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ESDA17P50-1U1M 데이터시트 PDF




STMicroelectronics에서 제조한 전자 부품 ESDA17P50-1U1M은 전자 산업 및 응용 분야에서
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부품번호 ESDA17P50-1U1M 기능
기능 High power transient voltage suppressor
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ESDA17P50-1U1M 데이터시트, 핀배열, 회로
ESDA17P50-1U1M
High power transient voltage suppressor
Datasheet - production data
Description
The ESDA17P50-1U1M is a unidirectional single
line TVS diode designed to protect the power line
against EOS and ESD transients.
The device is ideal for applications where high
power TVS and board space saving are required.
Figure 1: Pin configuration
1610 package
Features
Low clamping voltage
Typical peak pulse power: 1200 W (8/20 µs)
Stand-off voltage 15 V
Unidirectional diode
Low leakage current: 50 nA at 25 °C
Complies with IEC 61000-4-2 level 4
±30 kV (air discharge)
±30 kV (contact discharge)
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
Smartphones, mobile phones, tablets,
portable multimedia
USB VBUS protection
Power supply protection
Battery protection
July 2016
Doc029464 Rev 1
This is information on a product in full production.
1/10
www.st.com




ESDA17P50-1U1M pdf, 반도체, 판매, 대치품
Package information
ESDA17P50-1U1M
2 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
2.1 QFN 1610 package information
Figure 9: QFN 1610 package outline
D
Top view
Side view
e
4/10
L
Bottom view
Table 3: QFN 1610 package mechanical data
Dimensions
Ref. Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
A 0.51 0.55 0.60 0.0201 0.0217
A1 0.02 0.05
0.0008
b
0.75
0.80
0.85
0.0295
0.0315
D 1.60
0.0630
E 1.00
0.0394
e 1.05
0.0413
L
0.030
0.035
0.040
0.0118
0.0138
Doc029464 Rev 1
Max.
0.0236
0.0020
0.0335
0.0157

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ESDA17P50-1U1M 전자부품, 판매, 대치품
ESDA17P50-1U1M
Recommendation on PCB assembly
3 Recommendation on PCB assembly
3.1 Stencil opening design
1. General recommendation on stencil opening design
a. Stencil opening dimensions: L (Length), W (Width), T (Thickness).
2. General design rule
a. Stencil thickness (T) = 75 ~ 125 μm
b.
Aspect
ratio
=
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1.5
c.
Aspect
area
=
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2������(������+������)
0.66
3. Reference design
a. Stencil opening thickness: 100 μm
b. Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 14: Stencil opening dimensions
L
TW
Figure 15: Recommended stencil window position
Figure 16: Alternative stencil window position
3.2 Solder paste
1. Use halide-free flux, qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during PCB movement.
4. Solder paste with fine particles: powder particle size is 20-45 μm.
Doc029464 Rev 1
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부품번호상세설명 및 기능제조사
ESDA17P50-1U1M

High power transient voltage suppressor

STMicroelectronics
STMicroelectronics

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