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PDF AS5SP512K36 Data sheet ( Hoja de datos )

Número de pieza AS5SP512K36
Descripción Synchronous SRAM
Fabricantes Micross 
Logotipo Micross Logotipo



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Plastic Encapsulated Microcircuit
18Mb, 512K x 36, Synchronous SRAM
Pipeline Burst, Single Cycle Deselect
FEATURES
 Synchronous Operation in relation to the input Clock
 2 Stage Registers resulting in Pipeline operation
 On chip address counter (base +3) for Burst operations
 Self-Timed Write Cycles
 On-Chip Address and Control Registers
 Byte Write support
 Global Write support
 On-Chip low power mode [powerdown] via ZZ pin
 Interleaved or Linear Burst support via Mode pin
 Three Chip Enables for ease of depth expansion without
Data Contention.
 Two Cycle load, Single Cycle Deselect
 Asynchronous Output Enable (OE\)
 Three Pin Burst Control (ADSP\, ADSC\, ADV\)
 3.3V Core Power Supply
 3.3V/2.5V IO Power Supply
 JEDEC Standard 100 pin TQFP Package
 Available in Industrial, Enhanced, and Mil-
Temperature Operating Ranges
RoHs compliant options available
SSRAM
AS5SP512K36
100-PIN TQFP
PINOUT
(3-CHIP ENABLE)
Fast Access Times
Parameter
Cycle Time
Clock Access Time
Output Enable Access Time
Symbol
tCYC
tCD
tOE
200Mhz
5.0
3.1
3.1
166Mhz
6.0
3.5
3.5
133Mhz
7.5
4.0
4.0
Block Diagram
OE\
ZZ
CLK
CE1\
CE2
CE3\
BWE\
BWx\
GW\
ADV\
ADSC\
ADSP\
MODE
A0-Ax
CONTROL
BLOCK
BURST CNTL.
Address
Registers
Row
Decode
Column
Decode
I/O Gating and Control
Memory Array
x36
SBP
Synchronous Pipeline
Burst
Two (2) cycle load
One (1) cycle
de-select
One (1) cycle latency
on Mode change
Output Output
Register Driver
Input
Register
Units
ns
ns
ns
DQx, DQPx
GENERAL DESCRIPTION
The AS5SP512K36 is a 18Mb High Performance
Synchronous Pipeline Burst SRAM, available in multiple
temperature screening levels, fabricated using High
Performance CMOS technology and is organized as a
512K x 36 array. It integrates address and control registers,
a two (2) bit burst address counter supporting four (4)
double-word transfers. Writes are internally self-timed and
synchronous to the rising edge of clock.
The AS5SP512K36 includes advanced control options
including Global Write, Byte Write as well as an
asynchronous output enable. Burst Cycle controls are
handled by three (3) input pins, ADV\, ADSP\ and ADSC\.
Burst operation can be initiated with either the Address
Status Processor (ADSP\) or Address Status controller
(ADSC\) inputs. Subsequent burst addresses are generated
internally in the system’s burst sequence control block and
are controlled by the Address Advance (ADV\) control
input.
AS5SP512K36
Rev. 3.0 10/13
Micross Components reserves the right to change products or specications without notice.
1

1 page




AS5SP512K36 pdf
SSRAM
AS5SP512K36
DC Electrical Characteristics (VDD = 3.3v ± 5%, VDDQ = 3.3V/2.5V ± 5%, VDDQ VDD) [1, 2]
TA=Min. and Max temperatures of Screening level chosen
Symbol
VDD
VDDQ
VoH
VoL
VIH
VIL
IIL
IZ
IOL
IDD
ISB1
ISB2
Parameter
Power Supply Voltage
I/O Supply Voltage
Output High Voltage
Output Low Voltage
Input High Voltage
Input Low Voltage
Input Leakage (except ZZ) Mode Pin
Input Leakage, ZZ pin
Output Leakage
Operating Current
Automatic CE, Power Down
Current - TTL inputs
CMOS Standby
Test Conditions
VDD=Min., IOH=-4mA
VDD=Min., IOH=-1mA
VDD=Min., IOL=8mA
VDD=Min., IOL=1mA
VDD=Max., VIN=VSS to VDD
3.3v
2.5v
3.3v
2.5v
3.3v
2.5v
3.3v
2.5v
Output Disabled, VOUT=VSSQ to VDDQ
VDD=Max., f=Max.,
5.0ns Cycle, 200 Mhz
IOH=0mA
6.0ns Cycle, 166 Mhz
7.5ns Cycle, 133 Mhz
Max VDD, De-Selected,
VIN>=VIH or VIN</=VIL
5.0ns Cycle, 200 Mhz
f=1/tCYC
6.0ns Cycle, 166 Mhz
7.5ns Cycle, 133 Mhz
Max. VDD, Device deselected, VIN </=0.3V or VIN>/=VDDQ-0.3V
f=1/tCYC
Min
3.465
2.375
2.4
2
2
1.7
-5
-30
-5
Max
3.630
VDD
0.4
0.4
0.8
0.7
5
30
5
475
425
375
250
225
200
200
Units
V
V
V
V
V
V
V
V
V
V
uA
uA
uA
mA
mA
mA
mA
mA
mA
mA
Notes
4
3
3
Thermal Resistance
Parameter
Description
ȺJA
ThermalResistance
(JunctiontoAmbient)
ȺJC
ThermalResistance
(JunctiontoCase)
TestConditions
Testconditionsfollowstandardtest
methodsandproceduresfor
measuringthermalimpedance,per
EIA/JESD51
DQ DQC
Package Package Unit
28.66 30.2 oC/W
4.08 6.5 oC/W
Notes:
[1]
[2]
[3]
[4]
All Voltages referenced to VSS (Logic Ground)
Overshoot: VIH(AC) < VDD +1.5V (Pulsewidth less than tCYC/2)
Undershoot: VIL(AC) > -2V (Pulsewidth less than tCYCLZ)
tPower-up: Assumes a linear amp from OV to VDD(MIN) within zooms.
During this time VIH ” VDD and VDDQ ” VDD
MODE and ZZ pins have internal pull-up resistors
VDDQ should never exceed VDD, VDD and VDDQ can be connected together
AS5SP512K36
Rev. 3.0 10/13
Micross Components reserves the right to change products or specications without notice.
5

5 Page





AS5SP512K36 arduino
SSRAM
AS5SP512K36
MECHANICAL DEFINITION
100-Pin TQFP (Package Designator DQ)
AS5SP512K36
Rev. 3.0 10/13
11
Micross Components reserves the right to change products or specications without notice.

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