frequency
960
40
35
869 MHz
920 MHz
960 MHz
30
10 12 14 16 18 20 22 24
Pout/tone (dBm)
ACLR vs Pout
-40
Temp.=+25°C
-45 W-CDMA 3GPP Test Model 1+64 DPCH,
PAR = 10.2 dB @ 0.01% Probability, 3.84
MHz BW
-50
-55
-60
-65
8
-40
-45
869 MHz
920 MHz
960 MHz
10 12 14 16 18 20
Pout (dBm)
ACLR vs Pout
Signal : LTE 20MHz, PAR = 9.5dB
Channel BW E-UTRA, IBW = 18.02MHz
Temp.=+25°C
-50
-55
-60
-65
8
869 MHz
920 MHz
960 MHz
10 12 14 16 18 20
Pout (dBm)
40
35
30
10 12 14 16 18 20 22 24
Pout/tone (dBm)
ACLR vs Pout
-40
W-CDMA 3GPP Test Model 1+64 DPCH,
PAR = 10.2 dB @ 0.01% Probability, 3.84
-45 MHz BW F = 920 MHz
+105°C
-50
+25°C
−40°C
-55
-60
-65
8
-40
-45
-50
10 12 14 16 18
Pout (dBm)
ACLR vs Pout
Signal : LTE 20MHz, PAR = 9.5dB
Channel BW E-UTRA, IBW = 18.02MHz
F = 920 MHz
+105°C
+25°C
−40°C
20
-55
-60
-65
8
10 12 14 16 18 20
Pout (dBm)
27 +105°C
+25°C
−40°C
26
25
870 880 890 900 910 920 930 940 950 960
Frequency (MHz)
P1dB vs Frequency
30
F = 920 MHz
29
28
27 +105°C
+25°C
−40°C
26
25
870 880 890 900 910 920 930 940 950 960
Frequency (MHz)
Icc vs. Pout
400
350
F = 920 MHz
300
250
200
150
+105°C
100 +25°C
−40°C
50
0
12 14 16 18 20 22 24 26 28 30
Pout (dBm)
Data Sheet: Rev. E 09-24-15
© 2015 TriQuint Semiconductor, Inc
- 5 of 12 -
Disclaimer: Subject to change without notice
www.Qorvo.com / www.qorvo.com
5 Page 
Package Marking and Dimensions
Marking: Part number – 9119
Date - YYWW
Lot code – AaXXXX
9119
YYWW
AaXXXX
QPA9119
½ W High Linearity Amplifier
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012.
3. Contact plating: NiPdAu
PCB Mounting Pattern
1.50
Pin 1 Locator
16X 0.52
16X 0.32
Package Outline
0.31
0.09
7X 3
1.50
0.50 Pitch 16X
0.55
COMPONENT SIDE
0.32
0.64
NOTES:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 1 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We
recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Data Sheet: Rev. E 09-24-15
© 2015 TriQuint Semiconductor, Inc
- 11 of 12 -
Disclaimer: Subject to change without notice
www.Qorvo.com / www.qorvo.com
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet QPA9119.PDF ] | |
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