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Número de pieza | BYD57K | |
Descripción | Ultra-fast soft-recovery controlled avalanche rectifiers | |
Fabricantes | NXP Semiconductors | |
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No Preview Available ! DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D121
BYD57 series
Ultra-fast soft-recovery
controlled avalanche rectifiers
Product specification
Supersedes data of 1998 Dec 04
1999 Nov 11
1 page Philips Semiconductors
Ultra-fast soft-recovery
controlled avalanche rectifiers
GRAPHICAL DATA
2.0
I F(AV)
(A)
1.6
MSA961
1.2
0.8
0.4
0
0 40 80 120
BYD57D to M
a = 1.42; VR = VRRMmax; δ = 0.5.
Switched mode application.
160 200
T tp (oC)
Fig.2 Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
Product specification
BYD57 series
handbook2, .h0alfpage
IF(AV)
(A)
1.6
MGM273
1.2
0.8
0.4
0
0 40 80 120
BYDU and V
a = 1.42; VR = VRRMmax; δ = 0.5.
Switched mode application.
160 200
Ttp (°C)
Fig.3 Maximum permissible average forward
current as a function of tie-point temperature
(including losses due to reverse leakage).
0.5
I F(AV)
(A)
0.4
0.3
MSA960
handbook0, .h6alfpage
IF(AV)
(A)
0.4
MGM272
0.2
0.2
0.1
0
0 40 80 120 160 200
Tamb ( o C)
BYD57D to M
a = 1.42; VR = VRRMmax; δ = 0.5.
Device mounted as shown in Fig.17.
Switched mode application.
Fig.4 Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
0
0 40 80 120
BYD57U and V
a = 1.42; VR = VRRMmax; δ = 0.5.
Device mounted as shown in Fig.17.
Switched mode application.
160 200
Tamb (°C)
Fig.5 Maximum permissible average forward
current as a function of ambient temperature
(including losses due to reverse leakage).
1999 Nov 11
5
5 Page Philips Semiconductors
Ultra-fast soft-recovery
controlled avalanche rectifiers
PACKAGE OUTLINE
Hermetically sealed glass surface mounted package;
ImplotecTM(1) technology; 2 connectors
k (2)
Product specification
BYD57 series
a
D1 D
SOD87
L
DIMENSIONS (mm are the original dimensions)
UNIT
D
D1
H
L
mm
2.1
2.0
2.0
1.8
3.7
3.3
Notes
1. Implotec is a trademark of Philips.
2. The marking indicates the cathode.
OUTLINE
VERSION
IEC
0.3
REFERENCES
JEDEC
EIAJ
SOD87
100H03
H
L
0 1 2 mm
scale
EUROPEAN
PROJECTION
ISSUE DATE
99-03-31
99-06-04
DEFINITIONS
Data Sheet Status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Nov 11
11
11 Page |
Páginas | Total 12 Páginas | |
PDF Descargar | [ Datasheet BYD57K.PDF ] |
Número de pieza | Descripción | Fabricantes |
BYD57 | Ultra-fast soft-recovery controlled avalanche rectifiers | NXP Semiconductors |
BYD57D | Ultra-fast soft-recovery controlled avalanche rectifiers | NXP Semiconductors |
BYD57G | Ultra-fast soft-recovery controlled avalanche rectifiers | NXP Semiconductors |
BYD57J | Ultra-fast soft-recovery controlled avalanche rectifiers | NXP Semiconductors |
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