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MMBV3401LT1 데이터시트 PDF




ON Semiconductor에서 제조한 전자 부품 MMBV3401LT1은 전자 산업 및 응용 분야에서
광범위하게 사용되는 반도체 소자입니다.


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부품번호 MMBV3401LT1 기능
기능 Silicon Pin Diode
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MMBV3401LT1 데이터시트, 핀배열, 회로
ON Semiconductort
Silicon Pin Diode
This device is designed primarily for VHF band switching
applications but is also suitable for use in general–purpose switching
circuits. Supplied in a Surface Mount package.
Rugged PIN Structure Coupled with Wirebond Construction
for Optimum Reliability
Low Capacitance 0.7 pF (Typ) at VR = 20 Vdc
Very Low Series Resistance at 100 MHz 0.34 Ohms (Typ)
@ IF = 10 mAdc
MAXIMUM RATINGS
Rating
Reverse Voltage
Forward Power Dissipation @ TA = 25°C
Derate above 25°C
Junction Temperature
Storage Temperature Range
Symbol
VR
PD
TJ
Tstg
Value
35
200
2.0
+125
–55 to +150
MMBV3401LT1
ON Semiconductor Preferred Device
Unit
Vdc
mW
mW/°C
°C
°C
3
1
2
CASE 318–08, STYLE 8
SOT–23 (TO–236AB)
3
Cathode
1
Anode
DEVICE MARKING
MMBV3401LT1 = 4D
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max Unit
Reverse Breakdown Voltage
(IR = 10 µAdc)
V(BR)R
35
— Vdc
Diode Capacitance
(VR = 20 Vdc)
CT — — 1.0 pF
Series Resistance (Figure 5)
(IF = 10 mAdc, f = 100 MHz)
RS — — 0.7
Reverse Leakage Current
(VR = 25 Vdc)
IR — — 0.1 µAdc
Preferred devices are ON Semiconductor recommended choices for future use and best overall value.
© Semiconductor Components Industries, LLC, 2001
September, 2001 – Rev. 3
1
Publication Order Number:
MMBV3401LT1/D




MMBV3401LT1 pdf, 반도체, 판매, 대치품
MMBV3401LT1
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 7 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can
affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177–189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
200°C
150°C
100°C
STEP 1
PREHEAT
ZONE 1
RAMP"
STEP 2
VENT
SOAK"
STEP 3
HEATING
ZONES 2 & 5
RAMP"
STEP 4
STEP 5
HEATING HEATING
ZONES 3 & 6 ZONES 4 & 7
SOAK"
SPIKE"
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
160°C
170°C
150°C
STEP 6 STEP 7
VENT COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
50°C
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 5. Typical Solder Heating Profile
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MMBV3401LT1 전자부품, 판매, 대치품
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MMBV3401LT1
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