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PDF SSF1010A Data sheet ( Hoja de datos )

Número de pieza SSF1010A
Descripción MOSFET ( Transistor )
Fabricantes Silikron 
Logotipo Silikron Logotipo



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No Preview Available ! SSF1010A Hoja de datos, Descripción, Manual

                                
Main Product Characteristics:
VDSS
100V
RDS(on) 9.5mohm(typ.)
ID 100A
Features and Benefits:
D2PAK 
Advanced trench MOSFET process technology
Special designed for PWM, load switching and
general purpose applications
Ultra low on-resistance with low gate charge
Fast switching and reverse body recovery
175operating temperature
SSF1010A 
 
Marking and pin
Assignment 
Schematic diagram 
 
 
 
Description:
It utilizes the latest trench processing techniques to achieve the high cell density and reduces the
on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely
efficient and reliable device for use in power switching application and a wide variety of other applications 
Absolute max Rating:
Symbol
ID @ TC = 25°C
ID @ TC = 100°C
IDM
PD @TC = 25°C
VDS
VGS
EAS
IAS
TJ TSTG
Parameter
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Drain-Source Voltage
Gate-to-Source Voltage
Single Pulse Avalanche Energy @ L=1.28mH
Avalanche Current @ L=1.28mH
Operating Junction and Storage Temperature Range
Max.
100
70
400
205
1.3
100
± 20
576
30
-55 to + 175
Units
A
W
W/°C
V
V
mJ
A
°C
©Silikron Semiconductor CO.,LTD.
2011.05.25
www.silikron.com 
Version : 2.2
page 1 of 8

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SSF1010A pdf
                                
Typical electrical and thermal characteristics 
SSF1010A 
 
 
 
 
 
 
Figure 5. Maximum Drain Current Vs. Case
 
Temperature
 
 
 
 
 
Figure 6.Typical Capacitance Vs. Drain-to-Source
Voltage
 
 
 
 
 
 
 
 
 
 
 
 
Figure7. Maximum Effective Transient Thermal Impedance, Junction-to-Case
 
 
©Silikron Semiconductor CO.,LTD.
2014.08.20
www.silikron.com 
Version : 1.0
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