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ADRF6780 데이터시트 PDF




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부품번호 ADRF6780 기능
기능 Microwave Upconverter
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ADRF6780 데이터시트, 핀배열, 회로
Data Sheet
5.9 GHz to 23.6 GHz,
Wideband, Microwave Upconverter
ADRF6780
FEATURES
GENERAL DESCRIPTION
Wideband RF output frequency range: 5.9 GHz to 23.6 GHz
Two upconversion modes
Direct conversion from baseband I/Q to RF
Single sideband upconversion from real IF
LO input frequency range: 5.4 GHz to 14 GHz
LO doubler for up to 28 GHz
Matched 100 Ω balanced RF output, LO input, and IF input
High impedance baseband inputs
Sideband suppression and carrier feedthrough optimization
Variable attenuator and power detector for Tx power control
Programmable via 4-wire SPI interface
32-lead, 5 mm × 5 mm LFCSP microwave packaging
APPLICATIONS
Point to point microwave radios
Radar, electronic warfare systems
Instrumentation, automatic test equipment (ATE)
The ADRF6780 is a silicon germanium (SiGe) design, wideband,
microwave upconverter optimized for point to point microwave
radio designs operating in the 5.9 GHz to 23.6 GHz frequency
range.
The upconverter offers two modes of frequency translation. The
device is capable of direct conversion to radio frequency (RF)
from baseband I/Q input signals, as well as single sideband (SSB)
upconversion from a real intermediate frequency (IF) input
carrier frequency. The baseband inputs are high impedance and
are generally terminated off chip with 100 Ω differential back
terminations. The baseband I/Q input path can be disabled and
a modulated real IF signal anywhere from 0.8 GHz to 3.5 GHz can
fed into the IF input path and upconverted to 5.9 GHz to 23.6 GHz
while suppressing the unwanted sideband by typically better than
25 dBc. The serial port interface (SPI) allows tweaking of the
quadrature phase adjustment to allow optimum sideband
suppression. In addition, the SPI interface allows powering down
the output power detector to reduce power consumption when
power monitoring is not necessary.
The ADRF6780 upconverter comes in a compact, thermally
enhanced, 5 mm × 5 mm LFCSP package. The ADRF6780
operates over the −40°C to +85°C temperature range.
FUNCTIONAL BLOCK DIAGRAM
ALM VPLO LOIP AGND LOIN VPLO SEN SDTO
32 31 30 29 28 27 26 25
VDET 1
ADC
SPI 24 SCLK
VPDT 2
VPRF 3
LOG
DET
×1 ×2
BIAS
CONTROL
23 SDIN
22 VP18
AGND 4
21 VPBI
RFOP 5
AGND 6
VVA
QUAD
SPLITTER
BUFFER
20 IFIP
19 AGND
RFON 7
18 IFIN
AGND 8
ADRF6780 17 RST
9
VPRF
10
VATT
11
BBQN
12 13
BBQP BBIP
Figure 1.
14 15 16
BBIN VPBB PWDN
Rev. A
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibilityisassumedbyAnalogDevices for itsuse,nor foranyinfringementsofpatentsor other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarksandregisteredtrademarksarethepropertyoftheirrespectiveowners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
©2016 Analog Devices, Inc. All rights reserved.
Technical Support
www.analog.com




ADRF6780 pdf, 반도체, 판매, 대치품
Data Sheet
ADRF6780
SPECIFICATIONS
VPBB = VPBI = VPLO = 3.3 V, VP18 = 1.8 V, VPDT = VPRF = 5 V, TA = 25°C, LO = 0 dBm differential drive; baseband I/Q amplitude =
−15 dBm differential sine waves in quadrature with a 500 mV dc bias, baseband input termination with 100 Ω externally, IF amplitude =
−12 dBm differential sine waves, unless otherwise noted.
Table 1.
Parameter
RF OUTPUT FREQUENCY RANGE
LOCAL OSCILLATOR (LO) INPUT
FREQUENCY RANGE
LO AMPLITUDE RANGE
IF INPUT FREQUENCY RANGE
BASEBAND (BB) I/Q INPUT FREQUENCY
RANGE
I/Q MODULATOR PERFORMANCE
Modulator Voltage Gain
Output Noise Density
Output Third-Order Intercept (OIP3)
5.9 GHz to 10 GHz
10 GHz to 14 GHz
14 GHz to 20 GHz
20 GHz to 23.6 GHz
Fifth-Order Intermodulation Distortion
(IMD5)
Output Second-Order Intercept (OIP2)
5.9 GHz to 10 GHz
10 GHz to 14 GHz
14 GHz to 20 GHz
20 GHz to 23.6 GHz
Output 1 dB Compression Point (P1dB)
5.9 GHz to 10 GHz
10 GHz to 14 GHz
14 GHz to 20 GHz
20 GHz to 23.6 GHz
LO Feedthrough
Sideband Suppression
Test Conditions/Comments
Maximum gain at maximum gain setting
Minimum gain at minimum gain setting
Output carrier > −5 dBm
Output carrier > −14 dBm
Output carrier > −22.5 dBm
f1BB = 10 MHz, f2BB = 12 MHz, BB I/Q amplitude per
tone = −15 dBm sine waves in quadrature with a
500 mV dc bias, 10 dB gain setting
Min
5.9
5.4
−6
0.8
DC
10
f1 BB = 10 MHz, f2 BB = 12 MHz, baseband I/Q amplitude
per tone = −15 dBm sine waves in quadrature with a
500 mV dc bias, 10 dB gain setting
f1 BB = 10 MHz, f2 BB = 12 MHz, baseband I/Q amplitude
per tone = −15 dBm sine waves in quadrature with a
500 mV dc bias, 10 dB gain setting
At 10 dB gain setting
At maximum gain setting
At 10 dB gain setting
At maximum gain setting
At 10 dB gain setting
At maximum gain setting
At 10 dB gain setting
At maximum gain setting
At 10 dB gain setting (can be improved baseband dc
offset adjustment)
At 10 dB gain setting
Typ Max Unit
23.6 GHz
14 GHz
0 +6 dBm
3.5 GHz
750 MHz
13
−12
−147
−145
−136
dB
dB
dBc/Hz
dBc/Hz
dBc/Hz
24 dBm
25 dBm
27 dBm
27 dBm
65 dBm
65 dBm
65 dBm
66 dBm
50 dBm
10.5 dBm
11 dBm
11 dBm
12 dBm
10 dBm
12 dBm
10 dBm
11 dBm
−25 dBm
25 dBc
Rev. A | Page 3 of 35

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ADRF6780 전자부품, 판매, 대치품
ADRF6780
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage
VPDT, VPRF
VPBB, VPLO, VPBI
VP18
Maximum Junction Temperature
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering 60 sec)
Rating
6.5 V
4.3 V
2.3 V
150°C
−40°C to +85°C
−55°C to +125°C
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Data Sheet
THERMAL RESISTANCE
θJA is thermal resistance, junction to ambient (°C/W), and θJC is
thermal resistance, junction to case (°C/W).
Table 3. Thermal Resistance
Package Type
θJA1
32-Lead LFCSP
32.95
θJC1 Unit
1.14 °C/W
1 See JEDEC standard JESD51-2 for additional information on optimizing the
thermal impedance (printed circuit board (PCB) with 3 × 3 vias).
ESD CAUTION
Rev. A | Page 6 of 35

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Microwave Upconverter

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