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PDF ZSSC3027 Data sheet ( Hoja de datos )
| Número de pieza | ZSSC3027 | |
| Descripción | High-Resolution 16-Bit Sensor Signal Conditioner | |
| Fabricantes | IDT | |
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Low-Power, High-Resolution
16-Bit Sensor Signal Conditioner
ZSSC3027
Datasheet
Brief Description
The ZSSC3027 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Designed for high-resolution altimeter module
applications, the ZSSC3027 can perform offset,
span, and 1st and 2nd order temperature compen-
sation of the measured signal. Developed for correc-
tion of resistive bridge sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
The measured and corrected bridge values are
provided at the digital output pins, which can be
configured as I2C™* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP) run-
ning a correction algorithm. Calibration coefficients
are stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Pro-
gramming the ZSSC3027 is simple via the serial
interface. The IC-internal charge pump provides the
MTP programming voltage. The interface is used for
the PC-controlled calibration procedure, which pro-
grams the set of calibration coefficients in memory.
The ZSSC3027 provides accelerated signal process-
ing in order to support high-speed control, safety,
and real-time sensing applications. It complements
IDT’s ZSSC30x6 products.
Features
• Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing two-
segment analog-to-digital converter (ADC)
• Fully programmable gain amplifier accepting
sensors from 14 to 72 (linear factor)
• Internal auto-compensated temperature sensor
• Digital compensation of individual sensor offset;
1st and 2nd order digital compensation of sensor
gain as well as of 1st and 2nd order temperature
gain and offset drift
• Layout optimized for stacked-die bonding for
high-density chip-on-board assembly
• Typical sensor elements can achieve accuracy of
better than ±0.10% FSO** @ -40 to 85°C
Benefits
• Integrated 18-bit calibration math DSP
• Fully corrected signal at digital output
• One-pass calibration minimizes calibration costs
• No external trimming, filter, or buffering com-
ponents required
• Highly integrated CMOS design
• Excellent for low-voltage and low-power battery
applications
• Optimized for operation in calibrated resistive
sensor modules
Physical Characteristics
• Supply voltage range: 1.7 to 3.6V
• Operating mode current consumption:
930µA (typical)
• Sleep State current: 20nA (typical)
• Temperature resolution: <0.003K/LSB
• Operation temperatures: –40°C to +85°C
• Small die size
• Delivery options: die for wafer bonding
Available Support
• ZSSC3026 Evaluation Kit can be used to
evaluate ZSSC3027 capabilities
• Support Documentation
ZSSC3027 Application Example
* I2C™ is a trademark of NXP.
** FSO = Full Scale Output.
© 2016 Integrated Device Technology, Inc.
1
April 20, 2016
1 page  
ZSSC3027 Datasheet
List of Tables
Table 1.1
Table 1.2
Table 1.3
Table 1.4
Table 2.1
Table 2.2
Table 2.3
Table 2.4
Table 2.5
Table 2.6
Table 2.7
Table 2.8
Table 3.1
Table 3.2
Table 3.3
Table 3.4
Table 3.5
Table 3.6
Table 3.7
Table 3.8
Table 4.1
Maximum Ratings ............................................................................................................................6
Operating Conditions .......................................................................................................................6
Requirements for VDD Power-on Reset..........................................................................................7
Electrical Parameters.......................................................................................................................7
Amplifier Gain: Stage 1..................................................................................................................12
Amplifier Gain: Stage 2..................................................................................................................12
Gain Polarity ..................................................................................................................................13
MSB/LSB Segmentation Settings for Bridge Measurement ..........................................................14
MSB/LSB Segmentation Settings for Temperature Measurement................................................14
ADC Conversion Times for a Single A2D Conversion...................................................................14
Typical Conversion Times vs. Noise Performance for 16-Bit Results with Full Sensor Signal
Conditioning for AZBM, BM, AZTM, and TM .................................................................................15
ADC Offset Settings for the Measurement Configuration Register BM_config .............................16
SPI/I2C™ Commands ....................................................................................................................22
Get_Raw Commands ....................................................................................................................23
General Status Byte.......................................................................................................................24
Status Byte for Read Operations ...................................................................................................24
Status Byte for Write Operations ...................................................................................................24
Mode Status...................................................................................................................................25
Memory Status Word .....................................................................................................................30
MTP Memory Content Assignments ..............................................................................................31
Pad Assignments ...........................................................................................................................43
© 2016 Integrated Device Technology, Inc.
5
April 20, 2016
5 Page 
ZSSC3027 Datasheet
Figure 2.1 ZSSC3027 Functional Block Diagram
VDDB
VTP Temperature
Reference
VTN Sensor
AGND / CM
Generator
Vreg int
Bias Current
Generator
Voltage
Regulator
Power Ctr.
ZSSC3027
VDD
VSS
Sensor
Bridge
INP
INN
VSSB
Power-ON
Reset
Pre-
Amplifier
Clock
Generator Ring
Oscillator
A
D
16 Bit
System
Control
Unit
18-bit DSP Core
(Calculations,
Communication)
EOC
MTP
ROM
SPI
I²CTM
SCLK/SCL
SS
MOSI/SDA
MISO
SEL
The amplifier consists of two stages with programmable gain values. The 1/f noise and inherent offset are
suppressed by auto-zero and chopper stabilizer techniques. This auto-zero sequence is performed before each
bridge sensor and temperature measurement to compensate for the inherent offset of the amplifier.
The ZSSC3027 employs a 2-stage analog-to-digital converter (ADC) based on switched-capacitor technique with
inherit low-pass behavior and noise suppression. The programmable resolution from 10 to 16 bits provides
flexibility for adapting the conversion characteristics. To improve power supply noise suppression, the ADC uses
the bridge supply VDDB as its reference voltage.
The remaining IC-internal offset and the sensor element offset, i.e., the overall system offset for the amplifier and
ADC, can be canceled by an offset and auto-zero measurement, respectively.
The DSP accomplishes the auto-zero, span, and 1st and 2nd order temperature compensation of the measured
bridge signal. The correction coefficients are stored in the MTP memory.
The ZSSC3027 supports SPI and I2C™ interface communication for controlling the ZSSC3027, configuration, and
measurement result output.
© 2016 Integrated Device Technology, Inc.
11
April 20, 2016
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet ZSSC3027.PDF ] | |
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