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S70GL02GP 데이터시트 PDF




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부품번호 S70GL02GP 기능
기능 2 Gbit / 3V Page Mode S70GL-P MirrorBit Flash
제조업체 Cypress Semiconductor
로고 Cypress Semiconductor 로고


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S70GL02GP 데이터시트, 핀배열, 회로
S70GL02GP
2 Gbit, 3V Page Mode
S70GL-P MirrorBit® Flash
General Description
The Cypress S70GL02GP 2 Gbit Mirrorbit Flash device is fabricated on 90-nm process technology. This device offers a fast page
access time of 25 ns with a corresponding random access time of 110 ns. It features a Write Buffer that allows a maximum of 32
words/64 bytes to be programmed in one operation, resulting in faster effective programming time than standard single byte/word
programming algorithms. This makes the device an ideal product for today’s embedded applications that require higher density,
better performance and lower power consumption.
This document contains information for the S70GL02GP device, which is a dual die stack of two S29GL01GP die. For detailed
specifications, refer to the discrete die datasheet provided in Table 1.
Table 1. Affected Documents/Related Documents
Title
S29GL01GP, S29GL512P, S29GL256P, S29GL128P
1 Gbit, 512, 256, 128 Mbit, 3 V, Page Flash with 90 nm MirrorBit
Process Technology
Publication Number
002-00886
Distinctive Characteristics
Two 1024 Mbit (S29GL01GP) in a single 64-ball Fortified-
BGA package (see S29GL01P datasheet for full
specifications)
Single 3V read/program/erase (3.0V - 3.6V)
90 nm MirrorBit process technology
8-word/16-byte page read buffer
32-word/64-byte write buffer reduces overall programming
time for multiple-word writes
Secured Silicon Sector region
– 128-word/256-byte sector for permanent, secure
identification through an 8-word/16-byte random Electronic
Serial Number
– Can be programmed and locked at the factory or by the
customer
Uniform 64Kword/128KByte Sector Architecture
– S70GL02GP: two thousand forty-eight sectors
100,000 erase cycles per sector typical
20-year data retention typical
Offered Packages
– 64-ball Fortified BGA
Suspend and Resume commands for Program and Erase
operations
Write operation status bits indicate program and erase
operation completion
Unlock Bypass Program command to reduce programming
time
Support for Common Flash Interface (CFI)
Persistent and Password methods of Advanced Sector
Protection
WP#/ACC input
– Accelerates programming time (when VACC is applied) for
greater throughput during system production
– Protects first or last sector of each die, regardless of sector
protection settings
Hardware reset input (RESET#) resets device
Ready/Busy# output (RY/BY#) detects program or erase
cycle completion
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 002-01338 Rev. *D
• San Jose, CA 95134-1709 • 408-943-2600
Revised March 16, 2016




S70GL02GP pdf, 반도체, 판매, 대치품
S70GL02GP
1. Ordering Information
The ordering part number is formed by a valid combination of the following:
S70GL02GP
11 F F C R1 0
PACKING TYPE
0 = Tray (standard; see (Note 3)
2 = 7” Tape and Reel
3 = 13” Tape and Reel
MODEL NUMBER (VIO range, protection when WP# =VIL)
R1 = VIO = VCC = 3.0 to 3.6V, highest address sector protected
R2 = VIO = VCC = 3.0 to 3.6V, lowest address sector protected
TEMPERATURE RANGE
I = Industrial (–40 °C to +85 °C)
C = Commercial (0 °C to +85 °C)
PACKAGE MATERIALS SET
A = Pb (Note 1)
F = Pb-free
PACKAGE TYPE
F = Fortified Ball Grid Array, 1.0 mm pitch package
SPEED OPTION
11 = 110 ns
DEVICE NUMBER/DESCRIPTION
S70GL02GP
3.0V-only, 2048 Megabit (128 M x 16-Bit/256 M x 8-Bit) Page-Mode Flash Memory
Manufactured on 90 nm MirrorBit process technology
1.1 Recommended Combinations
Recommended Combinations table below list various configurations planned to be available in volume. The table below will be
updated as new combinations are released. Check with your local sales representative to confirm availability of specific
configuration not listed or to check on newly released combinations.
Base OPN
Speed (ns)
S29GL-P Recommended Combinations (Note 1)
Package and
Temperature
Model Number Packing Type
S70GL02GP
110
FFC, FAC (Note 2)
R1, R2
0, 2, 3 (Note 3)
Notes
1. Contact a local sales representative for availability.
2. BGA package marking omits leading “S29” and packing type designator from ordering part number.
3. Packing Type “0” is standard option.
Ordering Part Number
(x = Packing Type)
S70GL02GP11FFCR1x
S70GL02GP11FFCR2x
S70GL02GP11FACR1x
S70GL02GP11FACR2x
Document Number: 002-01338 Rev. *D
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S70GL02GP 전자부품, 판매, 대치품
S70GL02GP
2.2 LSE064—64 ball Fortified Ball Grid Array, 13 11 mm
Figure 2.2 LSE064—64-ball Fortified Ball Grid Array (FBGA), 13 x 11 mm
PACKAGE
JEDEC
LSE 064
N/A
DxE
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
n
Øb
eE
eD
SD / SE
13.00 mm x 11.00 mm
PACKAGE
MIN NOM MAX
--- --- 1.40
0.40 ---
---
0.79 --- 0.91
13.00 BSC.
11.00 BSC.
7.00 BSC.
7.00 BSC.
8
8
64
0.50 0.60 0.70
1.00 BSC.
1.00 BSC
0.50 BSC.
---
NOTE
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
Document Number: 002-01338 Rev. *D
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP95,
SECTION 4.3, SPP-010.
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
8. "+" INDICATES THE THEORETICAL CENTER OF
DEPOPULATED BALLS.
9 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3611 \ 16-038.15 \ 11.13.6
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관련 데이터시트

부품번호상세설명 및 기능제조사
S70GL02GP

2 Gbit / 3V Page Mode S70GL-P MirrorBit Flash

Cypress Semiconductor
Cypress Semiconductor
S70GL02GP

3.0 Volt-only Page Mode Flash Memory

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