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PDF BD4142HFV Data sheet ( Hoja de datos )
| Número de pieza | BD4142HFV | |
| Descripción | Free Delay Time Setting CMOS Voltage Detector IC | |
| Fabricantes | ROHM Semiconductor | |
| Logotipo |  |
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Datasheet
Free Delay Time Setting
CMOS Voltage Detector IC
BD4142HFV
●General Description
BD4142HFV is 1ch voltage detector IC for monitoring an
input voltage line. The default detected voltage is 0.5V
and is adjustable via external resistors. When monitoring
an input voltage supply, the IC outputs a HIGH signal via
a PGOOD pin when the supply rises above the threshold
and is LOW when below.
●Features
Open Drain Output
Built in Under Voltage LockOut (UVLO) Circuit
Delay Time Controlled by External Capacitor
Very small and low height package
PGOOD HIGH Output
●Applications
Laptop PC, Desktop PC, LCD-TV, Printer, STB, Digital
Appliances, and more.
●Key Specifications
Input voltage range:
3.0V to 5.5V
Detected voltage:
500mV(Typ)
PGOOD output ON resistance:
100Ω(Typ)
Bias current:
7.5μA (Typ)
Operating temperature range (Ta): -10℃ to +100℃
●Package
HVSOF5
1.60mm x 1.60mm x 0.60mm
●Typical Application Circuit
HVSOF5
R1
U1
BD4142HFV
VCC
3 VCC
1
PGOOD
PGOOD
GND
CVCC
2
GND
5
DLY
IN 4
CEXT
VMON
R2
R3
Figure 1. Typical Application Circuit
○Product structure：Silicon monolithic integrated circuit
.www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・14・001
○This product is not designed for protection against radioactive rays
1/14
TSZ02201-0333AAZ00350-1-2
21.Aug.2015 Rev.002
1 page  
BD4142HFV
●Typical Performance Curves (Unless otherwise noted, Ta=25℃, VCC=5V) - continued
Datasheet
300
290
280
270
260
250
240
230
220
210
200
3
3.5 4 4.5 5
Supply Voltage : VCC[V]
5.5
Figure 8. Supply Voltage - Delay Current
320
300
280
260
240
220
200
-10
10 30 50 70
Temperature : Ta[℃]
90
Figure 9. Temperature - Delay Current
25
20
15
10
5
0
0 2000 4000 6000 8000 10000
External Capacitance : CEXT[pF]
Figure 10. External Capacitance - Delay Time
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
5/14
TSZ02201-0333AAZ00350-1-2
21.Aug.2015 Rev.002
5 Page 
BD4142HFV
Datasheet
●Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at all
power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on
the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in
deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size
and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of
connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.
www.rohm.com
© 2013 ROHM Co., Ltd. All rights reserved.
TSZ22111・15・001
11/14
TSZ02201-0333AAZ00350-1-2
21.Aug.2015 Rev.002
11 Page | ||
| Páginas | Total 18 Páginas | |
| PDF Descargar | [ Datasheet BD4142HFV.PDF ] | |
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