BZD27B100P-M Datasheet PDF - Vishay
| Part Number | BZD27B100P-M | |
| Description | Zener Diodes | |
| Manufacturers | Vishay | |
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www.vishay.com
BZD27B-M Series
Vishay Semiconductors
Zener Diodes with Surge Current Specification
17249
PRIMARY CHARACTERISTICS
PARAMETER
VALUE
VZ range nom.
Test current IZT
VBR
VWM
PPPM
TJ max.
VZ specification
Int. construction
3.6 to 200
5 to 100
7.35 to 196
6.2 to 160
150
175
Pulse current
Single
Polarity
Uni-directional
UNIT
V
mA
V
V
W
°C
FEATURES
• Sillicon planar Zener diodes
Available
• Voltage range includes 43 breakdown
voltages from 3.6 V to 200 V with ± 2 %
for BZD27B-M Series
• Low profile surface-mount package
• Zener and surge current specification
• Low leakage current
• Excellent stability
• Meets MSL level 1, per J-STD-020,
LF maximum peak of 260 °C
• Meets JESD 201 class 2 whisker test
• ESD capability according to AEC-Q101:
human body model: > 8 kV
machine model: > 800 V
• Wave and reflow solderable
• AEC-Q101 qualified
• Base P/N-M3 - halogen-free, RoHS-compliant, and
commercial grade
• Base P/N-HM3 - halogen-free, RoHS-compliant, and
automotive grade (available on request)
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
ORDERING INFORMATION
DEVICE NAME
ORDERING CODE
BZD27B3V6P-M3-08 to BZD27B200P-M3-08
BZD27B-M Series
BZD27B3V6P-M3-18 to BZD27B200P-M3-18
TAPED UNITS PER REEL
3000 per 7" reel (8mm tape)
10 000 per 13" reel (8 mm tape)
MINIMUM ORDER QUANTITY
30 000/box
50 000/box
PACKAGE
PACKAGE NAME
DO-219AB (SMF)
WEIGHT
15 mg
MOLDING COMPOUND MOISTURE SENSITIVITY
FLAMMABILITY RATING
LEVEL
UL 94 V-0
MSL level 1
(according J-STD-020)
WHISKER TEST
ACC. JESD 201
Class 2
SOLDERING CONDITIONS
Peak temperature max. 260 °C
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
Power dissipation
Non repetitive peak surge power dissipation (2)
TL = 105 °C
TA = 30 °C (1)
100 μs square pulse
10/1000 μs waveform
Junction to lead
Junction to ambient air
Mounted on epoxy-glass PCB with
3 mm x 3 mm Cu pads ( 40 μm thick)
Ptot
Ptot
PZSM
PRSM
RthJL
RthJA
Junction temperature
Storage temperature range
Operating temperature range
Tj
Tstg
Top
Notes
(1) Mounted on epoxy-glass PCB with 3 mm x 3 mm Cu pads ( 40 μm thick)
(2) TJ = 25 °C prior to surge
VALUE
2300
800
300
150
30
180
175
-65 to +175
-65 to +175
UNIT
mW
mW
W
W
K/W
K/W
°C
°C
°C
Rev. 1.0., 29-Oct-15
1 Document Number: 85922
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
PACKAGE DIMENSIONS in millimeters (inches): DO-219AB (SMF)
0.85 (0.033)
0.35 (0.014)
BZD27B-M Series
Vishay Semiconductors
Detail Z
enlarged
2.9 (0.114)
2.7 (0.106)
3.9 (0.154)
3.5 (0.138)
1.08 (0.043)
0.88 (0.035)
Foot print recommendation:
1.3 (0.051)
1.3 (0.051)
Created - Date: 15. February 2005
Rev. 3 - Date: 13. March 2007
Document no.:S8-V-3915.01-001 (4)
17247
2.9 (0.114)
Rev. 1.0., 29-Oct-15
5 Document Number: 85922
For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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