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PDF MIC24053 Data sheet ( Hoja de datos )
| Número de pieza | MIC24053 | |
| Descripción | High-Efficiency Buck Regulator | |
| Fabricantes | Microchip | |
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MIC24053
12V, 9A High-Efficiency Buck Regulator with Hyper Speed Control
Features
• Hyper Speed Control® Architecture Enables:
- High Delta V Operation (VIN = 19V and VOUT
= 0.8V)
- Small Output Capacitance
• 4.5V to 19V Voltage Input
• 9A Output Current Capability, Up to 95%
Efficiency
• Adjustable Output from 0.8V to 5.5V
• ±1% Feedback Accuracy
• Any Capacitor Stable-Zero-to-High ESR
• 600 kHz Switching Frequency
• No External Compensation
• Power Good (PG) Output
• Foldback Current-Limit and “Hiccup Mode”
Short-Circuit Protection
• Supports Safe Startup into a Pre-Biased Load
• –40°C to +125°C Junction Temperature Range
• Available in 28-pin 5 mm x 6 mm QFN Package
Applications
• Servers, Workstations
• Routers, Switches, and Telecom Equipment
• Base Stations
General Description
The MIC24053 is a constant-frequency, synchronous
buck regulator featuring a unique adaptive on-time
control architecture. The MIC24053 operates over an
input supply range of 4.5V to 19V and provides a
regulated output of up to 9A of output current. The
output voltage is adjustable down to 0.8V with a
guaranteed accuracy of ±1%, and the device operates
at a switching frequency of 600 kHz.
The Hyper Speed Control® architecture allows for
ultra-fast transient response while reducing the output
capacitance and also makes (High VIN)/(Low VOUT)
operation possible. This adaptive tON ripple control
architecture combines the advantages of
fixed-frequency operation and fast transient response
in a single device.
The MIC24053 offers a full suite of features to ensure
protection of the IC during fault conditions. These
include undervoltage lockout to ensure proper
operation under power-sag conditions, internal
soft-start to reduce inrush current, foldback current
limit, “hiccup mode” short-circuit protection, and
thermal shutdown. An open-drain Power Good (PG)
pin is provided. pin is provided.
Typical Application Circuit
MIC24053
5x6 QFN
2.2μF
10k
PG
VIN
4.5V to 19V
10k
4.7μF
x2
EN
MIC24053
VDD
PVDD
BST
SGND
PG
VIN
PVIN
SW
CS
PGND
FB
EN
0.1μF
2.2μH
0.1μF
19.6k
2.49k 4.7nF
VOUT
1.8V/9A
100μFx2
2.00k
2015 Microchip Technology Inc.
DS20005668A-page 1
1 page  
MIC24053
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, PVIN = VIN = VEN = 12V, VBST – VSW = 5V; TA = 25°C. Bold
values indicate –40°C ≤ TJ ≤ +125°C
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Thermal Protection
Overtemperature Shutdown
— 160
—
°C TJ Rising
Overtemperature Shutdown
Hysteresis
— 15 — °C —
Note 1:
2:
3:
Specification for packaged product only.
Measured in test mode.
The maximum duty-cycle is limited by the fixed mandatory off-time (tOFF) of typically 300 ns.
2015 Microchip Technology Inc.
DS20005668A-page 5
5 Page 
MIC24053
100
95
90
85
80
75
70
65
60
55
50
0
VIN = 5V
369
OUTPUT CURRENT (A)
3.3V
2.5V
1.8V
1.5V
1.2V
1.0V
0.9V
0.8V
12
FIGURE 2-25:
Output Current.
Efficiency (VIN = 5V) vs.
4.0
3.5 VIN = 5V
3.0
2.5
2.0 VOUT = 3.3V
1.5
1.0
VOUT = 0.8V
0.5
0.0
0
1.5 3 4.5 6 7.5
OUTPUT CURRENT (A)
9
FIGURE 2-26:
IC Power Dissipation
(VIN = 5V) vs. Output Current.
100
80
60
40
20 VIN = 5V
VOUT = 1.8V
0
0 1.5 3 4.5 6 7.5 9
OUTPUT CURRENT (A)
FIGURE 2-27:
Die Temperature (VIN = 5V)
vs. Output Current (Note 1).
100
95 5.0V
90 3.3V
2.5V
85 1.8V
1.5V
80 1.2V
75 1.0V
0.9V
70 0.8V
65
60
55
50
0
VIN = 12V
2 4 6 8 10
OUTPUT CURRENT (A)
12
FIGURE 2-28:
Output Current.
Efficiency (VIN = 12V) vs.
4.0
VIN = 12V
3.5
3.0
2.5
VOUT = 5V
2.0
1.5
1.0
VOUT = 0.8V
0.5
0.0
0
1.5 3 4.5 6 7.5
OUTPUT CURRENT (A)
9
FIGURE 2-29:
IC Power Dissipation
(VIN = 12V) vs. Output Current.
14
12
0.8V
10
8
1.5V
6
4
VIN = 5V
2 VOUT = 0.8, 1.2, 1.5V
0
-50 -25 0 25 50 75 100 125
AMBIENT TEMPERATURE (°C)
FIGURE 2-30:
Thermal Derating vs.
Ambient Temperature (Note 1).
Note 1: Die Temperature: The temperature measurement was taken at the hottest point on the MIC24053 case
mounted on a 5in2, 4 layer, 0.62”, FR-4 PCB with 2oz finish copper weight per layer; see the Thermal Mea-
surements section. Actual results depend on the size of the PCB, ambient temperature, and proximity to
other heat-emitting components.
2015 Microchip Technology Inc.
DS20005668A-page 11
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet MIC24053.PDF ] | |
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