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PDF MPC853T Data sheet ( Hoja de datos )
| Número de pieza | MPC853T | |
| Descripción | PowerPC processor | |
| Fabricantes | Freescale Semiconductor | |
| Logotipo |  |
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Hay una vista previa y un enlace de descarga de MPC853T (archivo pdf) en la parte inferior de esta página. Total 30 Páginas | ||
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Freescale Semiconductor
Advance Information
MPC853TEC
Rev. 1, 12/2004
MPC853T Hardware Specification
This hardware specification contains detailed information on the
power considerations, DC/AC electrical characteristics, and AC
timing specifications of the MPC853T. The MPC853T contains a
PowerPC™ processor core.
This hardware specification describes pertinent electrical and
physical characteristics of the MPC853T. For the functional
characteristics of the processor, refer to the MPC866
PowerQUICC™ Family User’s Manual (MPC866UM).
1 Overview
The MPC853T PowerQUICC™ is a 0.18-micron derivative of the
MPC860 PowerQUICC family. It can operate at up to 100 MHz on
the MPC8xx core with a 66-MHz external bus. The MPC853T has
a 1.8-V core and 3.3-V I/O operation with 5-V TTL compatibility.
The MPC853T integrated communications controller is a versatile
one-chip integrated microprocessor and peripheral combination
that can be used in a variety of controller applications. It
particularly excels in Ethernet control applications, including CPE
equipment, Ethernet routers and hubs, VoIP clients, and Wi-Fi
access points.
The MPC853T is a PowerPC architecture-based derivative of
Freescale's MPC860 quad integrated communications controller
(PowerQUICC). The CPU on the MPC853T has a MPC8xx core,
a 32-bit microprocessor that implements the PowerPC architecture
Contents
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3. Maximum Tolerated Ratings . . . . . . . . . . . . . . . . . . . 6
4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . 7
5. Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
6. DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
7. Thermal Calculation and Measurement . . . . . . . . . . . 9
8. Power Supply and Power Sequencing . . . . . . . . . . . 11
9. Mandatory Reset Configurations . . . . . . . . . . . . . . . 12
10. Layout Practices . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
11. Bus Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 13
12. IEEE 1149.1 Electrical Specifications . . . . . . . . . . . 42
13. CPM Electrical Characteristics . . . . . . . . . . . . . . . . . 44
14. FEC Electrical Characteristics . . . . . . . . . . . . . . . . . 63
15. Mechanical Data and Ordering Information . . . . . . . 67
16. References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
17. Document Revision History . . . . . . . . . . . . . . . . . . . 84
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
© Freescale Semiconductor, Inc., 2004. All rights reserved.
1 page  
Features
Embedded
MPC8xx
Processor
Core
Instruction
4-Kbyte
Bus Instruction Cache
Instruction MMU
32-Entry ITLB
Load/Store 4-Kbyte
Bus Data Cache
Data MMU
32-Entry DTLB
Fast Ethernet
Controller
DMAs
Unified
Bus
System Interface Unit (SIU)
Memory Controller
Internal
External
Bus Interface Bus Interface
Unit Unit
System Functions
PCMCIA-ATA Interface
FIFOs
10/100
BaseT
Media Access
Control
MII
Parallel I/O
2 Baud Rate
Generators
2 Interrupt 8-Kbyte
Timers Controllers Dual-Port RAM
32-Bit RISC Controller
and Program
Timers
ROM
1 Virtual
IDMA
&
8 Serial
DMA
Channels
SCC3 SCC4 SMC1 SPI
Time-Slot Assigner
Serial Interface (NMSI)
Figure 1. MPC853T Block Diagram
Freescale Semiconductor
MPC853T Hardware Specification, Rev. 1
5
5 Page 
Power Supply and Power Sequencing
7.5 Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the thermal
characterization parameter (ΨJT) can be used. It determines the junction temperature with a measurement of the
temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
ΨJT = thermal characterization parameter
TT = thermocouple temperature on top of package
PD = power dissipation in package
The thermal characterization parameter is measured per the JESD51-2 specification published by JEDEC using a 40
gauge type T thermocouple epoxied to the top center of the package case. The thermocouple should be positioned
so that the thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple
junction and over about 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the
package case to avoid measurement errors caused by cooling effects of the thermocouple wire.
8 Power Supply and Power Sequencing
This section provides design considerations for the MPC853T power supply. The MPC853T has a core voltage
(VDDL) and PLL voltage (VDDSYN), which both operate at lower voltages than the I/O voltage VDDH. The I/O
section of the MPC853T is supplied with 3.3 V across VDDH and VSS (GND).
The signals PA[0:3], PA[8:11], PB15, PB[24:25]; PB[28:31], PC[4:7], PC[12:13], PC15] PD[3:15], TDI, TDO,
TCK, TRST, TMS, MII_TXEN, and MII_MDIO are 5-V tolerant. All inputs cannot be more than 2.5 V greater than
VDDH. In addition, 5-V tolerant pins can not exceed 5.5 V, and remaining input pins cannot exceed 3.465 V. This
restriction applies to power up/down and normal operation.
One consequence of multiple power supplies is that when power is initially applied, the voltage rails ramp up at
different rates. The rates depend on the nature of the power supply, the type of load on each power supply, and the
manner in which different voltages are derived. The following restrictions apply:
• VDDL must not exceed VDDH during power up and power down.
• VDDL must not exceed 1.9 V, and VDDH must not exceed 3.465 V.
These cautions are necessary for the long-term reliability of the part. If they are violated, the electrostatic discharge
(ESD) protection diodes are forward-biased, and excessive current can flow through these diodes. If the system
power supply design does not control the voltage sequencing, the circuit shown in Figure 2 can be added to meet
these requirements. The MUR420 Schottky diodes control the maximum potential difference between the external
bus and core power supplies on power up and the 1N5820 diodes regulate the maximum potential difference on
power down.
Freescale Semiconductor
MPC853T Hardware Specification, Rev. 1
11
11 Page | ||
| Páginas | Total 30 Páginas | |
| PDF Descargar | [ Datasheet MPC853T.PDF ] | |
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