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부품번호 | BL1005-05E2450B 기능 |
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기능 | Multilayer Chip Baluns | ||
제조업체 | Advanced Ceramic X | ||
로고 | |||
BL 1005 Series
Multilayer Chip Baluns
ACX
Advanced Ceramic X
Features
Monolithic SMD with small, low-profile and light-weight
type.
Applications
2.4 ~ 2.5 GHz wireless communication systems.
Specifications
Frequency Unbalanced Balance
Part Number Range
Impedance Impedance
(MHz)
(ohm)
(ohm)
Insertion
Loss
(dB)
BL1005-
05E2450_
2400 ~
2500
Q’ty/Reel (pcs)
Operating Temperature Range
Storage Temperature Range
Storage Period
Power Capacity
50 50 1.0 max.
: 10,000
: -40 ~ +85 oC
: +5 ~ +35 oC, Humidity 45~75%RH
: 12 months max.
: 2W max.
VSWR
@BW
Phase
Difference
(degree)
Amplitude
Difference
(dB)
2.0 max. 180 10 2 max.
Part Number
BL 1005 - 05 E 2450 /LF
Type
BL : Balun
Dimensions ( L × W ) 1.0 × 0.5 mm
Balanced Impedance 05 : 50 ohm
Specification Code
E
Central Frequency
Soldering
2450 : 2450MHz Packaging
=lead-containing
/LF=lead-free
T: Tape & Reel
B: Bulk
Terminal Configuration (Top View)
No. Terminal Name No. Terminal Name
Unbalanced Port
(IN)
Balanced Port
(OUT1)
Balanced Port
(OUT2)
GND
BL1005-05E2450T/LF REV:4 PAGE:1/8
Return Loss on Smith Chart
ACX
Advanced Ceramic X
freq (500.0MHz to 8.500GHz)
freq (2.400GHz to 2.500GHz)
freq (4.800GHz to 5.000GHz)
freq (500.0MHz to 8.500GHz)
freq (2.400GHz to 2.500GHz)
freq (4.800GHz to 5.000GHz)
Production Test Limit
Frequency Unbalanced Balance
Part Number Range
Impedance Impedance
(MHz)
(ohm)
(ohm)
BL1005-
05E2450_
2400 ~
2500
50
50
Insertion
Loss
(dB)
1.0 max.
VSWR
@BW
1.43 max.
Phase
Difference
(degree)
180 7
Amplitude
Difference
(Pin2/Pin3)
(dB)
1.5 max.
-1.5 min.
BL1005-05E2450T/LF REV:4 PAGE:4/8
4페이지 Mechanical & Environmental Characteristics
ACX
Advanced Ceramic X
Item
Requirements
Procedure
Solderability
1. No apparent damage
2. More than 95% of the terminal 1. Preheat: 120 5 oC
electrode shall be covered with 2. Solder: 245 5oC for 5 1 sec
new solder
Soldering strength
(Termination 1. 0.7kg minimum
Adhesion)
1. Solder specimen onto test jig.
2. Apply push force at 0.5mm/s until electrode pads
are peeled off or ceramic are broken. Pushing force
is applied to longitude direction
1. Solder specimen onto test jig (FR4, 0.8mm) using
the recommend soldering profile.
2. Apply a bending force of 2mm deflection
Deflection
1. No apparent damage
(Substrate Bending)
` R230
Pressure Rod
90mm
Heat/Humidity
Resistance
1.
2.
No apparent damage
Fulfill the electrical specification
after test
1.
2.
3.
4.
Temperature: 85 2oC
Humidity: 90% ~ 95% RH
Duration: 1000±48hrs
Recovery: 1-2hrs
Thermal shock
(Temperature Cycle)
1.
2.
1. One cycle/step 1:125 ± 5C for 30 min
No apparent damage
Fulfill the electrical specification
after test
2.
No
of
step 2:-
cycles:100
40
±
5C
for
30
min
3. Recovery:1-2 hrs
Low Temperature
Resistance
1.
2.
No apparent damage
1.
Fulfill the electrical specification 2.
after test
3.
Temperature: -40o 5 oC
Duration: 500 ±24hrs
Recovery: 1-2hrs
BL1005-05E2450T/LF REV:4 PAGE:7/8
7페이지 | |||
구 성 | 총 8 페이지수 | ||
다운로드 | [ BL1005-05E2450B.PDF 데이터시트 ] |
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부품번호 | 상세설명 및 기능 | 제조사 |
BL1005-05E2450B | Multilayer Chip Baluns | Advanced Ceramic X |
BL1005-05E2450T | Multilayer Chip Baluns | Advanced Ceramic X |
DataSheet.kr | 2020 | 연락처 | 링크모음 | 검색 | 사이트맵 |