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RSJ650N10FRA 데이터시트 PDF




ROHM Semiconductor에서 제조한 전자 부품 RSJ650N10FRA은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


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부품번호 RSJ650N10FRA 기능
기능 MOSFET ( Transistor )
제조업체 ROHM Semiconductor
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RSJ650N10FRA 데이터시트, 핀배열, 회로
4V Drive Nch MOSFET
RSJ650N10 FRA
z Structure
Silicon N-channel MOSFET
zFeatures
1) Low on-resistance.
2) High power package.
3) 4V drive.
Data Sheet
AEC-Q101 Qualified
z Dimensions (Unit : mm)
LPTS
10.1 4.5 1.3
1.24
2.54 0.78
5.08
(1) (2) (3)
0.4
2.7
z Application
Switching
z Packaging specifications
Package
Type Code
Basic ordering unit (pieces)
RSJ650N10 FRA
Taping
TL
1000
{
z Absolute maximum ratings (Ta = 25qC)
Parameter
Symbol
Limits
Drain-source voltage
Gate-source voltage
Drain current
Continuous
Pulsed
Source current
(Body Diode)
Continuous
Pulsed
Power dissipation
Channel temperature
Range of storage temperature
VDSS
VGSS
ID *3
IDP *1
IS *3
ISP *1
PD *2
Tch
Tstg
100
r20
r65
r130
65
130
100
150
55 to 150
*1 PWd10Ps, Duty cycled1%
*2 TC=25°C
*3 Please use within the range of SOA.
Unit
V
V
A
A
A
A
W
qC
qC
z Inner circuit
1
2
(1) Gate
(2) Drain
(3) Source
(1) (2) (3)
1 ESD PROTECTION DIODE
2 BODY DIODE
z Thermal resistance
Parameter
Channel to Case
* TC=25°C
Symbol Limits
Rth (ch-c)* 1.25
Unit
qC / W
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
1/6
20116.06 - Rev.A




RSJ650N10FRA pdf, 반도체, 판매, 대치품
RSJ650N10FRA
Data Sheet
Fig.7 Typical Transfer Characteristics
100
VDS=10V
pulsed
10
Ta=125rC
1 Ta=75rC
Ta=25rC
Ta=25rC
0.1
0.01
0.001
0.0
0.5 1.0 1.5 2.0 2.5 3.0
Gate-Source Voltage : VGS [V]
3.5
Fig.9 Static Drain-Source On-State Resistance vs. Gate-Source Voltage
20
Ta=25rC
pulsed
15 ID=50A
ID=32.5A
10
5
0
0
2468
Gate-Source Voltage : VGS [V]
Fig.11 Dynamic Input Characteristics
10
Ta=25rC
VDD=50V
8
ID=32.5A
Pulsed
10
6
4
2
0
0 50 100 150 200 250 300
Total Gate Charge : Qg [nC]
Fig.8 Source Current vs. Source-Drain Voltage
100
VGS=0V
pulsed
10
Ta=125rC
Ta=75rC
Ta=25rC
1 Ta=25rC
0.1
0.01
0.0
100000
10000
1000
0.5 1.0 1.5
Source-Drain Voltage : VSD [V]
2.0
Fig.10 Switching Characteristics
tf
td(off)
VDDҸ50V
VGS=10V
RG=10:
Ta=25rC
Pulsed
100
10
td(on) tr
1
0.01
0.1 1
Drain Current : ID [A]
10
100
100000
Fig.12 Typical Capacitance vs. Drain-Source Voltage
10000
Ciss
1000
100
Coss
Crss
Ta=25rC
f=1MHz
VGS=0V
10
0.01 0.1 1 10 100 1000
Drain-Source Voltage : VDS [V]
www.rohm.com
© 2011 ROHM Co., Ltd. All rights reserved.
4/6
20161.06 - Rev.A

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RSJ650N10FRA 전자부품, 판매, 대치품
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (Specific Applications), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHMs Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU CHINA
CLASS
CLASS
CLASS
CLASSb
CLASS
CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E
© 2015 ROHM Co., Ltd. All rights reserved.
Rev.003

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