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PDF HV9922 Data sheet ( Hoja de datos )

Número de pieza HV9922
Descripción 3-Pin Switch-Mode LED Lamp Driver ICs
Fabricantes Microchip 
Logotipo Microchip Logotipo



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HV9921/HV9922/HV9923
3-Pin Switch-Mode LED Lamp Driver ICs
Features
• Constant output current:
- HV9921 – 20mA
- HV9922 – 50mA
- HV9923 – 30mA
• Universal 85 - 264VAC operation
• Fixed off-time buck converter
• Internal 475V power MOSFET
Applications
• Decorative lighting
• Low power lighting fixtures
Description
HV9921/HV9922/HV9923 are pulse-width modulated
(PWM), high-efficiency, LED driver control ICs. They
allow efficient operation of LED strings from voltage
sources ranging up to 400VDC. HV9921/22/23 include
an internal high voltage switching MOSFET controlled
with fixed off-time (TOFF) of approximately 10μs. The
LED string is driven at constant current, thus providing
constant light output and enhanced reliability. The out-
put current is internally fixed at 20mA for HV9921,
50mA for HV992, and 30mA for HV9923. The peak cur-
rent control scheme provides good regulation of the
output current throughout the universal AC line voltage
range of 85 to 264VAC or DC input voltage of 20 to
400V.
2014 Microchip Technology Inc.
DS20005311A-page 1

1 page




HV9922 pdf
HV9921/HV9922/HV9923
THERMAL RESISTANCE
Package
TO-92
TO-243AA(SOT-89)
θja
132°C/W
133°C/W
FIGURE 1-1:
1.10
1.05
1.00
0.95
0.90
0.85
0.80
-40
12
TYPICAL PERFORMANCE CHARACTERISTICS (TJ= 25°C UNLESS OTHERWISE NOTED)
200
180
160
140
120
100
80
60
40
-15 10 35 60 85
Junction Temperature, °C
110
20
0
-40
1000
-15 10 35 60 85
Junction Temperature (°C)
110
10
8 100
6
4 10
2
0
-40
580
570
560
550
540
530
520
510
500
490
-40
-15 10 35 60 85
Junction Temperature (°C)
-15 10 35
60 85
Junction Temperature (°C)
110
110
1
0
180
160
140
120
100
80
60
40
20
0
0
10 20 30
DRAIN Voltage (V)
TJ = 25°C
TJ = 125°C
10 20 30
DRAIN Voltage (V)
40
40
2014 Microchip Technology Inc.
DS20005311A-page 5

5 Page





HV9922 arduino
HV9921/HV9922/HV9923
5.0 LAYOUT CONSIDERATIONS
For a recommended circuit board layout for the
HV9921/22/23, see Figure 5-1.
5.1 Single Point Grounding
Use a single point ground connection from the input fil-
ter capacitor to the area of copper connected to the
GND pin.
5.2 Bypass Capacitor (CDD)
The VDD pin bypass capacitor CDD should be located
as near as possible to the VDD and GND pins.
5.3 Switching Loop Areas
The area of the switching loop connecting the input fil-
ter capacitor CIN, the diode D1 and the HV9921/22/23
together should be kept as small as possible.
The switching loop area connecting the output filter
capacitor CO, the inductor L1 and the diode D1
together should be kept as small as possible.
5.4 Thermal Considerations vs.
Radiated EMI
The copper area where GND pin is connected acts not
only as a single point ground, but also as a heat sink.
This area should be maximized for good heat sinking,
especially when the SOT-89 package is used. The
same applies to the cathode of the free-wheeling diode
D1. Both nodes are quiet; therefore, they will not cause
radiated RF emission. The switching node copper area
connected to the DRAIN pin of the HV9921/22/23, the
anode of D1 and the inductor L1 needs to be mini-
mized. A large switching node area can increase high
frequency radiated EMI.
5.5 Input Filter Layout Considerations
The input circuits of the EMI filter must not be placed in
the direct proximity to the inductor L1 in order to avoid
magnetic coupling of its leakage fields. This consider-
ation is especially important when unshielded con-
struction of L1 is used. When an axial input EMI filter
inductor LIN is selected, it must be positioned orthogo-
nal with respect to L1. The loop area formed by CIN2,
LIN and CIN should be minimized. The input lead wires
must be twisted together.
FIGURE 5-1:
RECOMMENDED CIRCUIT BOARD LAYOUT WITH HV9921/22/23
COMPONENT SIDE VIEW
AC Line F1
85-264VAC
VRD1
D2-5
LIN
D1
CIN2
CIN
CO
L1
LED +
LED -
CDD U1
2014 Microchip Technology Inc.
DS20005311A-page 11

11 Page







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