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PDF MBT3946DW1T1 Data sheet ( Hoja de datos )
| Número de pieza | MBT3946DW1T1 | |
| Descripción | Dual General Purpose Transistor | |
| Fabricantes | ON Semiconductor | |
| Logotipo |  |
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MBT3946DW1T1
Dual General Purpose
Transistor
The MBT3946DW1T1 device is a spin−off of our popular
SOT−23/SOT−323 three−leaded device. It is designed for general
purpose amplifier applications and is housed in the SOT−363−6
surface mount package. By putting two discrete devices in one
package, this device is ideal for low−power surface mount
applications where board space is at a premium.
• hFE, 100−300
• Low VCE(sat), ≤ 0.4 V
• Simplifies Circuit Design
• Reduces Board Space
• Reduces Component Count
• Available in 8 mm, 7−inch/3,000 Unit Tape and Reel
• Device Marking: MBT3946DW1T1 = 46
• Pb−Free Package May be Available. The G−Suffix Denotes a
Pb−Free Lead Finish
MAXIMUM RATINGS
Rating
Collector −Emitter Voltage
(NPN)
(PNP)
Collector −Base Voltage
(NPN)
(PNP)
Emitter −Base Voltage
(NPN)
(PNP)
Collector Current − Continuous
(NPN)
(PNP)
Electrostatic Discharge
Symbol
VCEO
VCBO
VEBO
IC
ESD
Value
40
−40
60
−40
6.0
−5.0
200
−200
HBM>16000,
MM>2000
Unit
Vdc
Vdc
Vdc
mAdc
V
THERMAL CHARACTERISTICS
Characteristic
Total Package Dissipation (Note 1)
TA = 25°C
Thermal Resistance
Junction−to−Ambient
Junction and Storage
Temperature Range
Symbol
PD
RqJA
TJ, Tstg
Max
150
833
−55 to +150
Unit
mW
°C/W
°C
1. Device mounted on FR4 glass epoxy printed circuit board using the minimum
recommended footprint.
© Semiconductor Components Industries, LLC, 2004
January, 2004 − Rev. 2
1
http://onsemi.com
(3) (2) (1)
Q1 Q2
(4) (5)
(6)
MBT3946DW1T1*
*Q1 PNP
Q2 NPN
6 54
1
23
SOT−363−6/SC−88
CASE 419B
Style 1
MARKING
DIAGRAM
46d
46 = Specific Device Code
d = Date Code
ORDERING INFORMATION
Device
Package
Shipping†
MBT3946DW1T1 SOT−363 3000/Tape & Reel
MBT3946DW1T1G SOT−363 3000/Tape & Reel
MBT3946DW1T2 SOT−363 3000/Tape & Reel
MBT3946DW1T2G SOT−363 3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
MBT3946DW1T1/D
1 page  
MBT3946DW1T1
(NPN)
500 500
300
200
IC/IB = 10
300
200
VCC = 40 V
IC/IB = 10
100
70 tr @ VCC = 3.0 V
50
30 40 V
20
10 (NPN)
7
5
1.0 2.0 3.0
15 V
td @ VOB = 0 V
2.0 V
5.0 7.0 10
20 30 50 70 100
200
IC, COLLECTOR CURRENT (mA)
Figure 5. Turn −On Time
500
300
200 IC/IB = 20
IC/IB = 10
t′s = ts − 1/8 tf
IB1 = IB2
100
70
50 IC/IB = 20
30 IC/IB = 10
20
100
70
50
30
20
10 (NPN)
7
5
1.0 2.0 3.0
5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
Figure 6. Rise Time
200
500
300 VCC = 40 V
200 IB1 = IB2
IC/IB = 20
100
70
50
30 IC/IB = 10
20
10 (NPN)
7
5
1.0 2.0 3.0
5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
Figure 7. Storage Time
200
10 (NPN)
7
5
1.0 2.0 3.0
5.0 7.0 10
20 30 50 70 100
IC, COLLECTOR CURRENT (mA)
Figure 8. Fall Time
200
TYPICAL AUDIO SMALL−SIGNAL CHARACTERISTICS
NOISE FIGURE VARIATIONS
(VCE = 5.0 Vdc, TA = 25°C, Bandwidth = 1.0 Hz)
12
SOURCE RESISTANCE = 200 W
10 IC = 1.0 mA
8 SOURCE RESISTANCE = 200 W
IC = 0.5 mA
6 SOURCE RESISTANCE = 1.0 k
IC = 50 mA
4
2 SOURCE RESISTANCE = 500 W
IC = 100 mA
0
0.1 0.2 0.4
1.0 2.0 4.0
(NPN)
10 20
f, FREQUENCY (kHz)
40
Figure 9. Noise Figure
100
14
12 f = 1.0 kHz IC = 1.0 mA
10 IC = 0.5 mA
8
6
IC = 50 mA
IC = 100 mA
4
2
0
0.1 0.2
(NPN)
0.4 1.0 2.0 4.0 10 20
RS, SOURCE RESISTANCE (k OHMS)
Figure 10. Noise Figure
40
100
http://onsemi.com
5
5 Page 
MBT3946DW1T1
PACKAGE DIMENSIONS
SOT−363−6/SC−88
CASE 419B−02
ISSUE L
A
G
654
S −B−
123
D 6 PL
C
0.2 (0.008) M B M
N
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD 419B−02.
INCHES
DIM MIN MAX
A 0.071 0.087
B 0.045 0.053
C 0.031 0.043
D 0.004 0.012
G 0.026 BSC
H −−− 0.004
J 0.004 0.010
K 0.004 0.012
N 0.008 REF
S 0.079 0.087
MILLIMETERS
MIN MAX
1.80 2.20
1.15 1.35
0.80 1.10
0.10 0.30
0.65 BSC
−−− 0.10
0.10 0.25
0.10 0.30
0.20 REF
2.00 2.20
STYLE 1:
PIN 1. EMITTER 2
2. BASE 2
3. COLLECTOR 1
4. EMITTER 1
5. BASE 1
6. COLLECTOR 2
HK
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.40
0.0157
0.65
0.025
1.9
0.0748
ǒ ǓSCALE 20:1
mm
inches
Figure 35. SC−88/SC70−6
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
11
11 Page | ||
| Páginas | Total 12 Páginas | |
| PDF Descargar | [ Datasheet MBT3946DW1T1.PDF ] | |
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