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What is HMC571?

This electronic component, produced by the manufacturer "Hittite Microwave", performs the same function as "GaAs MMIC I/Q DOWNCONVERTER".


HMC571 Datasheet PDF - Hittite Microwave

Part Number HMC571
Description GaAs MMIC I/Q DOWNCONVERTER
Manufacturers Hittite Microwave 
Logo Hittite Microwave Logo 


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v03.0808
HMC571
GaAs MMIC I/Q DOWNCONVERTER
21 - 25 GHz
Typical Applications
The HMC571 is ideal for:
• Point-to-Point and Point-to-Multi-Point Radio
3 • Military Radar, EW & ELINT
• Satellite Communications
Features
Conversion Gain: 11 dB
Image Rejection: 24 dB
2 LO to RF Isolation: 40 dB
Noise Figure: 3 dB
Input IP3: +5 dBm
Die Size: 2.33 x 2.51 x 0.10 mm
3 - 138
Functional Diagram
General Description
The HMC571 is a compact GaAs MMIC I/Q
downconverter chip which provides a small signal
conversion gain of 10 dB with a noise figure of 3 dB
and 24 dB of image rejection across the frequency
band. The device utilizes an LNA followed by an image
reject mixer which is driven by an active x2 multiplier.
The image reject mixer eliminates the need for a filter
following the LNA, and removes thermal noise at the
image frequency. I and Q mixer outputs are provided
and an external 90° hybrid is needed to select the
required sideband. All data shown below is taken
with the chip mounted in a 50 Ohm test fixture and
includes the effects of 1 mil diameter x 20 mil length
bond wires on each port. This product is a much
smaller alternative to hybrid style image reject mixer
downconverter assemblies.
Electrical Specifications, TA = +25° C, IF = 100 MHz, LO = +4 dBm, Vdd = 3.5 Vdc*
Parameter
Frequency Range, RF
Frequency Range, LO
Frequency Range, IF
Conversion Gain (As IRM)
Noise Figure
Image Rejection
1 dB Compression (Input)
2 LO to RF Isolation
2 LO to IF Isolation
IP3 (Input)
Amplitude Balance
Phase Balance
Total Supply Current
*Data taken as IRM with external IF hybrid
Min.
9
19
-9
38
28
+2
Typ.
21.2 - 23.7
9 - 14
DC - 3.5
11
3
22
-6
45
32
+5
0.3
5
125
Max.
165
Min. Typ. Max.
21 - 25
9 - 14
DC - 3.5
8 11
3
19 24
-11 -8
38 45
28 32
-2 +5
0.7
5
125 165
Units
GHz
GHz
GHz
dB
dB
dB
dBm
dB
dB
dBm
dB
Deg
mA
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com

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HMC571 equivalent
Outline Drawing
3
v03.0808
HMC571
GaAs MMIC I/Q DOWNCONVERTER
21 - 25 GHz
3 - 142
Die Packaging Information [1]
Standard
Alternate
GP-1 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS 0.004”
3. BOND PAD METALIZATION: GOLD
4. BACKSIDE METALIZATION: GOLD
5. BACKSIDE METAL IS GROUND
6. OVERALL DIE SIZE ±0.002
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com


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Part Details

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