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PDF HI-3001 Data sheet ( Hoja de datos )
| Número de pieza | HI-3001 | |
| Descripción | 1Mbps Avionics CAN Transceiver | |
| Fabricantes | HOLTIC | |
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October 2015
HI-3000, HI-3001, HI-3002
1Mbps Avionics CAN Transceiver
with Low Power Standby Mode
GENERAL DESCRIPTION
PIN CONFIGURATIONS (Top Views)
The HI-3000 is a 1 Mbps Controller Area Network (CAN)
transceiver optimized for use in aerospace applications.
It interfaces between a CAN protocol controller and the
physical wires of the bus in a CAN network. Differential
output amplitude and current drive capability are specifi-
cally enhanced to meet the needs of long cable runs typi-
cal of aerospace applications.
The HI-3000 supports two modes of operation: Normal
Mode and Standby Mode. The Standby Mode is a very
low-current mode which continues to monitor bus activity
and allows an external controller to manage wake-up.
Superior common-mode receiver performance makes
the device especially suitable for applications where
ground reference voltages may vary from point to point
over long distances along the CAN bus. In addition, the
HI-3000 provides a SPLIT pin to give an output reference
voltage of VDD/2 which can be used for stabilizing the re-
cessive bus level when the split termination technique is
used to terminate the bus.
A TXD dominant time-out feature also protects the bus
from being driven into a permanent dominant state (so-
called “babbling idiot”) if pin TXD becomes permanently
low due to application failure.
The device also has short circuit protection to +/-58V on
CANH, CANL and SPLIT pins and ESD protection to
+/- 6kV on all pins.
The HI-3001 is identical to the HI-3000 except the SPLIT
pin is substituted with a VIO supply voltage pin. This al-
lows the HI-3001 to interface directly with controllers with
3.3V supply voltages.
The HI-3002 provides both the SPLIT and VIO supply
voltage pins in a compact 16-pin QFN.
All three devices are available in industrial -40oC to +85oC
and extended -55oC to +125oC temperature ranges.
“RoHS compliant” lead-free options are also available
with optional burn-in for the extended temperature range.
TXD - 1
GND - 2
VDD - 3
RXD - 4
HI-3000PSI
HI-3000PST
HI-3000PSM
8 - STB
7 - CANH
6 - CANL
5 - SPLIT
TXD - 1
GND - 2
VDD - 3
RXD - 4
HI-3001PSI
HI-3001PST
HI-3001PSM
8 - STB
7 - CANH
6 - CANL
5 - VIO
8 - PIN PLASTIC NARROW BODY SOIC
GND 1
GND 2
VDD 3
VDD 4
HI-3002PCI
HI-3002PCT
HI-3002PCM
12 CANH
11 CANH
10 CANL
9 CANL
16 - PIN PLASTIC 4 x 4mm QFN
FEATURES
· Compatible with ARINC 825 and ISO 11898-5 standards.
· Signaling rates up to 1Mbit/s.
· Internal VDD/2 voltage source available to stabilize the
recessive bus level if split termination is used (HI-3000
SPLIT pin).
· VIO input on HI-3001 allows for direct interfacing with 3.3V
controllers.
· Detection of permanent dominant on TXD pin (babbling
idiot protection).
· High impedance allows connection of up to 120 nodes.
· Input levels compatible with 3.3V or 5V controllers.
· CANH, CANL and SPLIT pins short-circuit proof to +/-58V.
· Will not disturb the bus if unpowered.
· Extended temperature range and burn-in options for high
reliability applications.
· Compatible with CAN 2.0A & CAN 2.0B Specification
controllers
(DS3000 Rev. F)
HOLT INTEGRATED CIRCUITS
www.holtic.com
10/15
1 page  
HI-3000, HI-3001, HI-3002
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND = 0V)
Supply Voltage, VDD, VIO : .....................................................................7V
Current at Input pins ......................................................-100mA to +100mA
DC Voltages at TXD, RXD and STB ..............................-0.5V to VDD +0.5V
DC Voltages at CANH, CANL and SPLIT: ...............................-58V to +58V
Internal Power Dissipation: ..............................................................900mW
Electrostatic Discharge (ESD)1, All pins ..........................................+/- 6kV
Operating Temperature Range: (Industrial).........................-40°C to +85°C
(Hi-Temp) ........................-55°C to +125°C
Maximum Junction Temperature2 ......................................................175°C
Storage Temperature Range: ................................... -65°C to +150°C
Reflow Soldering Temperature: ................................................. 260°C
NOTES:
1. Human Body Model (HBM).
2. Junction Temperature TJ is defined as TJ = TAMB + P × Rth, where TAMB is the ambient or operating temperature, P is the power dissipation and Rth is
a fixed thermal resistance value which depends on the package and circuit board mounting conditions.
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only. Functional
operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
VDD = 5V±5%, Operating temperature range (unless otherwise noted). Positive currents flow into the IC.
PARAMETER
SYMBOL
CONDITIONS
LIMITS
UNIT
MIN TYP MAX
POWER SUPPLIES
VDD Supply Current
VIO Supply Current
VIO Supply Voltage (see Note 1)
DIGITAL INPUTS (Pins TXD, STB)
HIGH-level input voltage (see Note 1)
LOW-level input voltage
HIGH-level input current
LOW-level input current
DIGITAL OUTPUTS
HIGH-level output voltage (RXD Pin) (see Note 1)
LOW-level output voltage (RXD Pin)
Output voltage (SPLIT Pin)
Standby leakage current (SPLIT Pin)
IDD
IIO
VIO
VIH
VIL
IIH
IIL
VOH
VOL
VSPLIT
ISTB
Recessive: VTXD = VDD
Dominant: VTXD = 0 V
Standby Mode: VTXD = VDD
6 10 mA
50 70 mA
15 30 μA
100 μA
2.7 5.5 V
VTXD = VDD or VIO
VTXD = 0 V
80%VDD
− 0.5
−5
0
− 50
VDD + 0.5 V
20%VDD V
+ 5 μA
− 150 μA
IOH = 1mA
IOL = 1mA
− 100 μA < ISPLIT < 100 μA
90%VDD
V
0 0.1 10%VDD V
0.45VDD 0.5VDD 0.55VDD V
-5 +5 μA
DRIVER
CANH dominant output voltage
CANL dominant output voltage
Recessive output voltage
Bus output voltage in standby
Dominant differential output voltage
Recessive differential output voltage
VO(CANH)
VO(CANL)
VCANH(r),
VCANL(r)
VSTB
VDIFF(d)(o)
VDIFF(r)(o)
VTXD = 0 V
VTXD = 0 V (See Fig. 2)
VTXD = VDD, RL = 0 (See Fig. 2)
VTXD = VDD, RL = 0 (See Fig. 2)
VTXD = 0 V, 45 Ω < RL < 65 Ω
VTXD = VDD, no load (See Fig. 2)
3 3.6 4.25 V
0.5 1.4 1.75 V
2 0.5VDD 3
V
-0.1 0.1 V
1.5
− 50
1.8
0
3V
50 mV
NOTE:
1. When VIO is connected (HI-3001 or HI-3002), power supply limits are referenced wrt VIO rather than VDD. If VIO < 3.3V, VIH must be at least 2.5V.
HOLT INTEGRATED CIRCUITS
5
5 Page 
HI-3000, HI-3001, HI-3002
REVISION HISTORY
P/N Rev Date Description of Change
DS3000 NEW
A
B
C
02/15/11
04/29/11
09/09/11
12/18/12
D 10/30/14
E 6/19/15
F 10/14/15
Initial Release
Corrected heat-sink note on QFN package drawing.
Update pad and heat-sink dimensions for 16-lead QFN package (16PCS)
Change high-level digital input voltage (VIH) to 80%VDD (or VIO) and low-level digital
input voltage (VIL) to 20%VDD (or VIO). Update SOIC-8 and SOIC-16 package drawings.
Added "Compatible with CAN 2.0A & CAN 2.0B Specification controllers" to features.
Updated 8HN and 16PCS package drawings. Clarified Reflow Soldering Temperature in
Absolute Maximum Ratings.
Corrected package pin numbers 3 and 5 in Figure 7 HI-3001 Typical Application
Connections
Add parameter specification for VIO to DC Characteristics Table.
HOLT INTEGRATED CIRCUITS
11
11 Page | ||
| Páginas | Total 13 Páginas | |
| PDF Descargar | [ Datasheet HI-3001.PDF ] | |
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