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PDF AS8E128K32 Data sheet ( Hoja de datos )
| Número de pieza | AS8E128K32 | |
| Descripción | 128K x 32 EEPROM | |
| Fabricantes | Micross | |
| Logotipo |  |
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EEPROM
AS8E128K32
128K x 32 EEPROM
EEPROM Memory Array
AVAILABLE AS MILITARY
SPECIFICATIONS
• SMD 5962-94585
• MIL-STD-883
FEATURES
• Access times of 120, 140, 150, 200, 250, and 300 ns
• Built in decoupling caps for low noise operation
• Organized as 128K x32; User configurable
as 256K x16 or 512K x8
• Operation with single 5 volt supply
• Low power CMOS
• TTL Compatible Inputs and Outputs
• Operating Temperature Ranges:
Military: -55oC to +125oC
Industrial: -40oC to +85oC
OPTIONS
MARKINGS
• Timing
120 ns
-120
140 ns
-140
150 ns
-150
200 ns
-200
250 ns
-250
300 ns
-300
• Package
Ceramic Quad Flat Pack Q
Ceramic Quad Flat Pack Q3
Pin Grid Array- 8 Series P
Pin Grid Array- 8 Series PN
GENERAL DESCRIPTION
The AS8E128K32 is a 4 Megabit EEPROM Module organized
as 128K x 32 bit. User configurable to 256K x16 or 512Kx 8. The
module achieves high speed access, low power consumption and high
reliability by employing advanced CMOS memory technology.
The military grade product is manufactured in compliance to the
SMD and MIL-STD 883, making the AS8E128K32 ideally suited for
military or space applications.
The module is offered in a 1.075 inch square ceramic pin grid
array substrate. This package design provides the optimum space
saving solution for boards that accept through hole packaging.
The module is also offered as a 68 lead 0.990 inch square ceramic
quad flat pack. It has a max. height of 0.200 inch. This package de-
sign is targeted for those applications which require low profile SMT
Packaging.
For more products and information
please visit our web site at
www.micross.com
AS8E128K32
Rev. 8.2 07/10
1
PIN ASSIGNMENT
(Top View)
66 Lead PGA
(Pins 8, 21, 28, 39 are no connects on the PN package)
66 Lead PGA
(Pins 8, 21, 28, 39 are grounds on the P package)
68 Lead CQFP
Micross Components reserves the right to change products or specifications without notice.
1 page  
EEPROM
AS8E128K32
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS
(-55oC < TA < +125oC or -40oC to +85oC; Vcc = 5V +10%)
DESCRIPTION
Address to Output Delay
CE\ to Output Delay
OE\ to Output Delay
CE\ or OE\ to Output Float
Output Hold from OE\, CE\ or Address,
whichever comes first
SYMBOL
tACC
tCE
120
MIN MAX
120
120
tOE 0 50
tDF 55
tOH 0
140
MIN MAX
140
140
0 55
55
0
150
MIN MAX
150
150
0 55
55
0
200
MIN MAX
200
200
0 55
55
0
250
MIN MAX
250
250
0 55
55
0
300
MIN MAX UNITS
300 ns
300 ns
0 55 ns
55 ns
0 ns
ADDRESS
CE/
OE\
DQ
AC READ WAVEFORMS(1,2,3)
tRC
ADDRESS VALID
ttCCEE
ttOOEE
ttAACCCC
OUTPUT VALID
ttDDFF
tOtOHH
NOTES:
1. CE\ may be delayed to tACC-tCE after the address transition without impact on tACC.
2. OE\ may be delayed to tCE-tOE after the falling edge of CE\ without impact on tCE or by tACC-tOE after an address change
without inpact on tACC.
3. tDF is specified from OE\ or CE\ whichever occurs first (CL = 5pF).
AS8E128K32
Rev. 8.2 07/10
Micross Components reserves the right to change products or specifications without notice.
5
5 Page 
EEPROM
AS8E128K32
MECHANICAL DEFINITIONS*
Micross Package Designator Q3
D2
D1
D
b
0.015
D3
e
PACKAGESPECIFICATION
Symbol Min
Max
A .200
A2 .010 .025
A3 .070 .080
b .013 .017
B .010REF
D .800BSC
D1 .870 .890
D2 .980 1.00
e .050BSC
R .010TYP
L1 .035 .045
Dimensionsareininches.
*All measurements are in inches.
AS8E128K32
Rev. 8.2 07/10
R
L1
B
A
A2
A3
11
Micross Components reserves the right to change products or specifications without notice.
11 Page | ||
| Páginas | Total 15 Páginas | |
| PDF Descargar | [ Datasheet AS8E128K32.PDF ] | |
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