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부품번호 | ESDA17P50-1U1M 기능 |
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기능 | High power transient voltage suppressor | ||
제조업체 | STMicroelectronics | ||
로고 | |||
전체 10 페이지수
ESDA17P50-1U1M
High power transient voltage suppressor
Datasheet - production data
Description
The ESDA17P50-1U1M is a unidirectional single
line TVS diode designed to protect the power line
against EOS and ESD transients.
The device is ideal for applications where high
power TVS and board space saving are required.
Figure 1: Pin configuration
1610 package
Features
Low clamping voltage
Typical peak pulse power: 1200 W (8/20 µs)
Stand-off voltage 15 V
Unidirectional diode
Low leakage current: 50 nA at 25 °C
Complies with IEC 61000-4-2 level 4
±30 kV (air discharge)
±30 kV (contact discharge)
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
Smartphones, mobile phones, tablets,
portable multimedia
USB VBUS protection
Power supply protection
Battery protection
July 2016
Doc029464 Rev 1
This is information on a product in full production.
1/10
www.st.com
Package information
ESDA17P50-1U1M
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1 QFN 1610 package information
Figure 9: QFN 1610 package outline
D
Top view
Side view
e
4/10
L
Bottom view
Table 3: QFN 1610 package mechanical data
Dimensions
Ref. Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
A 0.51 0.55 0.60 0.0201 0.0217
A1 0.02 0.05
0.0008
b
0.75
0.80
0.85
0.0295
0.0315
D 1.60
0.0630
E 1.00
0.0394
e 1.05
0.0413
L
0.030
0.035
0.040
0.0118
0.0138
Doc029464 Rev 1
Max.
0.0236
0.0020
0.0335
0.0157
4페이지 ESDA17P50-1U1M
Recommendation on PCB assembly
3 Recommendation on PCB assembly
3.1 Stencil opening design
1. General recommendation on stencil opening design
a. Stencil opening dimensions: L (Length), W (Width), T (Thickness).
2. General design rule
a. Stencil thickness (T) = 75 ~ 125 μm
b.
Aspect
ratio
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c.
Aspect
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≥
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3. Reference design
a. Stencil opening thickness: 100 μm
b. Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 14: Stencil opening dimensions
L
TW
Figure 15: Recommended stencil window position
Figure 16: Alternative stencil window position
3.2 Solder paste
1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during PCB movement.
4. Solder paste with fine particles: powder particle size is 20-45 μm.
Doc029464 Rev 1
7/10
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구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
ESDA17P50-1U1M | High power transient voltage suppressor | STMicroelectronics |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |