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PDF NRVBB4030T4G Data sheet ( Hoja de datos )
| Número de pieza | NRVBB4030T4G | |
| Descripción | SWITCHMODE Power Rectifier | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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MBRB4030G,
NRVBB4030T4G
Preferred Device
SWITCHMODE
Power Rectifier
These state−of−the−art devices use the Schottky Barrier principle
with a proprietary barrier metal.
Features
Guardring for Stress Protection
Maximum Die Size
175C Operating Junction Temperature
Short Heat Sink Tab Manufactured − Not Sheared
AEC−Q101 Qualified and PPAP Capable
NRVBB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
All Packages are Pb−Free*
Mechanical Characteristics:
Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
Weight: 1.7 Grams (Approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads Readily Solderable
Device Meets MSL1 Requirements
ESD Ratings:
Machine Model = C (> 400 V)
Human Body Model = 3B (> 8000 V)
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
40 AMPERES, 30 VOLTS
D2PAK
CASE 418B
STYLE 3
1
4
3
MARKING DIAGRAM
AY WW
B4030G
AKA
A
Y
WW
B4030
G
AKA
= Assembly Location
= Year
= Work Week
= Device Code
= Pb−Free Package
= Diode Polarity
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Semiconductor Components Industries, LLC, 2012
January, 2012 − Rev. 7
1
Publication Order Number:
MBRB4030/D
1 page  
MBRB4030G, NRVBB4030T4G
PACKAGE DIMENSIONS
D2PAK 3
CASE 418B−04
ISSUE K
C
E
−B−
V
W
4
123
S
A
−T−
SEATING
PLANE
G
K
D 3 PL
0.13 (0.005) M T B M
H
VARIABLE
CONFIGURATION
ZONE
L
M
R
M
N
L
W
J
U
M
P
L
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
INCHES
DIM MIN MAX
A 0.340 0.380
B 0.380 0.405
C 0.160 0.190
D 0.020 0.035
E 0.045 0.055
F 0.310 0.350
G 0.100 BSC
H 0.080 0.110
J 0.018 0.025
K 0.090 0.110
L 0.052 0.072
M 0.280 0.320
N 0.197 REF
P 0.079 REF
R 0.039 REF
S 0.575 0.625
V 0.045 0.055
MILLIMETERS
MIN MAX
8.64 9.65
9.65 10.29
4.06 4.83
0.51 0.89
1.14 1.40
7.87 8.89
2.54 BSC
2.03 2.79
0.46 0.64
2.29 2.79
1.32 1.83
7.11 8.13
5.00 REF
2.00 REF
0.99 REF
14.60 15.88
1.14 1.40
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
F
VIEW W−W
1
FF
VIEW W−W
2
VIEW W−W
3
SOLDERING FOOTPRINT*
10.49
16.155
8.38
2X
1.016
2X
3.504
5.080
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
5
5 Page | ||
| Páginas | Total 6 Páginas | |
| PDF Descargar | [ Datasheet NRVBB4030T4G.PDF ] | |
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