MC74VHCT240A Datasheet PDF - ON Semiconductor
| Part Number | MC74VHCT240A | |
| Description | Octal Bus Buffer/Line Driver | |
| Manufacturers | ON Semiconductor | |
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MC74VHCT240A
Octal Bus Buffer/Line Driver
Inverting with 3−State Outputs
The MC74VHCT240A is an advanced high speed CMOS octal bus
buffer fabricated with silicon gate CMOS technology. It achieves high
speed operation similar to equivalent Bipolar Schottky TTL while
maintaining CMOS low power dissipation.
The MC74VHCT240A is an inverting 3−state buffer, and has two
active−low output enables. This device is designed to be used with
3−state memory address drivers, etc.
The VHCT inputs are compatible with TTL levels. This device can
be used as a level converter for interfacing 3.3 V to 5.0 V, because it
has full 5.0 V CMOS level output swings.
The VHCT240A input and output (when disabled) structures
provide protection when voltages between 0 V and 5.5 V are applied,
regardless of the supply voltage. These input and output structures
help prevent device destruction caused by supply
voltage−input/output voltage mismatch, battery backup, hot insertion,
etc.
Features
• High Speed: tPD = 5.6 ns (Typ) at VCC = 5.0 V
• Low Power Dissipation: ICC = 4 mA (Max) at TA = 25°C
• TTL−Compatible Inputs: VIL = 0.8 V; VIH = 2.0 V
• Power Down Protection Provided on Inputs and Outputs
• Balanced Propagation Delays
• Designed for 4.5 V to 5.5 V Operating Range
• Low Noise: VOLP = 1.1 V (Max)
• Pin and Function Compatible with Other Standard Logic Families
• Latchup Performance Exceeds 300 mA
• ESD Performance:
Human Body Model > 2000 V;
Machine Model > 200 V
• Chip Complexity: 110 FETs or 27.5 Equivalent Gates
• These Devices are Pb−Free and are RoHS Compliant
http://onsemi.com
MARKING
DIAGRAMS
20
VHCT240A
1 SOIC−20WB
SUFFIX DW
AWLYYWWG
CASE 751D 1
20
1 TSSOP−20
SUFFIX DT
CASE 948E
1
VHCT
240A
ALYWG
G
A = Assembly Location
WL, L = Wafer Lot
YY, Y = Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
October, 2014 − Rev. 7
1
Publication Order Number:
MC74VHCT240A/D
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MC74VHCT240A
PACKAGE DIMENSIONS
0.15 (0.006) T U S
2X L/2 20
L
PIN 1
IDENT
1
0.15 (0.006) T U S
C
D
0.100 (0.004)
−T− SEATING
PLANE
TSSOP−20
CASE 948E−02
ISSUE C
20X K REF
0.10 (0.004) M T U S V S
11
B
−U−
10
A
−V−
GH
K
K1
ÍÍÍÍJ J1
ÍÍÍÍÍÍÍÍSECTION N−N
N 0.25 (0.010)
M
N
F
DETAIL E
DETAIL E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION:
MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH OR GATE BURRS
SHALL NOT EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 6.40 6.60 0.252 0.260
B 4.30 4.50 0.169 0.177
C --- 1.20 --- 0.047
D 0.05 0.15 0.002 0.006
F 0.50 0.75 0.020 0.030
−W−
G 0.65 BSC
0.026 BSC
H 0.27 0.37 0.011 0.015
J 0.09 0.20 0.004 0.008
J1 0.09 0.16 0.004 0.006
K 0.19 0.30 0.007 0.012
K1 0.19 0.25 0.007 0.010
L 6.40 BSC
0.252 BSC
M 0_ 8_ 0_ 8_
SOLDERING FOOTPRINT
7.06
1
16X
0.36
16X
1.26
0.65
PITCH
DIMENSIONS: MILLIMETERS
http://onsemi.com
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| Information | Total 6 Pages | |
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