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PDF MCP19035 Data sheet ( Hoja de datos )

Número de pieza MCP19035
Descripción High-Speed Synchronous Buck Controller
Fabricantes Microchip 
Logotipo Microchip Logotipo



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MCP19035
High-Speed Synchronous Buck Controller
Features:
• Input Voltage Range: from 4.5V to 30V
• Targeted for Low-Voltage Power Trains with
Output Current up to 20A
• High-Speed Voltage Mode, Analog Pulse-Width
Modulation Control
• Power Good Output
• Internal Oscillator, Reference Voltage and
Overcurrent Limit Threshold for Stand-Alone
Applications.
• Multiple Switching Frequency Options (FSW):
- 300 kHz
- 600 kHz
• Integrated Synchronous MOSFET Drivers
• Multiple Dead-Time Options
• Internal Blocking Device for Bootstrap Circuit
• Integrated Current Sense Capability for Short
Circuit Protection
• Internal Overtemperature Protection
• Under Voltage Lockout (UVLO)
• Integrated Linear Voltage Regulator
• 10-LD 3 X 3 mm DFN Package
Applications:
• Point of Loads
• Set-Top Boxes
• DSL Cable Modems
• FPGA’s/DSP’s Power Supply
• PC’s Graphic/Audio Cards
General Description
The MCP19035 is an application-optimized, high-
speed synchronous buck controller that operates from
input voltage sources up to 30V. This controller
implements a voltage-mode control architecture with a
fixed switching frequency of 300 kHz or 600 kHz. The
high-switching frequency facilitates the use of smaller
passive components, including the inductor and
input/output capacitors, allowing a compact, high-
performance power supply solution. The MCP19035
implements an adaptive anti-cross conduction scheme
to prevent shoot-through in the external power
MOSFETs. Furthermore, the MCP19035 offers multiple
dead-time options, enabling an additional degree of
optimization, allowing a higher efficiency power supply
design.
The MCP19035 controller is intended to be used for
applications providing up to 20A of output currents
across a wide input voltage range, up to 30V.
The SHDN input is used to turn the device on and off.
While turned off, the current consumption is minimized.
The MCP19035 offers a Power Good feature
(PWRGD), enabling fault detection and simplifying
sequencing.
Package Types
MCP19035
3x3 DFN*
SHDN 1
FB 2
COMP 3
VIN 4
PWRGD 5
10 HDRV
9 PHASE
EP
11 8 BOOT
7 LDRV
6 +VCC
* Includes Exposed Thermal Pad (EP); see Table 3-1.
2012-2013 Microchip Technology Inc.
DS22326B-page 1

1 page




MCP19035 pdf
MCP19035
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, VIN = 12V, FSW = 300 kHz, CIN = 1.0 µF, TA = +25°C (for typical
values), TA = -40°C to +125°C (for minimum and maximum).
Parameters
Symbol Min Typ Max Units
Conditions
LDRV Fall Time
Dead Time
tFL
— 10 25
ns CLOAD = 1.0 nF, Note 1
tDT 20 — — ns Two Dead-Time options, see
— 12 —
Section 5.2.2, Dead Time
Selection, Note 1
Short Circuit Protection
High-Side Over Current OCTH-HI 430 480 530
Threshold Voltage
mV Note 1, VCBOOT = 5V
Low-Side Over Current
OCTH-LO
130
180
230
Threshold Voltage
mV Note 1, Note 3
Minimum Pulse Width
During Short Circuit
tSS-MIN
— 800 —
ns Note 1
Off-Time Between
Restart Attempts (Hick-
Up Time)
tSS-HT
30 60
ms Note 1
Thermal Shutdown
Thermal Shutdown
TSHD
— 150 —
Thermal Shutdown
TSHD_HYS
15
Hysteresis
°C Note 1
°C Note 1
Note 1:
2:
3:
Ensured by design. Not production tested.
Limited by the maximum power dissipation of the case.
Possibility to be adjusted for high volumes.
TEMPERATURE SPECIFICATIONS
Electrical Characteristics: Unless otherwise indicated, VIN = 6.0V to 30V, FSW = 300 kHz
Parameters
Sym Min Typ Max Units
Conditions
Temperature Ranges
Specified Temperature Range
Maximum Junction Temperature
TA
TJ-MAX
-40
— +125 °C
— +150 °C
Operating Temperature Range
Storage Temperature Range
TA -40 — +125 °C
TA -65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 10L-3x3 DFN
JA — 53.3 — °C/W Typical 4-Layer board with
interconnecting vias
2012-2013 Microchip Technology Inc.
DS22326B-page 5

5 Page





MCP19035 arduino
MCP19035
3.0 PIN DESCRIPTION
Description of the pins are listed in Table 3-1.
TABLE 3-1: PIN DESCRIPTION TABLE
MCP19035
3 x 3 DFN
Symbol
Description
1
SHDN
Device shutdown input pin
2 FB Feedback voltage input pin
3
COMP
Internal error amplifier output pin
4 VIN Input voltage pin
5
PWRGD
Power good pin
6
+VCC
+5.0V output voltage pin
7
LDRV
Lower gate drive output pin
8
BOOT
Floating bootstrap supply pin
9
PHASE
Switching node pin
10
HDRV
Upper gate drive output pin
11 EP Exposed Thermal Pad, must be connected to GND
3.1 Shutdown Input Pin (SHDN)
This pin enables or disables the MCP19035 device.
When logic “High” is applied to this pin, the device is
enabled. A logic “Low” will disable the device. When
the device is disabled, both the LDRV and HDRV pins
are held low. The internal LDO regulator is also dis-
abled when the SHDN pin is pulled low. Do not let this
pin float. If not used, connect to VIN using a 100 k
resistor.
3.2 Feedback Voltage Input Pin (FB)
This is the internal error amplifier’s negative input, and
is used to sense the output voltage. The positive input
to the amplifier is connected to the internal reference
voltage.
3.5 Power Good Pin (PWRGD)
The power good pin is an open drain output. This pin is
pulled low when the output is 90% less than the typical
value. Connect this pin to +VCC pin through a pull-up
resistor. The recommended value for the pull-up resis-
tor is 100 k.
3.6 LDO Output Voltage Pin (+VCC)
This pin is the output of the internal voltage regulator
(LDO). The internal circuitry of the controller is powered
from this pin (+5.0V). External low noise loads can be
powered from this pin, but the sum of the external load
current and the internal circuitry current should not
exceed 50 mA. A 4.7 μF ceramic capacitor must be
connected between this pin and GND.
3.3 Internal Error Amplifier Pin
(COMP)
This is the output of the internal error amplifier. The
compensation network is connected between this pin
and the FB pin.
3.4 Input Voltage Pin (VIN)
This pin is the input power for the controller. A bypass
capacitor must be connected between this pin and the
GND pin. The input of an internal voltage regulator
(LDO) is connected to this pin to generate the +5V VCC
used for internal circuitry bias.
3.7 Lower Gate Pin (LDRV)
This pin is the drive output for the low-side N-Channel
MOSFET (synchronous rectifier). The LDRV drive is
capable of sourcing 1A and sinking 1.5A.
3.8 Bootstrap Supply Pin (BOOT)
The BOOT pin is the floating bootstrap power supply
pin for the high-side MOSFET gate driver. A capacitor
connected between this pin and the PHASE pin pro-
vides the necessary charge to turn on the external
high-side MOSFET.
2012-2013 Microchip Technology Inc.
DS22326B-page 11

11 Page







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