(PDF) MPZ1608S221ATA00 Datasheet

Número de pieza	MPZ1608S221ATA00
Descripción	Chip Beads
Fabricantes	TDK
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No Preview Available ! MPZ1608S221ATA00 Applications Commercial Grade Feature Power Line Series MPZ Series / MPZ1608 Type Status Production 1 of 2 Creation Date :February 23 2015 Size Length(L) Width(W) Thickness(T) Recommended Land Pattern (A) Recommended Land Pattern (B) Recommended Land Pattern (C) Electrical Characteristics Impedance at 100MHz Rated Current DC Resistance [Max.] Other Operating Temp. Range (Including Self-Temp. Rise) Soldering Method AEC Q200 Packing Package Quantity Weight 1.60mm +/-0.15mm 0.80mm +/-0.15mm 0.80mm +/-0.15mm 0.60mm Nom. 0.80mm Nom. 0.80mm Nom. 220Ω +/-25% 2.2A 50mΩ -55 to 125degC Reflow, Iron Soldering No Punched (Paper)Taping [180mm Reel] 4000Pcs Min. 0.004g •This PDF document was created based on the data listed on the TDK Corporation website. •All speciﬁcations are subject to change without notice. Copyright(c) TDK Corporation. All rights reserved 1 page

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PDF MPZ1608S221ATA00 Data sheet ( Hoja de datos )