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부품번호 | KX-TG1070FXB 기능 |
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기능 | Digital Cordless Phone Service Manual | ||
제조업체 | Panasonic | ||
로고 | |||
ORDER NO. KM40610223CE
Telephone Equipment
KX-TG1070FXB
KX-TG1070FXC
KX-TG1072FXB
KX-TGA107EXB
KX-TGA107EXC
Digital Cordless Phone
Black Version
Blue Version
(for Central Europe)
© 2006 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and distribu-
tion is a violation of law.
KX-TG1070FXB/KX-TG1070FXC/KX-TG1072FXB/KX-TGA107EXB/KX-TGA107EXC
1 Safety Precautions
1.1. For Service Technicians
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil and ground them.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
2 Warning
2.1. Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2. About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
4
4페이지 4 Technical Descriptions
4.1. Block Diagram (Base Unit)
KX-TG1070FXB/KX-TG1070FXC/KX-TG1072FXB/KX-TGA107EXB/KX-TGA107EXC
7
7페이지 | |||
구 성 | 총 30 페이지수 | ||
다운로드 | [ KX-TG1070FXB.PDF 데이터시트 ] |
당사 플랫폼은 키워드, 제품 이름 또는 부품 번호를 사용하여 검색할 수 있는 |
구매 문의 | 일반 IC 문의 : 샘플 및 소량 구매 ----------------------------------------------------------------------- IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한 광범위한 전력 반도체를 판매합니다. 전력 반도체 전문업체 상호 : 아이지 인터내셔날 사이트 방문 : [ 홈페이지 ] [ 블로그 1 ] [ 블로그 2 ] |
부품번호 | 상세설명 및 기능 | 제조사 |
KX-TG1070FXB | Digital Cordless Phone Service Manual | Panasonic |
KX-TG1070FXC | Digital Cordless Phone Service Manual | Panasonic |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |