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PDF DSC6112 Data sheet ( Hoja de datos )
| Número de pieza | DSC6112 | |
| Descripción | Ultra-Low Power MEMS Oscillator | |
| Fabricantes | Microchip | |
| Logotipo |  |
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DSC61XX
Ultra-Small, Ultra-Low Power MEMS Oscillator
Features
• Wide Frequency Range: 2 KHz to 100 MHz
• Ultra–Low Power Consumption: 3 mA/12 A
(Active/Standby)
• Ultra-Small Footprints
- 1.6 mm 1.2 mm
- 2.0 mm 1.6 mm
- 2.5 mm 2.0 mm
- 3.2 mm 2.5 mm
• Frequency Select Input Supports 2 Predefined
Frequencies
• High Stability: ±25, ±50 ppm
• Wide Temperature Range
- Industrial: –40°C to 85°C
- Ext. Commercial: –20° to 70°C
• Excellent Shock & Vibration Immunity
- Qualified to MIL-STD-883
• High Reliability
- 20x Better MTF Than Quartz Oscillators
• Supply Range of 1.71V to 3.63V
• Short Sample Lead Time: <2 weeks
• Lead Free & RoHS Compliant
Applications
• Low Power/portable Applications - IoT,
Embedded/smart Devices
• Consumer - Home Healthcare, Fitness Devices,
Home Automation
• Automotive - Rear View/surround View Cameras,
Infotainment System
• Industrial - Building/ Factory Automation,
Surveillance Camera
General Description
The DSC61xx family of MEMS oscillators combines the
industry leading low power consumption and
ultra-small packages with exceptional frequency
stability and jitter performance over temperature. The
single-output DSC61xx MEMS oscillators are excellent
choices for use as clock references in small,
battery-powered devices such as wearable and
Internet of Things (IoT) devices in which small size, low
power consumption, and long-term reliability are
paramount. They also meet the stringent mechanical
durability and reliability requirements within Automotive
Electronics Council standard Q100 (AEC-Q100), so
they are well suited for under-hood applications as well.
The DSC61xx family is available in ultra-small
1.6 mm x 1.2 mm and 2.0 mm x 1.6 mm packages.
Other package sizes include: 2.5 mm x 2.0 mm and
3.2 mm x 2.5 mm. These packages are “drop-in”
replacements for standard 4-pin CMOS quartz crystal
oscillators.
Package Types
DSC61XX
3.2x2.5
DFN
Top View
43
DSC61XX
2.5x2.0
LGA
Top View
43
12
12
DSC61XX
2.0x1.6
LGA
Top View
43
DSC61XX
1.6x1.2
LGA
Top View
43
12
12
2016 Microchip Technology Inc.
DS20005624A-page 1
1 page  
DSC61XX
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Temperature Ranges
Junction Operating Temperature
Storage Temperature Range
Soldering Temperature
TJ
TA
TS
Min.
—
–55
—
Typ.
+150
—
+260
Max. Units
Conditions
—
+150
—
°C —
°C —
°C 40 Sec. Max.
2016 Microchip Technology Inc.
DS20005624A-page 5
5 Page 
DSC61XX
7.0 PACKAGING INFORMATION
4-Lead VFLGA 1.6 mm x 1.2 mm Package Outline
4-Lead Very Thin Fine Pitch Land Grid Array (ARA) - 1.6x1.2 mm Body [VFLGA]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
(DATUM A)
D
N
(DATUM B)
NOTE 1
2X
0.05 C
2X
0.05 C
12
TOP VIEW
AB
E
C
SEATING
PLANE
A
(A3)
0.10 C
A1
SIDE VIEW
4X
0.08 C
b2
CH
1
3X b1
0.07 C A B
2 0.03 C
CH
NOTE 1
4X L
N
e
BOTTOM VIEW
e1
e1
2
Microchip Technology Drawing C04-1199A Sheet 1 of 2
2016 Microchip Technology Inc.
DS20005624A-page 11
11 Page | ||
| Páginas | Total 26 Páginas | |
| PDF Descargar | [ Datasheet DSC6112.PDF ] | |
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