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RSD050N10FRA 데이터시트 PDF




ROHM Semiconductor에서 제조한 전자 부품 RSD050N10FRA은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


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부품번호 RSD050N10FRA 기능
기능 MOSFET ( Transistor )
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RSD050N10FRA 데이터시트, 핀배열, 회로
4V Drive Nch MOSFET
RSD050N10FRA
Structure
Silicon N-channel MOSFET
Features
1) Low on-resistance.
2) Fast switching speed.
3) Drive circuits can be simple.
3) Parallel use is easy.
Applications
Switching
AEC-Q101 Qualified
Dimensions (Unit : mm)
CPT3
(SC-63)
<SOT-428>
Packaging specifications
Package
Type Code
Basic ordering unit (pieces)
CPT3
TL
2500
Absolute maximum ratings (Ta=25°C)
Parameter
Symbol
Limits
Drain-source voltage
Gate-source voltage
Drain current
Continuous
Pulsed
Source current
(Body Diode)
Continuous
Pulsed
Power dissipation
Channel temperature
Range of storage temperature
VDSS
VGSS
ID
IDP *1
IS
ISP *1
PD *2
Tch
Tstg
100
20
5.0
20
5.0
20
15
150
55 to +150
*1 Pw10s, Duty cycle1%
*2 Tc=25°C
Unit
V
V
A
A
A
A
W
°C
°C
Inner circuit
1
(1) Gate
(2) Drain
(3) Source
2
*1 ESD Protection Diode
*2 Body Diode
(1) (2) (3)
Thermal resistance
Parameter
Channel to Case
* Tc=25C
Symbol
Rth (ch-c) *
Limits
8.33
Unit
°C / W
www.rohm.com
©2012 ROHM Co., Ltd. All rights reserved.
1/6
2012.02 - Rev.B




RSD050N10FRA pdf, 반도체, 판매, 대치품
RSD050N10FRA
Fig.7 Forward Transfer Admittance vs. Drain Current
100
VDS=10V
pulsed
10
Ta=125°C
1 Ta=75°C
Ta=25°C
Ta=-25°C
0.1
0.01
0.01
0.1 1
Drain Current : ID [A]
10
Fig.9 Source Current vs. Source-Drain Voltage
10
VGS=0V
pulsed
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.1
0.01
0.0
10000
1000
100
0.5 1.0
Source-Drain Voltage : VSD [V]
1.5
Fig.11 Switching Characteristics
tf
td(off)
VDD50V
VGS=10V
RG=10
Ta=25°C
Pulsed
10
1
0.01
td(on)
tr
0.1 1
Drain Current : ID [A]
10
  DataSheet
Fig.8 Typical Transfer Characteristics
10
VDS=10V
pulsed
1
Ta=125°C
Ta=75°C
0.1 Ta=25°C
Ta=-25°C
0.01
0.001
0.0
0.5 1.0 1.5 2.0 2.5 3.0
Gate-Source Voltage : VGS [V]
3.5
Fig.10 Static Drain-Source On-State Resistance vs.
Gate-Source Voltage
500
Ta=25°C
pulsed
400
300 ID=5.0A
ID=2.5A
200
100
0
0
2468
Gate-Source Voltage : VGS [V]
Fig.12 Dynamic Input Characteristics
10
Ta=25°C
VDD=50V
8
ID=5A
Pulsed
10
6
4
2
0
0 5 10 15 20
Total Gate Charge : Qg [nC]
www.rohm.com
© 2012 ROHM Co., Ltd. All rights reserved.
4/6
2012.02 - Rev.B

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RSD050N10FRA 전자부품, 판매, 대치품
Datasheet
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU CHINA
CLASS
CLASS
CLASS
CLASSb
CLASS
CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.001

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