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PDF DSC6001 Data sheet ( Hoja de datos )
| Número de pieza | DSC6001 | |
| Descripción | Ultra-Low Power MEMS Oscillator | |
| Fabricantes | Microchip | |
| Logotipo |  |
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DSC60XX
Ultra-Small, Ultra-Low Power MEMS Oscillator
Features
• Wide Frequency Range: 2 kHz to 80 MHz
• Ultra-Low Power Consumption: 1.3 mA/12 A
(Active/Stdby)
• Ultra-Small Footprints
- 1.6 mm 1.2 mm
- 2.0 mm 1.6 mm
- 2.5 mm 2.0 mm
- 3.2 mm 2.5 mm
• Frequency Select Input Supports 2 Predefined
Frequencies
• High Stability: ±25, ±50 ppm
• Wide Temperature Range
- Industrial: –40°C to 85°C
- Ext. Commercial: –20° to 70°C
• Excellent Shock & Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x Better MTF Than Quartz Oscillators
• Supply Range of 1.71V to 3.63V
• Short Sample Lead Time: <2 weeks
• Lead Free & RoHS Compliant
Applications
• Low Power/Portable Applications - IoT,
Embedded/Smart Devices
• Consumer - Home Healthcare, Fitness Devices,
Home Automation
• Automotive - Rear View/Surround View Cameras,
Infotainment System
• Industrial - Building/Factory Automation,
Surveillance Camera
General Description
The DSC60xx family of MEMS oscillators combines
industry-leading low-power consumption, ultra-small
packages with exceptional frequency stability, and jitter
performance over temperature. The single-output
DSC60xx MEMS oscillators are excellent choices for
use as clock references in small, battery-powered
devices such as wearable and Internet of Things (IoT)
devices in which small size, low power consumption,
and long-term reliability are paramount. They also meet
the stringent mechanical durability and reliability
requirements within Automotive Electronics Council
standard Q100 (AEC-Q100), so they are well suited for
under-hood applications as well.
The DSC60xx family is available in ultra-small
1.6 mm x 1.2 mm and 2.0 mm x 1.6 mm packages.
Other package sizes include: 2.5 mm x 2.0 mm and
3.2 mm x 2.5 mm. These packages are “drop-in”
replacements for standard 4-pin CMOS quartz crystal
oscillators.
Package Types
DSC60XX
3.2x2.5
DFN
Top View
DSC60XX
2.5x2.0
LGA
Top View
43
43
12
12
DSC60XX
2.0x1.6
LGA
Top View
43
DSC60XX
1.6x1.2
LGA
Top View
43
12
12
2016 Microchip Technology Inc.
DS20005625A-page 1
1 page  
DSC60XX
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Temperature Ranges
Junction Operating Temperature
Storage Temperature Range
Soldering Temperature
TJ
TA
TS
Min.
—
–55
—
Typ.
+150
—
+260
Max. Units
Conditions
—
+150
—
°C —
°C —
°C 40 Sec. Max.
2016 Microchip Technology Inc.
DS20005625A-page 5
5 Page 
DSC60XX
7.0 PACKAGING INFORMATION
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
(DATUM A)
D
N
(DATUM B)
NOTE 1
2X
0.05 C
2X
0.05 C
12
TOP VIEW
AB
E
C
SEATING
PLANE
A
(A3)
0.10 C
A1
SIDE VIEW
4X
0.08 C
b2
CH
1
3X b1
0.07 C A B
2 0.03 C
CH
NOTE 1
4X L
N
e
BOTTOM VIEW
e1
e1
2
Microchip Technology Drawing C04-1199A Sheet 1 of 2
2016 Microchip Technology Inc.
DS20005625A-page 11
11 Page | ||
| Páginas | Total 26 Páginas | |
| PDF Descargar | [ Datasheet DSC6001.PDF ] | |
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