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PDF BAV70DW Data sheet ( Hoja de datos )
| Número de pieza | BAV70DW | |
| Descripción | Fast Switching Surface Mount Planar Diodes | |
| Fabricantes | Diotec Semiconductor | |
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BAV70DW
BAV70DW
Fast Switching Surface Mount Planar Diodes – Dual Common Cathode
Schnelle Planar-Dioden für die Oberflächenmontage – Zweimal gemeinsame Kathode
Version 2015-05-28
Power dissipation – Verlustleistung
200 mW
2±0.1
2 x 0.65
65
4
Type
Code
123
2.4
0.9±0.1
Repetitive peak reverse voltage
Periodische Spitzensperrspannung
Plastic case – Kunststoffgehäuse
Weight approx. – Gewicht ca.
Plastic material has UL classification 94V-0
Gehäusematerial UL94V-0 klassifiziert
100 V
SOT-363
0.01 g
Dimensions - Maße [mm]
Standard packaging taped and reeled
Standard Lieferform gegurtet auf Rolle
Maximum ratings (TA = 25°C)
Power dissipation − Verlustleistung
Max. average forward current – Dauergrenzstrom (dc)
Repetitive peak forward current – Periodischer Spitzenstrom
Non repetitive peak forward surge current
Stoßstrom-Grenzwert
tp ≤ 1 µs
tp ≤ 1 ms
tp ≤ 1 s
Repetitive peak reverse voltage – Periodische Spitzensperrspannung
Reverse voltage – Sperrspannung
Junction temperature – Sperrschichttemperatur
Storage temperature – Lagerungstemperatur
Grenzwerte (TA = 25°C)
MMBD4448SDW
Ptot 350 mW 1)
IFAV 200 mA 1)
IFRM 450 mA 1)
IFSM
IFSM
IFSM
VRRM
VR
4A
1A
0.5 A
100 V
100 V
Tj -55...+150°C
TS -55…+150°C
Characteristics (Tj = 25°C)
Forward voltage 2)
Durchlass-Spannung 2)
Leakage current
Sperrstrom
Tj = 25°C
Tj = 150°C
Max. junction capacitance – Max. Sperrschichtkapazität
VR = 0 V, f = 1 MHz
Reverse recovery time – Sperrverzug
IF = 10 mA über/through IR = 10 mA bis/to IR = 1 mA
Thermal resistance junction to ambient air
Wärmewiderstand Sperrschicht – umgebende Luft
IF = 1 mA
IF = 10 mA
IF = 50 mA
IF = 150 mA
VR = 80 V
VR = 25 V
VR = 85 V
VR = 25 V
Kennwerte (Tj = 25°C)
VF < 715 mV
VF < 855 mV
VF < 1.0 V
VF < 1.25 V
IR < 500 nA
IR < 30 nA
IR < 100 µA
IR < 30 µA
CT 1.5 pF
trr < 4 ns
RthA < 625 K/W 1)
1 Mounted on P.C. board with 3 mm2 copper pad at each terminal
Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluss
2 Tested with pulses tp = 300 µs, duty cycle ≤ 2% – Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis ≤ 2%
© Diotec Semiconductor AG
http://www.diotec.com/
1
1 page | ||
| Páginas | Total 2 Páginas | |
| PDF Descargar | [ Datasheet BAV70DW.PDF ] | |
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