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부품번호 | BZX84B8V2LT1G 기능 |
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기능 | Zener Voltage Regulators | ||
제조업체 | ON Semiconductor | ||
로고 | |||
전체 8 페이지수
BZX84B4V7LT1,
BZX84C2V4LT1 Series
Zener Voltage Regulators
225 mW SOT−23 Surface Mount
This series of Zener diodes is offered in the convenient, surface
mount plastic SOT−23 package. These devices are designed to provide
voltage regulation with minimum space requirement. They are well
suited for applications such as cellular phones, hand held portables,
and high density PC boards.
Specification Features
• Pb−Free Packages are Available
• 225 mW Rating on FR−4 or FR−5 Board
• Zener Breakdown Voltage Range − 2.4 V to 75 V
• Package Designed for Optimal Automated Board Assembly
• Small Package Size for High Density Applications
• ESD Rating of Class 3 (>16 KV) per Human Body Model
• Tight Tolerance Series Available (See Page 4)
Mechanical Characteristics
CASE: Void-free, transfer-molded, thermosetting plastic case
FINISH: Corrosion resistant finish, easily Solderable
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds
POLARITY: Cathode indicated by polarity band
FLAMMABILITY RATING: UL 94 V−0
MAXIMUM RATINGS
Rating
Symbol Max Unit
Total Power Dissipation on FR−5 Board,
(Note 1) @ TA = 25°C
Derated above 25°C
Thermal Resistance, Junction−to−Ambient
Total Power Dissipation on Alumina
Substrate, (Note 2) @ TA = 25°C
Derated above 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage
Temperature Range
PD
RqJA
PD
RqJA
TJ, Tstg
225 mW
1.8 mW/°C
556 °C/W
300
2.4
417
−65 to
+150
mW
mW/°C
°C/W
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. FR−5 = 1.0 X 0.75 X 0.62 in.
2. Alumina = 0.4 X 0.3 X 0.024 in., 99.5% alumina.
http://onsemi.com
3
Cathode
1
Anode
1
2
3
SOT−23
CASE 318
STYLE 8
MARKING DIAGRAM
xxxM
xxx = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device*
Package
Shipping†
BZX84CxxxLT1 SOT−23 3000/Tape & Reel
BZX84CxxxLT1G SOT−23 3000/Tape & Reel
(Pb−Free)
BZX84CxxxLT3
BZX84BxxxLT1
SOT−23 10,000/Tape & Reel
SOT−23 3000/Tape & Reel
BZX84BxxxLT1G SOT−23 3000/Tape & Reel
(Pb−Free)
BZX84BxxxLT3 SOT−23 10,000/Tape & Reel
*The “T1” suffix refers to an 8 mm, 7 inch reel.
The “T3” suffix refers to an 8 mm, 13 inch reel.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking
column of the Electrical Characteristics table on page 3 of
this data sheet.
© Semiconductor Components Industries, LLC, 2004
June, 2004 − Rev. 7
1
Publication Order Number:
BZX84C2V4LT1/D
BZX84B4V7LT1, BZX84C2V4LT1 Series
ELECTRICAL CHARACTERISTICS − BZX84BxxxL (Tight Tolerance Series)
(Pinout: 1-Anode, 2-No Connection, 3-Cathode) (TA = 25°C unless otherwise noted, VF = 0.90 V Max. @ IF = 10 mA)
Device
Device
Marking
VZ (Volts) @ IZT = 5 mA
(Note 4)
Min Nom Max
ZZT (W) @
IZT = 5 mA
(Note 4)
Max
Max Reverse
Leakage
Current
IR VR
@
mA Volts
qVZ
(mV/k)
@ IZT = 5 mA
Min Max
BZX84B4V7LT1
T10
4.61 4.7 4.79
80
3
2
−3.5
0.2
BZX84B5V1LT1
T11
5.00 5.1 5.20
60
2
2
−2.7
1.2
BZX84B5V6LT1
T12
5.49 5.6 5.71
40
1 2 −2 2.5
BZX84B6V2LT1, G*
T13
6.08 6.2 6.32
10
3 4 0.4 3.7
BZX84B6V8LT1, G*
T14
6.66 6.8 6.94
15
2 4 1.2 4.5
BZX84B7V5LT1
T15
7.35 7.5 7.65
15
1 5 2.5 5.3
BZX84B8V2LT1, G*
T16
8.04 8.2 8.36
15
0.7 5 3.2 6.2
BZX84B9V1LT1, G*
T17
8.92 9.1 9.28
15
0.5 6 3.8 7
BZX84B16LT1
T19
15.7 16 16.3
40
0.05
11.2 10.4
14
BZX84B18LT1
T20
17.6 18 18.4
45
0.05
12.6
12.4
16
4. Zener voltage is measured with a pulse test current IZ at an ambient temperature of 25°C.
* The “G” suffix indicates Pb−Free package available.
C (pF)
@ VR =0,
f = 1 MHz
260
225
200
185
155
140
135
130
105
100
http://onsemi.com
4
4페이지 BZX84B4V7LT1, BZX84C2V4LT1 Series
PACKAGE DIMENSIONS
SOT−23
TO−236AB
CASE 318−09
ISSUE AH
A
L
3
12
BS
V
D
G
H
C
KJ
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIUMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. 318−01, −02, AND −06 OBSOLETE, NEW
STANDARD 318−09.
INCHES
DIM MIN MAX
A 0.1102 0.1197
B 0.0472 0.0551
C 0.0385 0.0498
D 0.0140 0.0200
G 0.0670 0.0826
H 0.0040 0.0098
J 0.0034 0.0070
K 0.0180 0.0236
L 0.0350 0.0401
S 0.0830 0.0984
V 0.0177 0.0236
MILLIMETERS
MIN MAX
2.80 3.04
1.20 1.40
0.99 1.26
0.36 0.50
1.70 2.10
0.10 0.25
0.085 0.177
0.45 0.60
0.89 1.02
2.10 2.50
0.45 0.60
STYLE 8:
PIN 1.
2.
3.
ANODE
NO CONNECTION
CATHODE
SOLDERING FOOTPRINT*
0.95
0.037
0.95
0.037
0.9
0.035
2.0
0.079
0.8
0.031
ǒ ǓSCALE 10:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7
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