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RWP15020-G1 데이터시트 PDF




RFHIC에서 제조한 전자 부품 RWP15020-G1은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


 

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부품번호 RWP15020-G1 기능
기능 Wideband Power Amplifier
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RWP15020-G1 데이터시트, 핀배열, 회로
Wideband Power Amplifier RWP15020-G1
Product Features
GaN on SiC Broadband High Power Amplifier
1000 to 2000MHz Operation Bandwidth
Small Signal Gain 27dB min
20W Typical. P3dB
Application
UHF/Military
Description
Package : DP-75
The power amplifier module is designed for Broadcasting, Telecommunication, Medical, Military and Other markets.
Operating frequency range is from 1000MHz to 2000MHz.
Gallium Nitride on SiC technology is used and attached on an aluminum sub carrier. Full in/out matching for broadband
performance is already applied.
Improved thermal handling by patented technology.
Typical Specifications
No Item
1 Bandwidth
2 Small Signal Gain
3 Gain Variation vs Temperature
4 Gain Variation vs Frequency
5 P3dB
OIP3 @ Po = +33dBm
6
(1MHz Tone spacing, CW 2-Tone)
7 Input Return Loss
8 Output Return Loss
9 2nd Harmonic suppression
10 Supply Voltage
11 Quiescent Current consumption
12 Current Consumption @ P3dB
13 On/Off Switching Time
Shut Down or Switch On/Off
14
TTL Voltage
Conditions
VCC = +28V; T = 25; ZS = ZL = 50
Min Typ Max Unit
1000
2000 MHz
27 29 31 dB
-20°C to 60°C
-2 +2 dB
±1 ±2 dBpp
1000MHz to 1200MHz
1200MHz to 2000MHz
41 43
42 44
dBm
1000MHz to 1600MHz
1600MHz to 2000MHz
48 50
46 48
dBm
-10 -6 dB
-10 -5 dB
CW 1-tone
@Po = +30dBm, Freq 1000MHz
-35 -28 dBc
Vcc(=Vds)
27.5 28 30 V
2.2 2.5
A
CW 1-tone
3.6 A
On : TTL "Low"
Off : TTL "High"(300mA@Disable)
3 5 uS
On : TTL “Low”(Enable)
Off : TTL “High”
0 0.5
V
2.5 5 5.5
Tel : 82-31-250-5078
www.rfhic.com/contact
All specifications may change without notice.
Version 1.1




RWP15020-G1 pdf, 반도체, 판매, 대치품
Wideband Power Amplifier RWP15020-G1
Precautions
1. This product is designed to be used for broadband amplification.
Heat generation is higher when there is no RF signal in the device. Therefore, the worst case scenario is when there is no
RF signal, and the amplifier is “on” with current draw. The temperature must be calculated properly.
Case temperature must maintain below 85°C.
2. Thermal Grease or Metal Thermal Interface Materials are recommended for heat dissipation.
An example would be spreading thermal grease on the bottom of the device.
Package Dimensions (Type: DP-75)
(Unit : mm/[inch], Tolerance : ±0.2/[.008])
20
[.787]
70
[2.756]
60
[2.362]
20
[.787]
38
[1.496] 15.6
50.8
[2]
[.616]
45
[1.772]
6.2
[.245]
6.9
[.273]
C
1
[.039]
17.1
[.673]
1.5
[.059]
7.3
[.288]
7.3
[.286]
6.9
[.273]
3.8
[.15]
5
[.197]
4.1
[.161]
38
[1.496]
50.8
[2]
70
[2.756]
60
[2.362]
'A'
4
[.156]
2.5
[.098]
4.5
[.177]
2
[.079]
1.5
[.059]
How to connect the amplifier to a target PCB
Method-І (with Pin)
Method-ΙІ (without Pin) - If you cut out the pin
Tel : 82-31-250-5078
www.rfhic.com/contact
All specifications may change without notice.
Version 1.1

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부품번호상세설명 및 기능제조사
RWP15020-G1

Wideband Power Amplifier

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