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uClamp0541Z PDF 데이터시트 : 부품 기능 및 핀배열

부품번호 uClamp0541Z
기능 1-Line ESD Protection
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uClamp0541Z 데이터시트, 핀배열, 회로
PROTECTION PRODUCTS - Z-PakTM
Description
μClamp® TVS diodes are designed to protect sensitive
electronics from damage or latch-up due to ESD. It is
designed to replace 0201 size multilayer varistors (MLVs)
in portable applications such as cell phones, notebook
computers, and other portable electronics. It features
large cross-sectional area junctions for conducting high
transient currents. This device offers desirable charac-
teristics for board level protection including fast response
time, low operating and clamping voltage, and no device
degradation.
μClamp®0541Z is in a 2-pin SLP0603P2X3 package. It
measures 0.6 x 0.3 mm with a nominal height of only
0.25mm. Leads are finished with lead-free NiAu. Each
device will protect one line operating at 5 volts. It
gives the designer the flexibility to protect single lines in
applications where arrays are not practical. The
combination of small size and high ESD surge capability
makes them ideal for use in portable applications such
as cellular phones, digital cameras, and MP3 players.
uClamp0541Z
Ultra Small μClamp®
1-Line ESD Protection
Features
High ESD withstand Voltage: +/-17kV (Contact/Air)
per IEC 61000-4-2
Able to withstand over 1000 ESD strikes per IEC
61000-4-2 Level 4
Ultra-small 0201 package
Protects one data or power line
Low reverse current: <10nA typical (VR=5V)
Working voltage: +/- 5V
Low capacitance: 6.5pF typical
Solid-state silicon-avalanche technology
Mechanical Characteristics
SLP0603P2X3 package
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Nominal Dimensions: 0.6 x 0.3 x 0.25 mm
Lead Finish: NiAu
Marking : Marking code + dot matrix date code
Packaging : Tape and Reel
Applications
Cellular Handsets & Accessories
Keypads, Side Keys, Audio Ports
Portable Instrumentation
Digital Lines
Tablet PC
Nominal Dimensions
0.62
0.22
2/6/2015
0.32
0.16
0.355 BSC
0.25
Schematic
1
2
SLP0603P2X3 (Bottom View)
1 www.semtech.com




uClamp0541Z pdf, 반도체, 판매, 대치품
PROTECTION PRODUCTS
Typical Characteristics
Typical Insertion Loss S21
CH1 S21 LOG 6 dB / REF 0 dB
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
-42 dB
-48 dB
1
MHz
START. 030 MHz
10
MHz
1: -2.0678 dB
800 MHz
2: -2.2545 dB
900 MHz
12
3
3: -6.6417 dB
1.8 GHz
5 4: -12.722 dB
4 2.5 GHz
100
MHz
13
GHz GHz
STOP 3000.000000 MHz
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. The table below provides
Semtech's recommended assembly guidelines for
mounting this device. The figure at the right details
Semtech’s recommended aperture based on the
below recommendations. Note that these are only
recommendations and should serve only as a starting
point for design since there are many factors that
affect the assembly process. The exact manufactur-
ing parameters will require some experimentation to
get the desired solder application.
Assembly Parameter
Solder Stencil Design
Aperture shape
Solder Stencil Thickness
Solder Paste Type
Solder Reflow Profile
PCB Solder Pad Design
PCB Pad Finish
Recommendation
Laser cut, Electro-polished
Rectangular with rounded
corners
0.100 mm (0.004")
Type 4 size sphere or smaller
Per JEDEC J-STD-020
Non-Solder mask defined
OSP OR NiAu
© 2015 Semtech Corporation
4
uClamp0541Z
Stencil Aperture
Mounting Pad
Package
0.272
0.175
0.250
0.298
0.270
Recommended Mounting Pattern
www.semtech.com

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uClamp0541Z 전자부품, 판매, 대치품
PROTECTION PRODUCTS
Carrier Tape Specification
Plastic Tape
Bo
Ko
Paper Tape
Ao
uClamp0541Z
Note: All dimensions in mm unless otherwise specified
Device Orientation in Tape
Date Code Location
(Away from Sprocket Holes)
© 2015 Semtech Corporation
7
www.semtech.com

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부품번호상세설명 및 기능제조사
uClamp0541Z

1-Line ESD Protection

Semtech Corporation
Semtech Corporation

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