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PDF EM44CM1688LBB Data sheet ( Hoja de datos )

Número de pieza EM44CM1688LBB
Descripción 1Gb Double DATA RATE 2 SDRAM
Fabricantes Eorex 
Logotipo Eorex Logotipo



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No Preview Available ! EM44CM1688LBB Hoja de datos, Descripción, Manual

Revision History
Revision 0.1 (Nov. 2010)
-First release.
EM44CM1688LBB
Nov. 2010
1/29
www.eorex.com

1 page




EM44CM1688LBB pdf
EM44CM1688LBB
Pin Description (Simplified)
Pin
J8,K8
L8
K2
M8,M3,M7,N2,
N8,N3,N7,P2,
P8,P3,M2,P7,
R2
L2,L3,L1
K9
K7, L7, K3
Name
CK,/CK
/CS
CKE
A0~A12
BA0, BA1,
BA2
ODT
/RAS, /CAS,
/WE
Function
(System Clock)
CK and CK are differential clock inputs. All address and control input
signals are sampled on the crossing of the positive edge of CK and
negative edge of CK. Output (read) data is referenced to the crossings
of CK and CK (both directions of crossing).
(Chip Select)
All commands are masked when CS is registered HIGH. CS provides
for external Rank selection on systems with multiple Ranks. CS is
considered part of the command code.
(Clock Enable)
CKE high activates and CKE low deactivates internal clock signals and
device input buffers and output drivers. Taking CKE low provides
Precharge Power-Down and Self- Refresh operation (all banks idle), or
Active Power-Down (row Active in any bank). CKE is synchronous for
power down entry and exit and for Self-Refresh entry. CKE is
asynchronous for Self-Refresh exit. CKE must be maintained high
throughout read and write accesses. Input buffers, excluding CK, CK,
ODT and CKE are disabled during Power Down. Input buffers,
excluding CKE are disabled during Self-Refresh.
(Address)
Provided the row address for Active commands and the column
address and Auto Precharge bit for Read/Write commands to select
one location out of the memory array in the respective bank. A10 is
sampled during a Precharge command to determine whether the
Precharge applies to one bank (A10 LOW) or all banks (A10 HIGH). If
only one bank is to be precharged, the bank is selected by BA0, BA1.
The address inputs also provide the op-code during Mode Register Set
commands.
(Bank Address)
BA0 – BA2 define to which bank an Active, Read, Write or Precharge
command is being applied. Bank address also determines if the mode
register or extended mode register is to be accessed during a MRS or
EMRS cycle.
(On Die Termination)
ODT (registered HIGH) enables termination resistance internal to the
DDR2 SDRAM. When enabled, ODT is applied to each DQ,
UDQS/UDQS, LDQS/LDQS, UDM, and LDM signal. The ODT pin will
be ignored if the Extended Mode Register (EMRS(1)) is programmed to
disable ODT.
(Command Inputs)
/RAS, /CAS and /WE (along with /CS) define the command being
entered.
Nov. 2010
5/29
www.eorex.com

5 Page





EM44CM1688LBB arduino
OCD Default Setting Table
Parameter
Output Impedance
Pull-up / Pull-down mismatch
Output Slew Rate
EM44CM1688LBB
Min. Typ.
12.6 18
0-
1.5 -
Max.
23.4
4
5.0
Units
V/ns
AC Operating Test Conditions
(VDD=1.8V±0.1V, TA=0°C ~70°C)
Symbol
VSWING (max.)
SLEW
VREF
Parameter
Input Signal Maximum Peak to Peak Swing
Input Signal Minimum Slew Rate
Input Reference Level
Value
1.0
1.0
0.5*VDDQ
Units
V
V/ns
V
AC Operating Test Conditions
Symbol
VID
VIX
VOX
VIH
VIH
VIL
VIL
Parameter
AC Differential Input Voltage
AC Differential Cross Point Input Voltage
AC Differential Cross Point Output Voltage
Input Logic High Voltage (DDR2-533)
Input Logic High Voltage (DDR2-667/800)
Input Logic High Voltage (DDR2-533)
Input Logic High Voltage (DDR2-667/800)
Min.
0.5
0.5*VDDQ-0.175
0.5*VDDQ-0.125
VREF+0.25
VREF+0.25
VSSQ-Vpeak
VSSQ-Vpeak
Max.
VDDQ+0.6
0.5*VDDQ+0.175
0.5*VDDQ+0.125
VDDQ+Vpeak
VDDQ+Vpeak
VREF-0.25
VREF-0.25
Units
V
V
V
V
V
V
V
Nov. 2010
11/29
www.eorex.com

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