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KX-TG1070FXC 데이터시트 PDF




Panasonic에서 제조한 전자 부품 KX-TG1070FXC은 전자 산업 및 응용 분야에서
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기능 Digital Cordless Phone Service Manual
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KX-TG1070FXC 데이터시트, 핀배열, 회로
ORDER NO. KM40610223CE
Telephone Equipment
KX-TG1070FXB
KX-TG1070FXC
KX-TG1072FXB
KX-TGA107EXB
KX-TGA107EXC
Digital Cordless Phone
Black Version
Blue Version
(for Central Europe)
© 2006 Panasonic Communications Co., Ltd. All
rights reserved. Unauthorized copying and distribu-
tion is a violation of law.




KX-TG1070FXC pdf, 반도체, 판매, 대치품
KX-TG1070FXB/KX-TG1070FXC/KX-TG1072FXB/KX-TGA107EXB/KX-TGA107EXC
1 Safety Precautions
1.1. For Service Technicians
ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic parts boxes with aluminum foil and ground them.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch IC or LSI pins with bare fingers.
2 Warning
2.1. Battery Caution
1. Danger of explosion if battery is incorrectly replaced.
2. Replace only with the same or equivalent type recommended by the manufacturer.
3. Dispose of used batteries according to the manufacture’s Instructions.
2.2. About Lead Free Solder (Pbf: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin (Sn),
Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder.
Caution
• PbF solder has a melting point that is 50 °F ~ 70 °F (30 °C ~ 40 °C) higher than Pb solder. Please use a soldering iron with
temperature control and adjust it to 700 °F ± 20 °F (370 °C ± 10 °C).
• Exercise care while using higher temperature soldering irons.:
Do not heat the PCB for too long time in order to prevent solder splash or damage to the PCB.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100 °F (600 °C).
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See the figure below).
4

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KX-TG1070FXC 전자부품, 판매, 대치품
4 Technical Descriptions
4.1. Block Diagram (Base Unit)
KX-TG1070FXB/KX-TG1070FXC/KX-TG1072FXB/KX-TGA107EXB/KX-TGA107EXC
7

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구매 문의
일반 IC 문의 : 샘플 및 소량 구매
-----------------------------------------------------------------------

IGBT, TR 모듈, SCR 및 다이오드 모듈을 포함한
광범위한 전력 반도체를 판매합니다.

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관련 데이터시트

부품번호상세설명 및 기능제조사
KX-TG1070FXB

Digital Cordless Phone Service Manual

Panasonic
Panasonic
KX-TG1070FXC

Digital Cordless Phone Service Manual

Panasonic
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