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HMC156A 데이터시트 PDF




Hittite Microwave Corporation에서 제조한 전자 부품 HMC156A은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

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부품번호 HMC156A 기능
기능 GaAs MMIC PASSIVE FREQUENCY DOUBLER
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HMC156A 데이터시트, 핀배열, 회로
v00.0111
Typical Applications
2 The HMC156A is suitable for:
• Wireless Local Loop
• LMDS, VSAT, and Point-to-Point Radios
• UNII & HiperLAN
• Test Equipment
Functional Diagram
HMC156A
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 0.7 - 2.4 GHz INPUT
Features
Conversion Loss: 15 dB
Fo, 3Fo, 4Fo Isolation: 38 dB
Input Drive Level: 10 to 20 dBm
General Description
The HMC156A is a miniature frequency doubler in
a MMIC die. Suppression of undesired fundamental
and higher order harmonics is 38 dB typical with
respect to input signal levels. The doubler uses the
same diode/balun technology used in Hittite MMIC
mixers, features small size and requires no DC bias.
Electrical Specifications, TA = +25° C, As a Function of Drive Level
Input = +10 dBm
Input = +15 dBm
Input = +20 dBm
Parameter
Min. Typ. Max. Min. Typ. Max. Min. Typ. Max.
Frequency Range, Input
1.1 - 2.1
0.8 - 2.4
0.7 - 2.3
Frequency Range, Output
2.2 - 4.2
1.6 - 4.8
1.4 - 4.6
Conversion Loss
17 22
15 20
15 20
FO Isolation
(with respect to input level)
42 47
43 47
27 35
3FO Isolation
(with respect to input level)
45 55
44 55
29 40
4FO Isolation
(with respect to input level)
28 38
31 38
25 35
Units
GHz
GHz
dB
dB
dB
dB
2-1
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]




HMC156A pdf, 반도체, 판매, 대치품
v00.0111
HMC156A
GaAs MMIC PASSIVE FREQUENCY
DOUBLER, 0.7 - 2.4 GHz INPUT
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD
protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry
nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning
systems.
Static Sensitivity: Follow ESD precautions to protect against ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias
cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The
surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive
epoxy. The mounting surface should be clean and flat.
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the
perimeter of the chip once it is placed into position.
Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of
150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use
the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and
terminated on the package. RF bonds should be as short as possible.
2
For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824
Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com
Application Support: Phone: 978-250-3343 or [email protected]
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관련 데이터시트

부품번호상세설명 및 기능제조사
HMC156

GaAs MMIC PASSIVE FREQUENCY DOUBLER/ 0.7 - 2.4 GHz INPUT

Hittite Microwave Corporation
Hittite Microwave Corporation
HMC156A

GaAs MMIC PASSIVE FREQUENCY DOUBLER

Hittite Microwave Corporation
Hittite Microwave Corporation

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