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S6E2D35GJA 데이터시트 PDF




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S6E2D35GJA 데이터시트, 핀배열, 회로
S6E2D3 Series
32-bit ARM® Cortex®-M4F based Microcontroller
S6E2D35J0A/S6E2D35G0A/S6E2D35GJA
Data Sheet (Full Production)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume
such that subsequent versions of this document are not expected to change. However, typographical or
specification corrections, or modifications to the valid combinations offered may occur.
Publication Number S6E2D3_DS709-00023 Revision 1.0 Issue Date April 21, 2015




S6E2D35GJA pdf, 반도체, 판매, 대치품
DataSheet
Table of Contents
1. Description................................................................................................................................................. 3
2. Features...................................................................................................................................................... 6
3. Product Lineup ........................................................................................................................................ 13
4. Packages .................................................................................................................................................. 15
5. Pin Assignment........................................................................................................................................ 16
6. Pin Descriptions ...................................................................................................................................... 20
7. I/O Circuit Type ........................................................................................................................................ 53
8. Handling Precautions.............................................................................................................................. 60
8.1. Precautions for Product Design ..................................................................................................... 60
8.2. Precautions for Package Mounting ................................................................................................ 61
8.3. Precautions for Use Environment .................................................................................................. 63
9. Handling Devices..................................................................................................................................... 64
10. Block Diagram........................................................................................................................................ 67
11. Memory Size........................................................................................................................................... 68
12. Memory Map........................................................................................................................................... 68
13. Pin Status in Each CPU State ............................................................................................................... 70
14. Electrical Characteristics...................................................................................................................... 78
14.1. Absolute Maximum Ratings ......................................................................................................... 78
14.2. Recommended Operating Conditions .......................................................................................... 80
14.3. DC Characteristics ....................................................................................................................... 84
14.3.1. Current Rating.................................................................................................................. 84
14.3.2. Pin Characteristics ........................................................................................................... 94
14.4. AC Characteristics ....................................................................................................................... 95
14.4.1. Main Clock Input Characteristics...................................................................................... 95
14.4.2. Sub Clock Input Characteristics ....................................................................................... 96
14.4.3. Built-in CR Oscillation Characteristics.............................................................................. 96
14.4.4. Operating Conditions of Main PLL (In the Case of Using Main Clock for Input Clock of
PLL)
......................................................................................................................... 97
14.4.5. Operating Conditions of USB/I2S/GDC PLL (In the Case of Using Main Clock for Input
Clock of PLL)..................................................................................................................... 97
14.4.6. Operating Conditions of Main PLL (In the Case of Using Built-in High-Speed CR Clock
for Input Clock of Main PLL).............................................................................................. 98
14.4.7. Reset Input Characteristics.............................................................................................. 98
14.4.8. Power-on Reset Timing ................................................................................................... 99
14.4.9. GPIO Output Characteristics ........................................................................................... 99
14.4.10. External Bus Timing..................................................................................................... 100
14.4.11. Base Timer Input Timing.............................................................................................. 111
14.4.12. CSIO Timing ................................................................................................................ 112
14.4.13. External Input Timing ................................................................................................... 145
14.4.14. Quadrature Position/Revolution Counter Timing.......................................................... 146
14.4.15. I2C Timing .................................................................................................................... 148
14.4.16. ETM Timing.................................................................................................................. 150
14.4.17. JTAG Timing ................................................................................................................ 151
14.4.18. I2S Timing .................................................................................................................... 152
14.4.19. GDC:Panel Output Timing ........................................................................................... 157
14.4.20. GDC: SDRAM-IF Timing.............................................................................................. 158
14.4.21. GDC: High-Speed Quad SPI Timing............................................................................ 160
14.4.22. GDC: HyperBus I/F Timing .......................................................................................... 161
14.5. 12-bit A/D Converter .................................................................................................................. 163
14.6. USB Characteristics................................................................................................................... 166
4 S6E2D3_DS709-00023-1v0-E, April 21, 2015

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S6E2D35GJA 전자부품, 판매, 대치품
DataSheet
USB Interface (One channel)
A USB interface is composed of function and host.
USB function
USB2.0 Full-Speed supported
Max 6 EndPoint supported
EndPoint 0 is for control transfer
EndPoint 1, 2 can be selected for bulk-transfer, interrupt-transfer or isochronous-transfer
EndPoint 3 to 5 can select bulk-transfer or interrupt-transfer
EndPoint 1 to 5 comprise the double buffer
The size of each endpoint is as follows.
Endpoint 0, 2 to 5: 64 bytes
EndPoint 1: 256 bytes
USB host
USB2.0 Full-Speed / Low-Speed supported
Bulk-transfer, interrupt-transfer and isochronous-transfer support
USB device connected/disconnected automatically detect
In/out token handshake packet automatically accepted
Max 256-byte packet-length supported
Wake-up function supported
Multi-function Serial Interface (Max eight channels)
64 bytes with FIFO (the FIFO step numbers vary depending on the settings of the communication mode or
bit length.)
Operation mode is selectable from the following for each channel.
UART
CSIO
LIN
I2C
UART
Full-duplex double buffer
Selection with or without parity supported
Built-in dedicated baud rate generator
External clock available as a serial clock
Various error detect functions available (parity errors, framing errors, and overrun errors)
CSIO
Full-duplex double buffer
Built-in dedicated baud rate generator
Overrun error detect function available
Serial chip select function (ch.6 and ch.7 only)
Supports High-speed SPI (ch.6 only)
Data length 5 to 16-bit
LIN
LIN protocol Rev.2.1 supported
Full-duplex double buffer
Master/Slave mode supported
LIN break field generation (can change to 13 to 16-bit length)
LIN break delimiter generation (can change to 1 to 4-bit length)
Various error detect functions available (parity errors, framing errors, and overrun errors)
April 21, 2015, S6E2D3_DS709-00023-1v0-E
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