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5.0SMDJ100A 데이터시트 PDF : 부품 기능 및 핀배열

부품번호 5.0SMDJ100A
기능 Transient Voltage Suppression Diodes
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5.0SMDJ100A 데이터시트 및 5.0SMDJ100A PDF

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5.0SMDJ100A pdf, 반도체, 판매, 대치품
Transient Voltage Suppression Diodes
Surface Mount – 5000W > 5.0SMDJ series
Soldering Parameters
Reflow Condition
Lead–free assembly
- Temperature Min (Ts(min))
Pre Heat - Temperature Max (Ts(max))
- Time (min to max) (ts)
Average ramp up rate (LiquidusTemp
(TL) to peak
TS(max) to TL - Ramp-up Rate
Reflow
-Temperature (TL) (Liquidus)
- Time (min to max) (ts)
Peak Temperature (TP)
Time within 5°C of actual peak
Temperature (tp)
Ramp-down Rate
Time 25°C to peakTemperature (TP)
Do not exceed
150°C
200°C
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260+0/-5 °C
20 – 40 seconds
6°C/second max
8 minutes Max.
280°C
Physical Specifications
Weight
Case
Polarity
Terminal
0.007 ounce, 0.21 grams
JEDEC DO214AB. Molded plastic body
over glass passivated junction
Color band denotes positive end
(cathode) except Bidirectional.
Matte Tin-plated leads, Solderable per
JESD22-B102D
TP
TL
Ts(max)
Ts(min)
25˚C
Ramp-up
tp
tL
Critical Zone
TL to TP
ts
Preheat
Ramp-down
t 25˚C to Peak
Time (t)
Environmental Specifications
Temperature Cycle
Pressure Cooker
High Temp. Storage
HTRB
Thermal Shock
JESD22-A104
JESD 22-A102
JESD22-A103
JESD22-A108
JESD22-A106
Dimensions
DO-214AB (SMC J-Bend)
Cathode Band
AC
B
H
D
F
EG
DimJensions in Kinches and L(millimeters)
I
5.0SMDJ Series
Solder Pads
(all dimensions in mm)
Dimensions
A
B
C
D
E
F
G
H
I
J
K
L
Inches
Min Max
0.114
0.126
0.260
0.280
0.220
0.245
0.079
0.103
0.030
0.060
- 0.008
0.305
0.320
0.006
0.012
0.129
-
0.094
-
-
0.094
0.165
-
Millimeters
Min Max
2.900
3.200
6.600
7.110
5.590
6.220
2.060
2.620
0.760
1.520
- 0.203
7.750
8.130
0.152
0.305
3.300
-
2.400
-
-
2.400
4.200
-
4 ©2011 Littelfuse, Inc.
Revision: November 15, 2011, 16:49
Specifications are subject to change without notice.
Please refer to http://www.Littelfuse.com/series/5.0SSMDJ.html for current information.

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