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부품번호 | IAB110P 기능 |
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기능 | Integrated Telecom Circuits | ||
제조업체 | IXYS | ||
로고 | |||
전체 8 페이지수
INTEGRATED CIRCUITS DIVISION
IAB110P
Integrated Telecom Circuits
Parameter
Blocking Voltage
Load Current
On-Resistance (max)
Rating
350
100
35
Units
VP
mArms / mADC
Features
• 3750Vrms Input/Output Isolation
• Three Functions in One Package
• Bidirectional Current Sensing
• Bidirectional Current Switching
• FCC Compatible
• No EMI/RFI Generation
• Small 16-Pin SOIC Package (PCMCIA Compatible)
• Machine Insertable, Wave Solderable
• Tape & Reel Versions Available
Applications
• Telecommunications
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringer Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
Description
The IAB110P Multifunction Telecom switch combines
one 350V single-pole, normally open (1-Form-A)
relay; one 350V single-pole, normally closed
(1-Form-B) relay; and one bidirectional optocoupler in
a single package. Optically coupled relay outputs that
use the patented OptoMOS architecture are
controlled by a highly efficient GaAIAs infrared LED.
The IAB110P allows telecom circuit designers to
combine three discrete functions in a single
component, whose small package uses less space
than traditional discrete component solutions.
Approvals
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1305490
• EN/IEC 60950-1 Certified Component:
TUV Certificate: B 09 07 49410 006
Ordering Information
Part #
IAB110P
IAB110PTR
Description
16-Pin SOIC (50/Tube)
16-Pin SOIC (1000/Reel)
Pin Configuration
1
(N/C)
2
3
4
5
6
7
8
(N/C)
16
15 (Form A)
14
13
12 (Form B)
11
10
9
1. (N/C)
2. + LED - Form A Relay #1
3. – LED - Form A Relay #1
4. + LED - Form B Relay #2
5. – LED - Form B Relay #2
6. Emitter - Phototransistor
7. Collector - Phototransistor
8. (N/C)
9. LED - Phototransistor +/–
10. LED - Phototransistor –/+
11. Output - Form B Relay #2
12. Common Source Relay #2
13. Output - Form B Relay #2
14. Output - Form A Relay #1
15. Common Source Relay #1
16. Output - Form A Relay #1
Pb
DS-IAB110P-R04
e3
Switching Characteristics of
Normally Open Devices
Form-A
IF
ILOAD
90%
ton
10%
toff
Switching Characteristics of
Normally Closed Devices
Form-B
IF
ILOAD
10%
toff
90%
ton
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1
INTEGRATED CIRCUITS DIVISION
IAB110P
1-FORM-A RELAY PERFORMANCE DATA (cont.)*
1-Form-A
Turn-On Time vs. LED Forward Current
(IL=100mADC)
2.0
1-Form-A
Typical Turn-On Time vs. Temperature
(IL=100mADC)
5.0
1-Form-A
Typical IF for Switch Operation
vs. Temperature
(IL=100mADC)
3.0
1.8 4.5
1.6 4.0 2.5
1.4 3.5 2.0
1.2 3.0
1.0
2.5 IF=5mA
1.5
0.8
0.6
2.0
IF=10mA
IF=20mA
1.5
1.0
0.4 1.0 0.5
0.2 0.5
0
0 5 10 15 20 25 30 35 40 45 50
0
-40 -20
0
20 40 60
80 100
0
-40 -20
0
20 40 60
80 100
LED Forward Current (mA)
Temperature (ºC)
Temperature (ºC)
1-Form-A
Turn-Off Time vs. LED Forward Current
(I =100mA )
L DC
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0 5 10 15 20 25 30 35 40 45 50
LED Forward Current (mA)
1-Form-A
Typical Turn-Off Time vs. Temperature
(IF=5mA, IL=100mADC)
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-40 -20
0
20 40 60
80 100
Temperature (ºC)
1-Form-A
Typical IF for Switch Dropout
vs. Temperature
(IL=100mADC)
3.0
2.5
2.0
1.5
1.0
0.5
0
-40 -20
0 20 40 60
Temperature (ºC)
80 100
1-Form-A
Typical On-Resistance vs. Temperature
(IF=5mA, IL=100mADC)
60
50
40
30
20
10
0
-40 -20
0 20 40 60
Temperature (ºC)
80 100
180
160
140
120
100
80
60
40
20
0
-40
1-Form-A
Maximum Load Current
vs. Temperature
IF=20mA
IF=10mA
IF=5mA
-20 0 20 40 60 80 100 120
Temperature (ºC)
1-Form-A
Typical Load Current vs. Load Voltage
100 (IF=5mA, TA=25ºC)
80
60
40
20
0
-20
-40
-60
-80
-100
-2.5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5
Load Voltage (V)
430
425
420
415
410
405
400
395
-40
1-Form-A
Typical Blocking Voltage
vs. Temperature
-20 0 20 40 60 80
Temperature (ºC)
100
* The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
4
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R04
4페이지 INTEGRATED CIRCUITS DIVISION
IAB110P
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the
latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
IAB110P
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device
IAB110P
Maximum Temperature x Time
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an
optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
Pb e3
R04 www.ixysic.com
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부품번호 | 상세설명 및 기능 | 제조사 |
IAB110P | Integrated Telecom Circuits | Clare |
IAB110P | Integrated Telecom Circuits | IXYS |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |